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31. 发明申请

US20110049439A1 ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME 有权
标题翻译：电导电胶，以及包括其的电气和电子设备
公开(公告)号：US20110049439A1
公开(公告)日：2011-03-03
申请号：US12744994
申请日：2008-11-21
申请人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
发明人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
IPC分类号： H01B1/22 , H05K3/30
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译：公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部中形成的导电路径中的空隙生长水平降低，其含有减少量的粘度调节/触变性添加剂。选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

32. 发明授权

US07785500B2 Electrically conductive adhesive 有权
标题翻译：导电胶
公开(公告)号：US07785500B2
公开(公告)日：2010-08-31
申请号：US12092453
申请日：2006-10-31
申请人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
发明人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
IPC分类号： H01B1/22 , C09J9/02
CPC分类号： C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0272 , H05K2203/0425
摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
摘要翻译：本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

33. 发明申请

US20090301771A1 CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME 审中-公开
标题翻译：导电布，其形成方法和使用其的电子元件安装结构
公开(公告)号：US20090301771A1
公开(公告)日：2009-12-10
申请号：US12477227
申请日：2009-06-03
申请人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
发明人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
IPC分类号： H05K1/16 , H05K1/11 , H01R43/02
CPC分类号： H05K3/4007 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/90 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/1132 , H01L2224/114 , H01L2224/11552 , H01L2224/11554 , H01L2224/116 , H01L2224/11901 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83192 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/095 , H05K2201/0367 , H05K2201/0373 , H05K2201/09827 , H05K2203/0514 , H05K2203/1476 , Y10T29/49213 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
摘要翻译：形成在电子部件的电极上的导电凸块。导电凸块由在电极上形成有一层或多层的第一凸块组成，并且包括至少包含球形导电填料的树脂和形成在第一凸块的上表面上的第二凸块，并且包括含有鳞片状导电填料。

34. 发明申请

US20090079706A1 Display Device 审中-公开
标题翻译：显示设备
公开(公告)号：US20090079706A1
公开(公告)日：2009-03-26
申请号：US12237434
申请日：2008-09-25
申请人： Yasuyuki Mishima , Setsuo Kobayashi , Takayuki Higuchi
发明人： Yasuyuki Mishima , Setsuo Kobayashi , Takayuki Higuchi
IPC分类号： G06F3/041
CPC分类号： G02F1/13338 , G02F2202/023 , G02F2202/28
摘要： In a display device having a touch panel, it is possible to prevent the generation of a screen defect caused by the intrusion of air bubbles into a UV curing resin formed between a touch panel and a display panel. The touch panel is constituted of an upper transparent-electrode-attached film and a lower transparent-electrode-attached film, and an air hole is formed in the lower transparent-electrode-attached film. Due to such constitution, in adhering the touch panel and the display panel to each other in a vacuum using a UV curing resin, air in the touch panel is also discharged and hence, there is no possibility that the touch panel swells. Accordingly, it is possible to prevent warping of the lower transparent-electrode-attached film and hence, in curing the UV curing resin for adhering the touch panel and the display panel to each other, it is possible to prevent the entanglement of air into the UV curing resin. Accordingly, a touch-panel attached display device free from a screen defect attributed to air bubbles can be manufactured.
摘要翻译：在具有触摸面板的显示装置中，可以防止由触摸面板和显示面板之间形成的UV固化树脂中气泡的侵入而产生的屏幕缺陷。触摸屏由上部透明电极附着膜和下部透明电极附着膜构成，并且在下部透明电极附着膜中形成空气孔。由于这样的结构，在使用UV固化树脂的真空中将触摸面板和显示面板彼此粘合时，触摸面板中的空气也被排出，因此触摸面板不会膨胀。因此，可以防止下部透明电极附着膜发生翘曲，因此，在将触摸面板和显示面板粘接的UV固化树脂固化的同时，可以防止空气的缠结 UV固化树脂。因此，可以制造不伴有气泡的屏幕缺陷的触摸面板附接显示装置。

35. 发明申请

US20080282936A1 CEMENT ADMIXTURE, CEMENT COMPOSITION, AND METHOD FOR SUPPRESSING CARBONATION USING THE SAME 有权
标题翻译：水泥组合物，水泥组合物和使用该组合物抑制碳化的方法
公开(公告)号：US20080282936A1
公开(公告)日：2008-11-20
申请号：US11923010
申请日：2007-10-24
申请人： Minoru MORIOKA , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
发明人： Minoru MORIOKA , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
IPC分类号： C04B28/04 , C04B28/26 , C04B7/14 , C04B7/02 , C04B28/00 , C04B28/08
CPC分类号： C04B14/042 , C04B14/043 , C04B28/08 , C04B28/082 , C04B2111/10 , C04B2111/1068 , C04B2111/22 , C04B20/008 , C04B2103/0089 , C04B7/02
摘要： A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO2, α-CaO.SiO2 and calcium magnesium silicate, a cement composition containing said admixture, and a carbonation suppressing method by use of said cement admixture or cement composition. According to the present invention, a remarkable carbonation suppressing effect can be obtained particularly when used in portland blast-furnace slag cement. This leads to an effective use of steelmaking slag and the like, and the load of clinker can be reduced, so that a cement composition of a low environmental load type can be attained. Further, this is suitable for cements in conformity with the EN standards, which are used in civil engineering and building industries.
摘要翻译：提供了具有碳酸化抑制效果和水合热抑制效果的水泥混合物和水泥组合物。含有一种或多种非水力化合物的水泥混合物，其选自γ-2CaO，SiO 2，α-CaO，SiO 2和硅酸钙镁，含有所述混合物的水泥组合物和使用所述水泥掺合剂或水泥组合物的碳酸化抑制方法。根据本发明，特别是当用于波特兰高炉矿渣水泥时，可以获得显着的碳酸化抑制效果。这导致有效地利用炼钢炉渣等，并且可以减少熟料的负荷，从而可以获得低环境负荷型的水泥组合物。此外，这适用于符合在土木工程和建筑行业使用的EN标准的水泥。

36. 发明申请

US20060141862A1 Electrical connector 失效
标题翻译：电连接器
公开(公告)号：US20060141862A1
公开(公告)日：2006-06-29
申请号：US10529336
申请日：2003-09-11
申请人： Yukifumi Machida , Shinji Yamaguchi , Yoshikazu Tanaka , Takayuki Higuchi
发明人： Yukifumi Machida , Shinji Yamaguchi , Yoshikazu Tanaka , Takayuki Higuchi
IPC分类号： H01R13/40
CPC分类号： H01R13/4365 , H01R13/4223 , H01R43/26
摘要： Upon releasing a locking arm from a connecting terminal by inserting a jig through a front holder, the jig could not be erroneously inserted into a terminal inserting hole. Connecting terminals 15 are inserted into a housing 11, and the connecting terminals are prevented from being pulled out of the housing backwardly by means of locking arms 13 arranged above the respective connecting terminals 15. The front holder is engaged with the housing by a clamping mechanism in an axial direction and is movable laterally in a direction perpendicular to the axial direction. A pair of a terminal inserting hole 17 and an arm operating hole 18 provided for respective connecting terminals are shifted laterally. In a first position of the front holder 16, the terminal inserting hole 17 is aligned with an axial line of a female-type connecting terminal 15, but the arm operating hole 18 is shifted laterally from the locking arm.
摘要翻译：通过将夹具插入前支架而从连接端子释放锁定臂时，夹具不能错误地插入端子插入孔中。连接端子15被插入壳体11中，并且通过设置在相应的连接端子15上方的锁定臂13防止连接端子从壳体向后拉出。前保持器通过夹紧机构与壳体接合在轴向方向上可以沿与轴向垂直的方向横向移动。为各连接端子设置的一对端子插入孔17和臂操作孔18横向移动。在前保持器16的第一位置，端子插入孔17与阴型连接端子15的轴线对齐，但臂操作孔18从锁定臂横向移位。

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