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31. 发明授权

US07190072B2 RFID-chip having RFID-tag or magnifying electrode 有权
标题翻译：具有RFID标签或放大电极的RFID芯片
公开(公告)号：US07190072B2
公开(公告)日：2007-03-13
申请号：US11075798
申请日：2005-03-10
申请人： Naoya Kanda , Madoka Minagawa , Kosuke Inoue , Hiroshi Homma
发明人： Naoya Kanda , Madoka Minagawa , Kosuke Inoue , Hiroshi Homma
IPC分类号： H01L23/48 , H01L23/52 , B29C65/00
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81395 , H01L2924/01079 , H01L2924/01327 , H01L2924/00
摘要： When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.
摘要翻译：当通过使用超声波将半导体芯片（RFID芯片）接合到由轧制金属箔等构成的天线来形成RFID标签时，抑制了向半导体芯片施加的压力，以避免半导体芯片的损坏。为此，本发明提供一种RFID标签1，其中通过将形成在半导体芯片上的金凸块压在天线构件上，并且施加超声波，将金凸块接合到金属箔上; 并且在金属箔上形成具有低光泽度的无光泽表面的RFID标签，或者在金属箔上形成具有浅轧条纹的表面，并且金凸块接合到表面。

32. 发明申请

US20050173541A1 Paper tag identified by using radiofrequency and method of manufacturing the same 有权
标题翻译：使用射频识别的纸标签及其制造方法
公开(公告)号：US20050173541A1
公开(公告)日：2005-08-11
申请号：US11003439
申请日：2004-12-06
申请人： Kosuke Inoue , Naoya Kanda , Hiroshi Honma
发明人： Kosuke Inoue , Naoya Kanda , Hiroshi Honma
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , G06K19/06
CPC分类号： G06K19/07728 , G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81395 , H01L2924/01057 , H01L2924/01079
摘要： A paper-like RFID tag is fabricated by bonding bumps of an RFID chip to an antenna to connect the chip to the antenna, the antenna being formed by a metal foil bonded onto a base film or a base tape, providing a protecting material around the RFID chip so that an upper surface becomes higher than that of the RFID chip, to constitute an RFID thread, and inlaying the RFID thread in between first and second paper layers to afford a paper-like structure. The thickness of the paper-like RFID tag fabricated as above is 0.1 mm or less. Further, the paper-like RFID tag is of high quality and has a surface smoothness almost equal to that of the ordinary type of paper, permitting a long-distance communication.
摘要翻译：通过将RFID芯片的凸块与天线接合以将芯片连接到天线来制造纸状RFID标签，该天线由接合到基膜或基带上的金属箔形成，从而提供保护材料 RFID芯片，使得上表面变得高于RFID芯片的上表面，以构成RFID线，并且将RFID线材嵌入第一和第二纸层之间以提供纸状结构。如上制造的纸状RFID标签的厚度为0.1mm以下。此外，纸状RFID标签质量高，并且具有与普通纸类似的表面平滑度，允许长距离通信。

33. 发明授权

US06589802B1 Packaging structure and method of packaging electronic parts 有权
标题翻译：包装电子零件的包装结构和方法
公开(公告)号：US06589802B1
公开(公告)日：2003-07-08
申请号：US09640647
申请日：2000-08-18
申请人： Toyoki Asada , Yuji Fujita , Kie Ueda , Naoya Kanda , Mari Matsuyoshi
发明人： Toyoki Asada , Yuji Fujita , Kie Ueda , Naoya Kanda , Mari Matsuyoshi
IPC分类号： H01L2144
CPC分类号： H01L24/29 , H01L21/563 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2203/0783 , H05K2203/162 , H05K2203/176 , Y02P70/613 , H01L2924/00
摘要： The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.
摘要翻译：本发明可以容易地去除半导体集成电路芯片并确保倒装芯片接合的可靠性的结构，电子部件的封装方法以及用于分离电子部件的方法和装置。根据本发明，目的是通过使用两种用于粘合半导体集成电路芯片和电路板的可溶性和不溶性树脂的倒装芯片接合结构来实现的。

34. 发明授权

US5202151A Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same 失效
标题翻译：化学镀金液，使用金的电镀方法，以及使用其镀金的电子器件
公开(公告)号：US5202151A
公开(公告)日：1993-04-13
申请号：US532656
申请日：1990-06-04
申请人： Jiro Ushio , Osamu Miyazawa , Akira Tomizawa , Hitoshi Yokono , Naoya Kanda , Naoko Matsuura , Setsuo Ando , Hiroaki Okudaira
发明人： Jiro Ushio , Osamu Miyazawa , Akira Tomizawa , Hitoshi Yokono , Naoya Kanda , Naoko Matsuura , Setsuo Ando , Hiroaki Okudaira
IPC分类号： C23C18/44
CPC分类号： C23C18/44
摘要： The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.
摘要翻译：本发明涉及无电镀金液，使用该方法的电镀方法以及使用该方法镀金的电子器件。根据本发明的无电解镀金液，电镀液成分不含氰化物离子，还原剂的使用量少，可以进行镀金而不会在其间具有微细间隔的导电路径上进行镀金，短路导通路径。因此，根据通过使用所述无电解镀金液的镀金方法，可以实现电镀工作中安全的镀液方法及其废液的处理。该方法具有该方法能够提供高密度地安装部件的电子设备，并且其中对部件的连接可靠性高的特征。

35. 发明授权

US5089104A Method and apparatus for forming a multiple-element thin film based on ion beam sputtering 失效
标题翻译：用于形成基于离子束溅射的多元素薄膜的方法和装置
公开(公告)号：US5089104A
公开(公告)日：1992-02-18
申请号：US620611
申请日：1990-12-03
申请人： Naoya Kanda , Yasushi Ishikawa , Kunio Matsumoto , Hiroshi Asao
发明人： Naoya Kanda , Yasushi Ishikawa , Kunio Matsumoto , Hiroshi Asao
IPC分类号： C23C14/46 , C23C14/54
CPC分类号： C23C14/548 , C23C14/46
摘要： Ion beams drawn out of a plurality of ion beam sources or neutralized beams derived therefrom are projected to a plurality of targets, and sputtered particles discharged from the targets are directed to a substrate. The composition of sputtered particles is measured in the vicinity to the substrate. The measured coomposition is compared with the predetermined reference value and the composition of sputtered particles is controlled based on the result of measurement. sputtered particles having a controlled composition distribution are deposited on the substrate thereby to form a multiple-element thin film.

36. 发明授权

US4734233A Ceramic wiring substrate and process for producing the same 失效
标题翻译：陶瓷布线基板及其制造方法
公开(公告)号：US4734233A
公开(公告)日：1988-03-29
申请号：US7088
申请日：1987-01-27
申请人： Gyozo Toda , Takashi Kuroki , Shousaku Ishihara , Tsuyoshi Fujita , Naoya Kanda
发明人： Gyozo Toda , Takashi Kuroki , Shousaku Ishihara , Tsuyoshi Fujita , Naoya Kanda
IPC分类号： H01B5/14 , H01B1/16 , H01B13/00 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/38 , C04B33/32 , H05K3/12
CPC分类号： H01L23/15 , H01L21/4807 , H01L21/4867 , H01L2924/0002 , H05K1/092 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.
摘要翻译：一种陶瓷布线基板及其制造方法，具有导电层，其通过烧结包含85〜97重量％的钨粉末和15〜3重量％的烧结添加剂（导电性金属）的导电性糊料而获得，所述烧结添加剂在莫来石陶瓷基板上的指定组成。

37. 发明授权

US08035522B2 RFID tag 有权
标题翻译： RFID标签
公开(公告)号：US08035522B2
公开(公告)日：2011-10-11
申请号：US12233900
申请日：2008-09-19
申请人： Noriyuki Oroku , Naoya Kanda , Hidehiko Kando , Kouichi Uesaka
发明人： Noriyuki Oroku , Naoya Kanda , Hidehiko Kando , Kouichi Uesaka
IPC分类号： G08B13/14
CPC分类号： G06K19/07749
摘要： A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.
摘要翻译：制备在主表面上具有环形天线线圈的电路芯片和在主表面上具有天线图案的标签片，并且将电路芯片安装在标签片的主表面上，以便不会放置在天线方向图。电路芯片靠近天线图案放置，并且至少主表面的一半期望面对天线图案。因此，可以在电路芯片（或天线线圈）和天线图案之间可靠地交换信号和/或功率。因此，通过粗略地对准电路芯片和标签片，可以获得高性能和刚性的RFID标签。

38. 发明授权

US08009047B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US08009047B2
公开(公告)日：2011-08-30
申请号：US12211150
申请日：2008-09-16
申请人： Naoya Kanda , Noriyuki Oroku
发明人： Naoya Kanda , Noriyuki Oroku
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/07775 , G06K19/07779 , G06K19/07798
摘要： For protecting information stored in an RFID chip and ensuring its authenticity, radio communication between the RFID chip and an external terminal is positively interrupted when a seal type RFID tag including the RFID chip is peeled from an adherend, while ensuring solidity integrity when the RFID tag is put on the adherend. In the seal type RFID tag which includes the RFID chip fixed on a mounting surface of a base member having an adhesive layer applied thereto and which is put on the adherend by using the adhesive layer, an antenna formed on a main surface of the RFID chip is embedded in adhesive layers together with the RFID chip and an adhesive bonding strength between the antenna and the adhesive layer is made greater than a joining strength between the antenna and the RFID chip.
摘要翻译：为了保护存储在RFID芯片中的信息并确保其真实性，当将RFID芯片的密封型RFID标签从被粘物剥离时，RFID芯片和外部端子之间的无线电通信被确实地中断，同时当RFID标签被贴在被粘物上。在包括RFID芯片的密封型RFID标签中，RFID芯片固定在具有粘合剂层的基底构件的安装面上，并且通过使用粘合剂层被放置在被粘物上，形成在RFID芯片的主表面上的天线与RFID芯片一起嵌入粘合剂层中，并且天线和粘合剂层之间的粘合剂粘合强度大于天线和RFID芯片之间的接合强度。

39. 发明授权

US07969067B2 Ultrasound probe 失效
标题翻译：超声探头
公开(公告)号：US07969067B2
公开(公告)日：2011-06-28
申请号：US12161962
申请日：2006-11-14
申请人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
发明人： Takanori Aono , Tatsuya Nagata , Katsunori Asafusa , Takashi Kobayashi , Naoya Kanda
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/00
摘要： There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.
摘要翻译：提供一种超声波探头，其包括具有硅衬底和超声波发射接收元件的第一衬底，设置在第一衬底的上表面上的声透镜，以及设置在第一衬底下方的阻尼层，其中第二衬底设置在第一基板的下表面和阻尼层的上表面之间，第二基板由具有与第一基板的硅基板大致相同的线膨胀系数和声阻抗的材料制成。利用这种结构，可以提供能够防止由于温度变化而损坏硅基板的超声波探头，并且在发送和接收中减少反射波的噪声的同时具有优异的发送/接收性能和结构可靠性。

40. 发明申请

US20070007344A1 RFID tag and manufacturing method thereof 审中-公开
标题翻译： RFID标签及其制造方法
公开(公告)号：US20070007344A1
公开(公告)日：2007-01-11
申请号：US11478645
申请日：2006-07-03
申请人： Kosuke Inoue , Hiroshi Homma , Hitoshi Odashima , Naoya Kanda , Kie Ueda
发明人： Kosuke Inoue , Hiroshi Homma , Hitoshi Odashima , Naoya Kanda , Kie Ueda
IPC分类号： G06K7/00
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/75 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/7565 , H01L2224/81191 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： In an RFID (radio frequency identification) tag comprising an antenna formed of a conductive paste containing conductive filler like silver flakes on a base member, and an RFID chip connected to the antenna, the present invention cures a pattern of the antenna formed of the conductive paste, and then connects the RFID chip to the antenna with thermoplastic resin contained in the conductive paste by heating bump electrodes of the RFID chip in contact with the antenna. According to the present invention, Since the bump electrodes of the RFID chip and the antenna are connected to each other and establish sufficient electrical conduction therebetween without providing an anisotropic conductive sheet or the like therebetween, a highly reliable RFID tag is supplied at a low cost.
摘要翻译：在包含天线形成的RFID（射频识别）标签中，该天线由包含导电填料，如在基底构件上的银薄片形成的导电膏形成，以及连接到天线的RFID芯片，本发明固化由导电材料形成的天线的图案然后通过加热与天线接触的RFID芯片的凸起电极，将RFID芯片与包含在导电浆料中的热塑性树脂连接到天线。根据本发明，由于RFID芯片和天线的凸起电极彼此连接并且在它们之间建立足够的导电，而不在其间提供各向异性导电片等，所以以低成本提供高可靠性的RFID标签。

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