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    • 31. 发明授权
    • High density content addressable memory using phase change devices
    • 使用相变装置的高密度内容寻址存储器
    • US07782646B2
    • 2010-08-24
    • US12165530
    • 2008-06-30
    • Chung Hon LamBipin Rajendran
    • Chung Hon LamBipin Rajendran
    • G11C15/00
    • G11C15/02G11C11/16G11C13/0004G11C15/04G11C15/046
    • A content addressable memory array storing stored words in memory elements. Each memory element stores one of at least two complementary binary bits as one of at least two complementary resistances. Each memory element is electrically coupled to an access device. An aspect of the content addressable memory array is the use of a biasing circuit to bias the access devices during a search operation. During the search operation, a search word containing a bit string is received. Each access device is biased to a complementary resistance value of a corresponding search bit in the search word. A match between the search word and stored word is indicated if the bits stored in the memory elements are complementary to the bits represented by the resistances in the access devices.
    • 一种在存储元件中存储存储字的内容可寻址存储器阵列。 每个存储器元件将至少两个互补二进制位中的一个存储为至少两个互补电阻之一。 每个存储器元件电耦合到访问设备。 内容可寻址存储器阵列的一个方面是使用偏置电路来在搜索操作期间偏置访问设备。 在搜索操作期间,接收包含位串的搜索词。 每个访问设备被偏置到搜索词中相应搜索位的互补电阻值。 如果存储在存储器元件中的位与由访问设备中的电阻表示的位互补,则指示搜索字和存储字之间的匹配。
    • 32. 发明授权
    • Phase change memory with finite annular conductive path
    • 具有有限环形导电路径的相变存储器
    • US07965537B2
    • 2011-06-21
    • US12491816
    • 2009-06-25
    • Matthew J. BreitwischChung H. LamBipin Rajendran
    • Matthew J. BreitwischChung H. LamBipin Rajendran
    • G11C11/00
    • G11C13/0004G11C13/0069G11C2013/0083H01L45/06H01L45/1233H01L45/144H01L45/16Y10T29/49002
    • A phase change memory device and a method for programming the same. The method includes determining a maximum possible resistance for the memory cells in the phase change memory device. The method includes determining a high resistance state for the memory cells in the phase change memory device. The method includes receiving a request to program a target memory cell in the phase change memory device to the high resistance state. The method also includes resetting the target memory cell in the phase change memory device to the high resistance state such that the high resistance state of the target memory cell is of less resistance than the maximum possible resistance. In one embodiment of the invention, the high resistance state for the memory cells in the phase change memory device is at least 10% less than the maximum possible resistance.
    • 相变存储器件及其编程方法。 该方法包括确定相变存储器件中的存储器单元的最大可能电阻。 该方法包括确定相变存储器件中存储单元的高电阻状态。 该方法包括接收将相变存储器件中的目标存储单元编程为高电阻状态的请求。 该方法还包括将相变存储器件中的目标存储单元重置为高电阻状态,使得目标存储单元的高电阻状态的阻抗比最大可能的电阻小。 在本发明的一个实施例中,相变存储器件中的存储单元的高电阻状态比最大可能电阻小至少10%。
    • 36. 发明授权
    • Process for PCM integration with poly-emitter BJT as access device
    • 与多发射器BJT作为接入设备的PCM集成过程
    • US07811879B2
    • 2010-10-12
    • US12121875
    • 2008-05-16
    • Chung Hon LamBipin Rajendran
    • Chung Hon LamBipin Rajendran
    • H01L21/8249
    • H01L27/0623H01L21/8249H01L27/101
    • Techniques for forming a memory cell. An aspect of the invention includes forming FET gate stacks and sacrificial cell gate stacks over the substrate. Spacer layers are then formed around the FET gate stacks and around the sacrificial cell gate stacks. The sacrificial cell gate stacks are then removed such that the spacer layers around the sacrificial cell gate stacks are still intact. BJT cell stacks are then formed in the space between the spacer layers where the sacrificial cell gate stacks were formed and removed, the BJT cell stacks including an emitter layer. A phase change layer above the emitter contacts and an electrode above the phase change layer are then formed.
    • 形成记忆体的技术。 本发明的一个方面包括在衬底上形成FET栅极叠层和牺牲电池栅叠层。 然后在FET栅极堆叠周围以及牺牲电池栅极堆叠周围形成间隔层。 然后去除牺牲单元栅极堆叠,使得牺牲单元栅极堆叠周围的间隔层仍然完整。 BJT电池堆随后形成在形成和去除牺牲电池栅极堆叠的间隔层之间的空间中,BJT电池堆包括发射极层。 然后形成发射极上方的相变层和相变层上方的电极。