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    • 38. 发明授权
    • Dielectric porcelain composition for use in electronic devices
    • 用于电子设备的介电瓷组合物
    • US07732361B2
    • 2010-06-08
    • US12063483
    • 2005-08-11
    • Takeshi Shimada
    • Takeshi Shimada
    • C04B35/495
    • H01B3/12C04B35/495C04B35/62695C04B2235/3206C04B2235/3213C04B2235/3215C04B2235/3279C04B2235/3284C04B2235/3286C04B2235/5436C04B2235/5445C04B2235/6585H05K1/0306
    • The invention intends to provide a dielectric porcelain composition for use in electronic devices which can be controlled in the temperature coefficient τf in particular in a negative direction and can shorten a sintering period while maintaining a high Qf value and a high dielectric constant. According to the invention, in conventional composition having a composition formula represented by XBa(Mg1/3Ta2/3)O3—Y(BazSr1-z)(Ga1/2Ta1/2)O3, when Mg is substituted by Ni to form a specific structure, the temperature coefficient τf can be controlled in a negative direction and the τf can be controlled in the range of 0.80 to −4.45 ppm/° C. while maintaining a high Qf value and a high dielectric constant, and even when a sintering period, which has been so far necessary substantially 50 hr, is reduced to 25 hr substantially one half the above, similar Qf value can be obtained.
    • 本发明提供一种用于电子器件的电介质瓷组合物,其可以以特别是负方向的温度系数τf进行控制,并且可以在保持高Qf值和高介电常数的同时缩短烧结时间。 根据本发明,在具有由XBa(Mg1 / 3Ta2 / 3)O3-Y(BazSr1-z)(Ga1 / 2Ta1 / 2)O3表示的组成式的常规组合物中,当Mg被Ni取代以形成特定结构时 ,可以将温度系数τf控制在负方向,并且可以将τf控制在0.80〜-4.45ppm /℃的范围内,同时保持高Qf值和高介电常数,并且即使在烧结期间, 基本上50小时已经基本上需要减少到25小时,可以获得类似的Qf值。
    • 40. 发明授权
    • Method of cleaning etching apparatus
    • 清洗蚀刻装置的方法
    • US07662235B2
    • 2010-02-16
    • US11203092
    • 2005-08-15
    • Atsushi YoshidaKotaro FujimotoTakeshi Shimada
    • Atsushi YoshidaKotaro FujimotoTakeshi Shimada
    • B08B3/12B08B6/00
    • B08B7/0035
    • To provide a cleaning method for an etching apparatus for a metal film that efficiently removes an etching residue deposited in an etching process chamber, assures the reproducibility of the etching performance, and keeps the etching process chamber in a low-dust-emission condition.Each time one workpiece with a metal film is etched (S1), the interior of the vacuum chamber is cleaned by replacing the workpiece with a dummy substrate (S2), performing a first step of plasma processing using oxygen (O2) and carbon tetrafluoride (CF4) to remove a carbon-based deposit pile (S3), and performing a second step of plasma processing using boron trichloride (BCl3) and chlorine (Cl2) to remove a residue that could not be removed by the first step and an etching residue of the metal film (S4).
    • 为了提供一种用于金属膜的蚀刻装置的清洁方法,其有效地去除在蚀刻处理室中沉积的蚀刻残留物,确保蚀刻性能的再现性,并且使蚀刻处理室保持在低灰尘发射状态。 每次蚀刻具有金属膜的一个工件(S1),通过用虚设衬底(S2)代替工件来清洁真空室的内部,使用氧(O 2)和四氟化碳(O 2)进行等离子体处理的第一步骤 CF4)以除去碳基沉积堆(S3),并且使用三氯化硼(BCl 3)和氯(Cl 2)进行等离子体处理的第二步骤,以除去第一步骤中不能除去的残留物和蚀刻残留物 的金属膜(S4)。