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31. 发明授权

US07258549B2 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US07258549B2
公开(公告)日：2007-08-21
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R12/00
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

32. 发明授权

US07748110B2 Method for producing connection member 有权
标题翻译：连接部件的制造方法
公开(公告)号：US07748110B2
公开(公告)日：2010-07-06
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

33. 发明授权

US08064213B2 Module with a built-in component, and electronic device with the same 有权
标题翻译：模块具有内置组件，电子设备具有相同的功能
公开(公告)号：US08064213B2
公开(公告)日：2011-11-22
申请号：US11043123
申请日：2005-01-27
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama
IPC分类号： H05K1/18
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/49805 , H01L23/5389 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06524 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12042 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0284 , H05K1/183 , H05K1/187 , H05K3/20 , H05K3/403 , H05K2203/302 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces. At least one wiring 20 extends from the upper surface to the lower surface through the side surface, and an electronic component 32 is disposed within the sheet substrate.
摘要翻译：提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c。至少一个布线20通过侧面从上表面延伸到下表面，并且电子部件32设置在片状基板内。

34. 发明申请

US20050184372A1 Three-dimensional mounting structure and method for producing the same 审中-公开
标题翻译：三维安装结构及其制造方法
公开(公告)号：US20050184372A1
公开(公告)日：2005-08-25
申请号：US11059845
申请日：2005-02-16
申请人： Toshiyuki Asahi , Seiichi Nakatani , Tousaku Nishiyama , Kiyoshi Nakanishi , Ken Muramatsu
发明人： Toshiyuki Asahi , Seiichi Nakatani , Tousaku Nishiyama , Kiyoshi Nakanishi , Ken Muramatsu
IPC分类号： H01L23/48 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/02
CPC分类号： H05K1/148 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/141 , H05K3/0052 , H05K3/36 , H05K2201/10424 , H01L2924/00
摘要： A three-dimensional mounting structure according to the present invention includes: a first main wiring board having a first wiring pattern on its surface and an electronic component mounted on the wiring pattern; a second main wiring board disposed facing the first main wiring board and having a second wiring pattern on its surface; and a lead frame connector disposed substantially perpendicular to the first main wiring board and the second main wiring board at an end portion of the two wiring bards, wherein the lead frame connector includes a plurality of lead wires made of an electrically conductive material and a resin portion to which the plurality of lead wires are fixed, wherein an end portion of each of the plurality of lead wires is exposed from the resin portion, and wherein at least two of the plurality of lead wires are each electrically connected to both the first wiring pattern of the first main wiring board and the second wiring pattern of the second main wiring board. Thus, there is provided a three-dimensional mounting structure that can realize high-density, multi-function mounting, allows easy testing, as well as repair and exchange of various elements and can reduce the mounting area, and a method for producing such a three-dimensional mounting structure.
摘要翻译：根据本发明的三维安装结构包括：在其表面上具有第一布线图案的第一主布线板和安装在布线图案上的电子部件; 第二主布线板，其布置成面对所述第一主布线板并且在其表面上具有第二布线图案; 以及引线框架连接器，其在所述两个布线条的端部处大致垂直于所述第一主布线板和所述第二主布线板布置，其中所述引线框架连接器包括由导电材料和树脂制成的多个引线所述多个引线被固定到所述多个引线的部分，其中，所述多个引线中的每一个的端部从所述树脂部露出，并且其中所述多个引线中的至少两个引线与所述第一布线第一主布线板的图案和第二主布线板的第二布线图案。因此，提供了一种能够实现高密度，多功能安装的三维安装结构，允许容易的测试以及各种元件的修理和更换，并且可以减少安装面积，以及制造这种三维安装结构。

35. 发明申请

US20070242440A1 Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board 有权
标题翻译：多层接线板，制造这种多层接线板的方法以及使用多层接线板的半导体器件和电子设备
公开(公告)号：US20070242440A1
公开(公告)日：2007-10-18
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

36. 发明申请

US20050006142A1 Circuit board with in-built electronic component and method for manufacturing the same 失效
标题翻译：具有内置电子部件的电路板及其制造方法
公开(公告)号：US20050006142A1
公开(公告)日：2005-01-13
申请号：US10888140
申请日：2004-07-09
申请人： Yukihiro Ishimaru , Tousaku Nishiyama , Yasuhiro Sugaya , Toshiyuki Asahi
发明人： Yukihiro Ishimaru , Tousaku Nishiyama , Yasuhiro Sugaya , Toshiyuki Asahi
IPC分类号： H01L23/538 , H01L25/065 , H05K1/18 , H05K3/20 , H05K3/40 , H05K3/46 , H05K1/11
CPC分类号： H05K1/187 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H05K1/188 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.
摘要翻译：根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

37. 发明授权

US07821795B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07821795B2
公开(公告)日：2010-10-26
申请号：US11578039
申请日：2006-02-01
申请人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
发明人： Yasuhiro Sugaya , Yoshiyuki Yamamoto , Toshiyuki Asahi , Katsumasa Miki , Masaaki Katsumata , Yoshiyuki Saitou , Takeshi Nakayama
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L23/3128 , H01L23/49822 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/429 , H05K3/4623 , H05K2201/09536 , H05K2201/10015 , Y10T29/4913 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.
摘要翻译：多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。固体电解电容器设置成保持在多个电路板之间。导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

38. 发明授权

US06885788B2 Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module 失效
标题翻译：光接收/发射装置内置模块，其中组合有光学和电气布线，用于制造模块和组件的组件的方法
公开(公告)号：US06885788B2
公开(公告)日：2005-04-26
申请号：US10609494
申请日：2003-06-20
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyoshi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
IPC分类号： H05K3/46 , G02B6/43 , H05K1/02 , H05K1/18 , G02B6/10 , G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/43 , H05K1/0274 , H05K1/185
摘要： A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.
摘要翻译：其中组合有光电布线的光接收/发射装置内置模块包括：包括芯部分和包层部分的光波导层; 形成在光波导层的主表面上的第一和第二布线图案; 光接收装置，其设置在所述光波导层的内部，所述光接收装置与所述光波导层的芯部部分光学连接并与所述第一布线图案电连接; 以及发光装置，其配置在所述光波导层的内部，所述发光装置与所述光波导层的芯部部分光学连接并且与所述第二布线图案电连接。利用这种结构，可以精确地进行光波导与光接收/发射装置之间的光耦合。

39. 发明申请

US20050045369A1 Circuit component built-in module and method for manufacturing the same 失效
标题翻译：电路元件内置模块及其制造方法
公开(公告)号：US20050045369A1
公开(公告)日：2005-03-03
申请号：US10926879
申请日：2004-08-26
申请人： Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi
发明人： Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi
IPC分类号： H01L23/31 , H01L23/433 , H01L25/16 , H05K1/18 , H05K3/20 , H05K3/40 , H05K3/46 , H05K1/00 , B23P19/00
CPC分类号： H05K1/187 , H01L23/3135 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2223/6622 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85001 , H01L2224/8592 , H01L2225/06558 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0187 , H05K2203/049 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754
摘要： A circuit component built-in module includes the following: an electrical insulating substrate made of a first mixture including a filler and a thermosetting resin; a wiring pattern formed on at least a principal surface of the electrical insulating substrate; circuit components that are arranged inside the electrical insulating substrate and connected electrically to the wiring pattern; and vias for electrically connecting the wiring patterns. At least one of the circuit components is mounted using wires. Part or all of the wires is sealed with a second mixture including a filler and a resin. This circuit component built-in module can eliminate a wire failure or short circuit while using a low cost mounting technique such as wire bonding.
摘要翻译：电路部件内置模块包括：由包括填料和热固性树脂的第一混合物制成的电绝缘基板; 形成在所述电绝缘基板的至少主面上的布线图案; 电路部件布置在电绝缘基板内并与布线图案电连接; 以及用于电连接布线图案的通孔。使用电线安装至少一个电路部件。部分或全部电线用包括填料和树脂的第二混合物密封。该电路部件内置模块可以在使用诸如引线接合的低成本安装技术的同时消除线路故障或短路。

40. 发明申请

US20050002608A1 Mount assembly, optical transmission line and photoelectric circuit board 有权
标题翻译：安装组件，光传输线和光电路板
公开(公告)号：US20050002608A1
公开(公告)日：2005-01-06
申请号：US10879067
申请日：2004-06-30
申请人： Tousaku Nishiyama , Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi , Seiji Karashima
发明人： Tousaku Nishiyama , Yukihiro Ishimaru , Yasuhiro Sugaya , Toshiyuki Asahi , Seiji Karashima
IPC分类号： G02B6/12 , G02B6/02 , G02B6/43 , H01L23/52 , H01L27/00 , H01L31/0352 , H01L33/20 , H01L33/24 , G02B6/26
CPC分类号： H01L31/035281 , G02B6/43 , H01L33/20 , H01L33/24 , H01L2224/16225 , H01L2924/1017 , Y02E10/50
摘要： A mount assembly with an excellent handling property which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly is provided. The mount assembly 100 is obtained by connecting a photo-electro conversion device 10a, spherical semiconductor devices 12a and 12b and an electro-photo conversion device 10b through electrical-connection portions 14 so that a light received by the photo-electro conversion device 10a is amplified by the spherical semiconductor devices 12a and 12b and then emitted from the electro-photo conversion device 10b.
摘要翻译：具有良好处理性能的安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且在光传输线与安装组件之间的连接部分不需要高度精确的垂直度，提供。通过电连接部14将光电转换装置10a，球形半导体装置12a，12b与电光转换装置10b连接，由光电转换装置10a接收的光为由球形半导体器件12a和12b放大，然后从电光转换器件10b发射。

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