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    • 33. 发明授权
    • Manufacturing method for an integrated semiconductor structure
    • 集成半导体结构的制造方法
    • US07595262B2
    • 2009-09-29
    • US11588591
    • 2006-10-27
    • Till Schlösser
    • Till Schlösser
    • H01L21/3205H01L21/4763H01L21/8236H01L21/8234H01L21/8242H01L21/336H01L21/44H01L21/28
    • H01L27/10894H01L27/10882H01L27/10891
    • A manufacturing method for an integrated semiconductor structure and a corresponding semiconductor structure is disclosed. The method includes forming a peripheral circuitry in a peripheral device region, wherein the peripheral circuitry includes a peripheral transistor at least partially formed in the semiconductor substrate and having a first gate dielectric formed in a first high temperature process step. The method further includes forming a plurality of memory cells in a memory cell region, each of said memory cells including an access transistor at least partially formed in a semiconductor substrate and having a second gate dielectric formed in a second high temperature process step and having a metallic gate conductor. The first and second high temperature process steps are performed before a step of forming the metallic gate conductor.
    • 公开了一种用于集成半导体结构和相应的半导体结构的制造方法。 该方法包括在外围设备区域中形成外围电路,其中外围电路包括至少部分地形成在半导体衬底中并具有在第一高温工艺步骤中形成的第一栅极电介质的外围晶体管。 该方法还包括在存储器单元区域中形成多个存储单元,每个存储单元包括至少部分地形成在半导体衬底中并具有在第二高温工艺步骤中形成的第二栅电介质的存取晶体管, 金属栅极导体。 第一和第二高温工艺步骤在形成金属栅极导体的步骤之前进行。
    • 38. 发明授权
    • DRAM cell system and method for producing same
    • DRAM单元系统及其制造方法
    • US06566187B1
    • 2003-05-20
    • US09806614
    • 2001-05-11
    • Josef WillerFranz HoffmannTill Schlösser
    • Josef WillerFranz HoffmannTill Schlösser
    • H01L218242
    • H01L27/10864H01L27/10841
    • DRAM cell arrangement and method for fabricating it Word lines and bit lines are arranged above a main area of a substrate, with the result that they have a planar construction and can be produced together with gate electrodes of transistors of a periphery of the cell arrangement. A depression of the substrate is provided per memory cell, a storage node of a storage capacitor being arranged in the lower region of said depression and a gate electrode of a vertical transistor being arranged in the upper region of said depression. The depressions of the memory cells are arranged between trenches filled with isolating structures. Upper source/drain regions of the transistors are arranged between two mutually adjacent isolating structures and between two mutually adjacent depressions. Lower source/drain regions are arranged in the substrate and adjoin the storage nodes. For process steps, alignment tolerances are so large that the space requirement for the memory cell can amount to 4F2.
    • DRAM单元布置及其制造方法字线和位线布置在基板的主区域上方,结果是它们具有平面结构,并且可以与单元布置的外围的晶体管的栅电极一起生成。 每个存储单元提供基板的凹陷,存储电容器的存储节点布置在所述凹陷的下部区域中,并且垂直晶体管的栅电极布置在所述凹陷的上部区域中。 存储单元的凹陷布置在填充有隔离结构的沟槽之间。 晶体管的上部源极/漏极区域布置在两个相互相邻的隔离结构之间以及两个彼此相邻的凹陷之间。 下部源极/漏极区域布置在衬底中并与存储节点相邻。 对于工艺步骤,对准公差如此大,使得存储器单元的空间需求可以达到4F2。
    • 39. 发明授权
    • Integrated memory having memory cells with magnetoresistive storage effect
    • 具有具有磁阻存储效应的存储单元的集成存储器
    • US06462979B2
    • 2002-10-08
    • US09799626
    • 2001-03-05
    • Till SchlösserRoland Thewes
    • Till SchlösserRoland Thewes
    • G11C1100
    • G11C11/15G11C11/16
    • The integrated memory has memory cells with a magnetoresistive storage effect in a memory cell array in the form of a matrix. The memory cells are each connected between one of the column lines and one of the row lines. The column lines are each connected to a read amplifier for reading a data signal from a memory cell. The read amplifier has an operational amplifier with feedback, and a first control input connected to one of the column lines. A capacitor is connected between a second control input of the operational amplifier and a terminal for a supply potential and is used to compensate for any offset voltage at the control inputs of the operational amplifier. This allows a data signal which is to be read from one of the memory cells to be detected comparatively reliably.
    • 集成存储器具有在矩阵形式的存储单元阵列中具有磁阻存储效应的存储单元。 存储单元各自连接在一列列线和一行行之间。 列线各自连接到用于从存储器单元读取数据信号的读取放大器。 读取放大器具有带有反馈的运算放大器,以及连接到列线之一的第一控制输入。 电容器连接在运算放大器的第二控制输入端和电源端之间,用于补偿运算放大器的控制输入端的任何偏移电压。 这允许相对可靠地检测从一个存储单元读取的数据信号。