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    • 34. 发明授权
    • Memory cell configuration and method for fabricating it
    • 存储单元配置及其制造方法
    • US06365944B1
    • 2002-04-02
    • US09668485
    • 2000-09-25
    • Hans Reisinger
    • Hans Reisinger
    • H01L31113
    • H01L27/11568H01L27/115
    • The invention relates to a memory cell configuration in which a plurality of memory cells are present in the region of a main area of a semiconductor substrate (10), and in which the memory cells each contain at least one MOS transistor having a source (29), gate (WL1 and WL2) and drain (60). The memory cells are configured in memory cell rows which run essentially parallel, in which adjacent memory cell rows are insulated by an isolation trench (20), in which adjacent memory cell rows each contain at least one bit line (60), and where the bit lines (60) of two adjacent memory cell rows face one another. The memory cell configuration is constructed in such a way that the isolation trench (20) penetrates more deeply into the semiconductor substrate (10) than the bit lines (60), and at least one of the source (29) and/or of the drain is at least partially situated underneath the isolation trench (20). The invention furthermore relates to a method for fabricating this memory cell configuration.
    • 本发明涉及一种存储单元结构,其中多个存储单元存在于半导体衬底(10)的主区域的区域中,并且其中存储单元各自包含至少一个具有源极(29)的MOS晶体管 ),栅极(WL1和WL2)和漏极(60)。 存储器单元被配置在基本上平行的存储单元行中,其中相邻的存储单元行被隔离沟槽(20)绝缘,其中相邻存储单元行各自包含至少一个位线(60),并且其中 两个相邻的存储单元行的位线(60)彼此面对。 存储单元配置被构造成使得隔离沟槽(20)比位线(60)更深地穿入半导体衬底(10),并且源极(29)和/或 漏极至少部分地位于隔离沟槽(20)下方。 本发明还涉及一种用于制造该存储单元配置的方法。