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    • 34. 发明申请
    • FILM-FORMING MATERIAL AND METHOD OF FORMING PATTERN
    • 成膜材料和形成图案的方法
    • US20090134119A1
    • 2009-05-28
    • US11997300
    • 2006-08-24
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • Shogo MatsumaruHideo HadaFujikawa ShigenoriToyoki Kunitake
    • C23F1/02
    • H01L21/0273C09D183/04G03F7/0755G03F7/40H01L21/31138H01L21/31144
    • A film-forming material that is capable of forming, at a low temperature, a film having a high degree of etching resistance and a high etching selectivity ratio relative to an organic film, as well as a method of forming a pattern that uses the film-forming material. The film-forming material includes a metal compound (W) capable of generating a hydroxyl group upon hydrolysis, and a solvent (S) in which the metal compound is dissolved, wherein the solvent (S) includes a solvent (S1) with a boiling point of at least 155° C. that contains no functional groups that react with the metal compound (W). The method of forming a pattern includes the steps of: coating a pattern, which has been formed on top of an organic film of a laminate that includes a substrate and the organic film, using the above film-forming material, and then conducting etching of the organic film using the pattern as a mask.
    • 能够在低温下形成相对于有机膜具有高耐蚀刻性和高蚀刻选择比的膜的成膜材料以及形成使用该膜的图案的方法 形成材料。 成膜材料包括水解时能够产生羟基的金属化合物(W)和其中溶解有金属化合物的溶剂(S),其中溶剂(S)包括沸腾的溶剂(S1) 至少155℃,不含与金属化合物(W)反应的官能团。 形成图案的方法包括以下步骤:使用上述成膜材料涂覆已经形成在包括基材和有机膜的层压体的有机膜的顶部上的图案,然后进行蚀刻 使用该图案作为掩模的有机膜。
    • 39. 发明申请
    • Polymer and positive type resist composition
    • 聚合物和正型抗蚀剂组合物
    • US20060147832A1
    • 2006-07-06
    • US10547632
    • 2004-02-26
    • Hideo HadaMiwa MiyairiTakeshi Iwai
    • Hideo HadaMiwa MiyairiTakeshi Iwai
    • G03C1/76
    • G03F7/0397
    • There is provided technology that enables the suppression of the surface roughness that occurs within a resist pattern, either following etching or following developing, or preferably following both processes. According to this technology, a resist pattern is formed using a positive resist composition including a resin component (A), which contains a structural unit (a1) containing a lactone, as represented by a general formula shown below, and exhibits increased alkali solubility under the action of acid, (wherein, R represents a hydrogen atom or a methyl group), an acid generator component (B) that generates acid on exposure, and an organic solvent (C).
    • 提供了能够抑制在抗蚀剂图案中发生的表面粗糙度的技术,无论是在蚀刻之后还是在显影之后,或优选地在两个过程之后。 根据该技术,使用包含树脂组分(A)的正型抗蚀剂组合物形成抗蚀剂图案,该抗蚀剂图案含有如下所示的通式所示的含有内酯的结构单元(a1),并且表现出增加的碱溶解度 酸的作用(其中,R表示氢原子或甲基),曝光时产生酸的酸产生剂成分(B)和有机溶剂(C)。