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31. 发明授权

US07608917B2 Power semiconductor module 失效
标题翻译：功率半导体模块
公开(公告)号：US07608917B2
公开(公告)日：2009-10-27
申请号：US11749211
申请日：2007-05-16
申请人： Ryoichi Kajiwara , Kazuhiro Suzuki , Toshiaki Ishii , Kazutoshi Itou
发明人： Ryoichi Kajiwara , Kazuhiro Suzuki , Toshiaki Ishii , Kazutoshi Itou
IPC分类号： H01L23/02 , H01L23/10
CPC分类号： H05K3/284 , H01L23/16 , H01L23/3735 , H01L23/4334 , H01L23/49575 , H01L23/49844 , H01L23/5385 , H01L24/33 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0306 , H05K3/0058 , H05K2201/0715 , H05K2201/10166 , H01L2924/00 , H01L2924/00012
摘要： A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of 175 to 250° C., resulting in excellent reliability at high temperature retaining test and thermal cycling test. Low thermal expansion ceramic substrates are disposed above and below the device. A material having a coefficient of thermal expansion of 10 ppm/K or less is disposed between the ceramic substrates. In addition, an inorganic material having a coefficient of thermal expansion in the range of 2 to 6 ppm/K or less is disposed around the device.
摘要翻译：功率半导体模块和逆变器装置，即使在使用温度在175〜250℃的范围内的高温下，器件或接合部也不会机械损坏，从而在高温保持试验中具有优异的可靠性和热循环试验。低热膨胀陶瓷衬底设置在器件的上方和下方。在陶瓷基板之间设置具有10ppm / K以下的热膨胀系数的材料。此外，在该装置的周围设置热膨胀系数为2〜6ppm / K以下的无机材料。

32. 发明申请

US20090179321A1 POWER SEMICONDUCTOR DEVICE 有权
标题翻译：功率半导体器件
公开(公告)号：US20090179321A1
公开(公告)日：2009-07-16
申请号：US12407041
申请日：2009-03-19
申请人： Kozo Sakamoto , Toshiaki Ishii
发明人： Kozo Sakamoto , Toshiaki Ishii
IPC分类号： H01L23/12
CPC分类号： H01L25/072 , H01L23/49844 , H01L23/5383 , H01L23/5385 , H01L25/115 , H01L25/117 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/10272 , H01L2924/1033 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15192 , H01L2924/3011 , H01L2924/00 , H01L2224/05599
摘要： A power semiconductor device, having a first semiconductor region, and a second semiconductor region; mounted with a first electrode pad on a semiconductor substrate main surface at the inside surrounded by the third semiconductor region, mounted in the second semiconductor region, and a multilayer substrate having first and second wiring layers, to take out an electrode of the semiconductor chip; joining the first wiring layer part for the first electrode, mounted on the multilayer substrate, in a region opposing to the semiconductor substrate main surface at the inside surrounded by the third semiconductor region, and the first electrode pad, by a conductive material; joining the first wiring layer part for the first electrode, and the second wiring layer at a conductive part; and extending the second wiring layer to the outside of a region opposing the semiconductor substrate main surface at the inside surrounded by the third semiconductor region.
摘要翻译：一种功率半导体器件，具有第一半导体区域和第二半导体区域; 安装在第一半导体区域中的由第三半导体区域包围的半导体衬底主表面上的第一电极焊盘和具有第一和第二布线层的多层衬底，以取出半导体芯片的电极; 通过导电材料将安装在多层基板上的第一电极的第一布线层部分与由第三半导体区域包围的内部的半导体基板主表面相对的区域和第一电极焊盘接合; 将第一电极的第一布线层部分和导电部分的第二布线层接合; 并且在由所述第三半导体区域包围的内部将所述第二布线层延伸到与所述半导体基板主表面相对的区域的外部。

33. 发明申请

US20080156398A1 BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE 有权
标题翻译：使用金属颗粒的粘合方法和粘合材料
公开(公告)号：US20080156398A1
公开(公告)日：2008-07-03
申请号：US11965973
申请日：2007-12-28
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： B23K35/34
CPC分类号： B23K35/34 , B23K35/3612 , H01L23/3107 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/29393 , H01L2224/30181 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8384 , H01L2224/83986 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/48 , H01L2224/83205
摘要： It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 μm and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
摘要翻译：本发明的目的是提供一种能够在与使用平均粒径不大于100nm的金属颗粒的接合材料相比在较低温度下的接合界面处通过金属接合实现接合的接合材料和接合方法。提供了一种粘合材料，其包括金属颗粒前体，金属颗粒前体是选自金属氧化物颗粒，金属碳酸盐颗粒和金属羧酸盐颗粒中的至少一种，平均粒径为1 以及由有机物构成的还原剂，其中金属颗粒前体的含量相对于每100质量份的接合材料大于50质量份且不大于99质量份。

34. 发明授权

US07165898B2 Optical module, method for manufacturing optical module and optical communication apparatus 有权
标题翻译：光模块，光模块和光通信装置的制造方法
公开(公告)号：US07165898B2
公开(公告)日：2007-01-23
申请号：US10787086
申请日：2004-02-27
申请人： Takeshil Kato , Koji Yoshida , Toshinori Hirataka , Toshiaki Ishii , Kazuyuki Fukuda , Tadaaki Ishikawa , Toshimasa Miura , Tsutomu Kono , Kimio Tatsuno
发明人： Takeshil Kato , Koji Yoshida , Toshinori Hirataka , Toshiaki Ishii , Kazuyuki Fukuda , Tadaaki Ishikawa , Toshimasa Miura , Tsutomu Kono , Kimio Tatsuno
IPC分类号： G02B6/36
CPC分类号： G02B6/4204 , G02B6/3865 , G02B6/3873 , G02B6/421 , G02B6/4292 , H01L24/45 , H01L2224/45144 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
摘要翻译：用于光学器件和光纤的光学模块由预成型塑料封装构成。在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。光学模块通过使用压力注射成型树脂然后使树脂固化而形成。当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。结果，对于综合成型，施加到光纤的成型压力降低。通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

35. 发明授权

US06457877B2 Optical module, method for manufacturing optical module and optical communication apparatus 失效
标题翻译：光模块，光模块和光通信装置的制造方法
公开(公告)号：US06457877B2
公开(公告)日：2002-10-01
申请号：US09788341
申请日：2001-02-21
申请人： Takeshil Kato , Koji Yoshida , Toshinori Hirataka , Toshiaki Ishii , Kazuyuki Fukuda , Tadaaki Ishikawa , Toshimasa Miura , Tsutomu Kono , Kimio Tatsuno
发明人： Takeshil Kato , Koji Yoshida , Toshinori Hirataka , Toshiaki Ishii , Kazuyuki Fukuda , Tadaaki Ishikawa , Toshimasa Miura , Tsutomu Kono , Kimio Tatsuno
IPC分类号： G02B642
CPC分类号： G02B6/4204 , G02B6/3865 , G02B6/3873 , G02B6/421 , G02B6/4292 , H01L24/45 , H01L2224/45144 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
摘要翻译：用于光学器件和光纤的光学模块由预成型塑料封装构成。在形成塑料包装时，成型树脂的主流动方向基本上平行于光纤的光轴。光学模块通过使用压力的注射方法模制树脂然后使树脂固化而形成。当通过综合成型形成塑料包装时，树脂的流动方向与要安装在光学模块中的光纤的光轴方向平行。结果，对于综合成型，施加到光纤的成型压力降低。通过使用形成的树脂壳体，所得到的包装与树脂的流动方向相比具有高刚性和低热膨胀性，从而减小施加到光纤上的外部应力和热应力。

36. 发明授权

US5448653A Line segment attribute recognition device having accuracy updating function 失效
标题翻译：线段属性识别装置具有精度更新功能
公开(公告)号：US5448653A
公开(公告)日：1995-09-05
申请号：US218293
申请日：1994-03-28
申请人： Osamu Hori , Shigeyoshi Shimotsuji , Fumihiko Hoshino , Toshiaki Ishii
发明人： Osamu Hori , Shigeyoshi Shimotsuji , Fumihiko Hoshino , Toshiaki Ishii
IPC分类号： G06F17/50 , G06K9/00 , G06K9/46
CPC分类号： G06K9/00476
摘要： Information regarding the line segments constituting a line figure is input from an input section. An initial degree of certainty with respect to the attribute of each of the line segments is calculated by a degree of certainty-calculating section, on the basis of the information input from the input section. How the line segments are connected to other line segments is detected by a connection-detecting section. A compatible coefficient is determined by a degree of certainty-updating section in accordance with the connection detected by the connection-detecting section. By repeatedly executing calculation on the basis of the compatible coefficient, the initial degree of certainty calculated by the degree of certainty-calculating section is updated. Based on the updated degree of certainty, the attributes of the line segments are determined.
摘要翻译：从输入部输入构成线图的线段的信息。基于从输入部输入的信息，通过确定性计算部的程度来计算相对于每个线段的属性的初始确定度。线段如何连接到其他线段由连接检测部分检测。兼容系数由确定性更新部分的程度根据连接检测部分检测到的连接来确定。通过基于兼容系数重复执行计算，更新由确定性计算部分的程度计算的初始确定度。基于更新的确定性程度，确定线段的属性。

37. 发明授权

US5393941A Controller for ropeless elevator 失效
标题翻译：无线电梯控制器
公开(公告)号：US5393941A
公开(公告)日：1995-02-28
申请号：US80621
申请日：1993-06-22
申请人： Masamoto Mizuno , Toshiaki Ishii
发明人： Masamoto Mizuno , Toshiaki Ishii
IPC分类号： B66B3/00 , B66B1/34 , B66B3/02 , B66B9/02 , B66B1/06
CPC分类号： B66B1/3415 , B66B1/34 , B66B1/3438 , B66B1/3446 , B66B1/3461
摘要： A controller for a ropeless elevator, includes: a cross induction line cable arranged along the hoistway; an exciter provided on the car side to generate sinusoidal waves for positional detection in the cable; a movement amount detector provided on the car side to detect a car movement amount; a data calculator provided on the car side to calculate data on car speed and on secondary-conductor magnetic pole phase from the movement amount detected by the movement amount detector; a data transmitter provided on the car side to utilize the cross induction line cable in transmitting the data calculated by the data calculator to the building side; an induction radio circuit provided on the building side to utilize the cable in receiving data from the data transmission device and calculate the initial phase of the secondary conductor from the sinusoidal waves generated in the cross induction line cable; and an inverter control circuit provided on the building side to interpolate the initial phase calculated by the induction radio circuit on the basis of the magnetic pole phase received by the induction radio circuit and control the inverter on the basis of the calculated car position and the car speed data received by the induction radio circuit.
摘要翻译：无电梯电梯的控制器包括：沿井道布置的十字感应线缆; 提供在轿厢侧的励磁机，以产生用于电缆中的位置检测的正弦波; 设置在轿厢侧以检测轿厢移动量的移动量检测器; 设置在轿厢侧的数据计算器，用于根据由移动量检测器检测到的移动量来计算汽车速度和次级导体磁极相位的数据; 设置在轿厢侧的数据发送器，以利用所述交叉感应线电缆将由所述数据计算器计算出的数据发送到建筑物侧; 设置在建筑物侧的感应无线电电路，以利用电缆从数据传输装置接收数据，并从交叉感应线电缆中产生的正弦波计算次导体的初始相位; 以及逆变器控制电路，其设置在建筑物侧，以基于由感应无线电路接收到的磁极相位来计算由感应无线电路计算的初始相位，并且基于计算出的轿厢位置和轿厢来控制逆变器由感应无线电电路接收的速度数据。

38. 发明授权

US5238508A Ferritic-austenitic duplex stainless steel 失效
标题翻译： FERRITIC-AUSTENITIC双相不锈钢
公开(公告)号：US5238508A
公开(公告)日：1993-08-24
申请号：US622401
申请日：1990-12-03
申请人： Akira Yoshitake , Akio Kuhara , Toshiaki Ishii
发明人： Akira Yoshitake , Akio Kuhara , Toshiaki Ishii
IPC分类号： C22C38/00 , C22C38/42 , C22C38/44 , C22C38/52
CPC分类号： C22C38/44 , C22C38/001 , C22C38/42 , C22C38/52 , Y10S148/909
摘要： Ferritic-austenitic duplex stainless steel comprising the following components in the following proportions in % by weight:0
摘要翻译：铁素体 - 奥氏体双相不锈钢，按以下比例包含以下重量比：0

39. 发明授权

US09326425B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US09326425B2
公开(公告)日：2016-04-26
申请号：US13996640
申请日：2011-12-07
申请人： Tokihito Suwa , Yujiro Kaneko , Masashi Yura , Nobutake Tsuyuno , Toshiaki Ishii , Junpei Kusukawa
发明人： Tokihito Suwa , Yujiro Kaneko , Masashi Yura , Nobutake Tsuyuno , Toshiaki Ishii , Junpei Kusukawa
IPC分类号： H05K7/02 , H05K7/20 , H01L23/433 , H01L25/16 , H02M7/00 , H01L23/473 , H01L25/18 , H01L23/36 , H01L25/11 , H01L23/367
CPC分类号： H05K7/20509 , H01L23/36 , H01L23/3677 , H01L23/4334 , H01L23/473 , H01L25/072 , H01L25/115 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H05K7/209 , H05K7/20927 , H01L2924/00
摘要： Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt−0.015)×∈r, where a relative permittivity of the insulating member is ∈r and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.
摘要翻译：本发明提供一种电力转换装置，其特征在于，包括绝缘部件，其制造成使得由与树脂形成的绝缘部件的厚度di（mm）设置在与功率半导体装置接合的导体板的散热面与散热板之间，散发功率半导体器件的热量满足di>（1.36×10-8×Vt2 + 3.4×10-5×Vt-0.015）×∈r的关系，其中绝缘构件的相对介电常数为∈r，a 伴随功率半导体器件的ON / OFF开关操作的导体板和散热板之间产生的浪涌电压为Vt（V）。功率半导体器件的导体板，绝缘构件和散热板通过热压接而接合。

40. 发明授权

US08821768B2 Bonding method and bonding material using metal particle 有权
标题翻译：使用金属颗粒的接合方法和接合材料
公开(公告)号：US08821768B2
公开(公告)日：2014-09-02
申请号：US11965973
申请日：2007-12-28
申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
发明人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
IPC分类号： H01B1/22 , H01L23/00 , B23K35/36 , B23K35/34 , H01L25/07 , H01L23/31
CPC分类号： B23K35/34 , B23K35/3612 , H01L23/3107 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29294 , H01L2224/29387 , H01L2224/29393 , H01L2224/30181 , H01L2224/32175 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/48247 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8384 , H01L2224/83986 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/48 , H01L2224/83205
摘要： It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 μm and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
摘要翻译：本发明的目的是提供一种能够在与使用平均粒径不大于100nm的金属颗粒的接合材料相比在较低温度下的接合界面处通过金属接合实现接合的接合材料和接合方法。提供了一种粘合材料，其包括金属颗粒前体，金属颗粒前体是选自金属氧化物颗粒，金属碳酸盐颗粒和金属羧酸盐颗粒中的至少一种，平均粒径为1 以及由有机物质构成的还原剂，其中金属颗粒前体的含量相对于每100质量份粘合材料大于50质量份且不大于99质量份。

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