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31. 发明授权

US4585706A Sintered aluminum nitride semi-conductor device 失效
标题翻译：烧结氮化铝半导体器件
公开(公告)号：US4585706A
公开(公告)日：1986-04-29
申请号：US769302
申请日：1985-08-26
申请人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
发明人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
IPC分类号： C22C29/16 , C04B35/581 , H01L21/318 , H01L23/15 , H01L29/12 , B32B15/04
CPC分类号： H01L21/318 , C04B35/581 , H01L23/15 , H01L2224/45124 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/14 , Y10T428/12528 , Y10T428/12576 , Y10T428/12583 , Y10T428/12674
摘要： A semi-conductor device comprising sintered aluminum nitride having a high thermal conductivity, which comprises at least 65% by weight of aluminum nitride, and at least one of beryllium, a beryllium compound, lithium and a lithium compound.
摘要翻译：包括具有高热导率的烧结氮化铝的半导体器件，其包含至少65重量％的氮化铝，以及铍，铍化合物，锂和锂化合物中的至少一种。

32. 发明授权

US4581501A Ignition distributor for internal combustion engine 失效
标题翻译：内燃机点火分配器
公开(公告)号：US4581501A
公开(公告)日：1986-04-08
申请号：US634049
申请日：1984-07-25
申请人： Ken Takahashi , Ryutarou Jimbou , Yasuo Matsushita , Seiichi Yamada , Hiromitsu Nagae
发明人： Ken Takahashi , Ryutarou Jimbou , Yasuo Matsushita , Seiichi Yamada , Hiromitsu Nagae
IPC分类号： F02P7/02 , H01H19/00
CPC分类号： F02P7/025
摘要： An ignition distributor for an internal combustion engine with reduced electric discharge energy and suppressed radio noise generation comprises a rotor electrode capable of rotary motion and a plurality of stationary electrodes arranged substantially in a circle around the rotor electrode through an electric discharge clearance therebetween, where the rotor electrode is made of a sintered mixture comprising zirconium oxide and an electroconductive inorganic compound having a specific resistance of not more than 10.sup.6 .OMEGA.cm as main components. The sintered mixture can be ZrO.sub.2 and an oxide selected from ZnO, NiO and CoO; or ZrO.sub.2, aluminum oxide and an oxide selected from ZnO, CoO, Al.sub.2 TiO.sub.5 and SrTiO.sub.3 or a carbide selected from ZrC, TiC and TaC.
摘要翻译：用于具有降低的放电能量和抑制的无线电噪声产生的内燃机的点火分配器包括能够旋转运动的转子电极和通过它们之间的放电间隙基本上围绕转子电极排列成圆形的多个固定电极，其中转子电极由包含氧化锆和电阻率不超过10 6欧米汞厘的主要成分的导电无机化合物的烧结混合物制成。烧结混合物可以是ZrO 2和选自ZnO，NiO和CoO的氧化物; 或ZrO 2，氧化铝和选自ZnO，CoO，Al 2 TiO 5和SrTiO 3的氧化物或选自ZrC，TiC和TaC的碳化物。

33. 发明授权

US07758354B2 Set of circuit board connectors 有权
标题翻译：电路板连接器组
公开(公告)号：US07758354B2
公开(公告)日：2010-07-20
申请号：US12120402
申请日：2008-05-14
申请人： Takahiro Shibata , Yasuo Matsushita , Tsutomu Tanaka
发明人： Takahiro Shibata , Yasuo Matsushita , Tsutomu Tanaka
IPC分类号： H01R12/00
CPC分类号： H01R12/7047 , H01R12/716 , H01R12/724 , H05K3/306 , H05K2201/09063 , H05K2201/09954 , H05K2201/10189 , H05K2201/10598 , Y10S439/954
摘要： A horizontal connector (10A) is configured for mounting on a circuit board (90) so that a connecting direction with a mating connector is parallel to the surface of the circuit board (90). A vertical connector (10B) is configured for mounting on the circuit board (90) so that a connecting direction with a mating connector is normal to the surface of the circuit board (90). Board connecting portions (35A, 35B) of terminal fittings (30A, 30B) to be inserted into connection holes (91) and mounting holes (16A, 16B) of mounting portions (12A, 12B) to be mounted to fixing holes (92) are arranged at the same positions for both the horizontal connector (10A) and vertical connector (10B). Therefore, the circuit board (90) can be commonly used for both horizontal connector (10A) and vertical connector (10B).
摘要翻译：水平连接器（10A）被配置为安装在电路板（90）上，使得与配合连接器的连接方向平行于电路板（90）的表面。垂直连接器（10B）构造成用于安装在电路板（90）上，使得与配合连接器的连接方向垂直于电路板（90）的表面。要插入到安装到固定孔（92）的安装部分（12A，12B）的连接孔（91）和安装孔（16A，16B）中的端子接头（30A，30B）的板连接部分（35A，35B）被布置在水平连接器（10A）和垂直连接器（10B）的相同位置。因此，电路板（90）可以共同用于水平连接器（10A）和垂直连接器（10B）。

34. 发明授权

US07581969B2 Connector with auxiliary housing having inverted insertion preventing portion 失效
标题翻译：具有辅助壳体的连接器具有倒置插入防止部分
公开(公告)号：US07581969B2
公开(公告)日：2009-09-01
申请号：US12055555
申请日：2008-03-26
申请人： Yasuo Matsushita
发明人： Yasuo Matsushita
IPC分类号： H01R13/44
CPC分类号： H01R13/514 , H01R13/62938 , H01R13/64 , Y10S439/903
摘要： A connector (A) has an auxiliary housing (30) and tabs (91C) project from the front surface of the auxiliary housing (30). A frame (10) has a chamber (13) for the auxiliary housing (30) and a receptacle (12) for surrounding the tabs (91C). A moving plate (60) is mounted into the receptacle (12). Inverted insertion preventing portions (35A, 35B) are formed on outer surfaces of the auxiliary housing (30) and have front ends retracted from the front end of the auxiliary housing (30). The front end of the auxiliary housing (30) can be inserted partly in the accommodating chamber (13) in an inverted posture. However, the inverted insertion preventing portions (35A, 35B) will contact the edge of the chamber (13) while the front ends of tabs (91C) and the rear end of the moving plate (60) are distanced from each other.
摘要翻译：连接器（A）具有辅助壳体（30），突出部（91C）从辅助壳体（30）的前表面突出。框架（10）具有用于辅助壳体（30）的腔室（13）和用于围绕凸片（91C）的容器（12）。移动板（60）安装在容器（12）中。倒置插入防止部分（35A，35B）形成在辅助壳体（30）的外表面上，并且具有从辅助壳体（30）的前端缩回的前端。辅助壳体（30）的前端可以倒置的姿势部分地插入容纳室（13）中。然而，当突片（91C）的前端和移动板（60）的后端彼此间隔开时，反向插入防止部分（35A，35B）将与腔室（13）的边缘接触。

35. 发明授权

US4651192A Ceramic packaged semiconductor device 失效
标题翻译：陶瓷封装半导体器件
公开(公告)号：US4651192A
公开(公告)日：1987-03-17
申请号：US751587
申请日：1985-07-03
申请人： Yasuo Matsushita , Kousuke Nakamura , Mitsuru Ura , Fumiyuki Kobayashi
发明人： Yasuo Matsushita , Kousuke Nakamura , Mitsuru Ura , Fumiyuki Kobayashi
IPC分类号： H01L23/34 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/36 , H01L23/14 , H01L23/02
CPC分类号： H01L23/057 , H01L23/15 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01025 , H01L2924/01029 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195
摘要： A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from SiC admixed with Be or a compound of Be.
摘要翻译：具有封装在中空陶瓷封装中的半导体元件的半导体器件。半导体元件配置的封装部分由与Be或Be化合物混合的SiC形成。

36. 发明授权

US4565907A Ignition distributor for internal combustion engine 失效
标题翻译：内燃机点火分配器
公开(公告)号：US4565907A
公开(公告)日：1986-01-21
申请号：US634470
申请日：1984-07-25
申请人： Ken Takahashi , Ryutarou Jimbou , Yasuo Matsushita , Seiichi Yamada , Tetuo Kosugi
发明人： Ken Takahashi , Ryutarou Jimbou , Yasuo Matsushita , Seiichi Yamada , Tetuo Kosugi
IPC分类号： F02P7/02 , H01H19/00
CPC分类号： F02P7/025
摘要： An ignition distributor for an internal combustion engine with reduced electric discharge energy and suppressed radio noise generation comprises a rotor electrode capable of rotary motion and a plurality of stationary electrodes arranged substantially in a circle around the rotor electrode through an electric discharge clearance therebetween, where the rotor electrode is a sintered mixture comprising an aluminum compound and/or a boron compound and silicon carbide and having a specific resistance of 10 to 10.sup.6 .OMEGA.cm at room temperature.
摘要翻译：用于具有降低的放电能量和抑制的无线电噪声产生的内燃机的点火分配器包括能够旋转运动的转子电极和通过它们之间的放电间隙基本上围绕转子电极排列成圆形的多个固定电极，其中转子电极是包含铝化合物和/或硼化合物和碳化硅并且在室温下具有10至106欧姆时厘米电阻率的烧结混合物。

37. 发明授权

US4555358A Electrically conductive sintered ceramics and ceramic heaters 失效
标题翻译：导电烧结陶瓷和陶瓷加热器
公开(公告)号：US4555358A
公开(公告)日：1985-11-26
申请号：US497577
申请日：1983-05-24
申请人： Yasuo Matsushita , Kousuke Nakamura , Koji Harada
发明人： Yasuo Matsushita , Kousuke Nakamura , Koji Harada
IPC分类号： C04B35/565 , C04B35/575 , H01B1/18 , H01C7/02 , H05B3/14 , H01B1/04
CPC分类号： H05B3/141 , C04B35/575 , H01B1/18 , H01C7/022
摘要： An electrically conductive sintered ceramics of the present invention comprises, as the main ingredients thereof, (a) silicon carbide, (b) an inorganic compound which exhibits a positive resistance-temperature coefficient, and preferably (c) a sintering assistant. The electrically conductive sintered ceramics obtained exhibits a positive resistance-temperature coefficient as a whole.A ceramic heater of the invention makes use of the electrically conductive sintered ceramics in an electrically conductive portion thereof.A sintered product which exhibits a positive resistance-temperature coefficient helps to prevent the occurrence of thermal runaway or thermal destruction.
摘要翻译：本发明的导电烧结陶瓷作为其主要成分包括（a）碳化硅，（b）具有正电阻温度系数的无机化合物，优选（c）烧结助剂。所得的导电烧结陶瓷整体呈现出正的电阻温度系数。本发明的陶瓷加热器在其导电部分中使用导电烧结陶瓷。具有正电阻温度系数的烧结产品有助于防止热失控或热破坏的发生。

38. 发明授权

US4540673A Sintered aluminum nitride and semi-conductor device using the same 失效
标题翻译：烧结氮化铝和半导体器件采用相同的方法
公开(公告)号：US4540673A
公开(公告)日：1985-09-10
申请号：US373150
申请日：1982-04-29
申请人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
发明人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
IPC分类号： C22C29/16 , C04B35/581 , H01L21/318 , H01L23/15 , C04B35/58
CPC分类号： H01L21/318 , C04B35/581 , H01L23/15 , H01L2224/45124 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/14 , Y10T428/12528 , Y10T428/12576 , Y10T428/12583 , Y10T428/12674
摘要： Sintered aluminum nitride having a high thermal conductivity, which comprises at least 65% by weight of aluminum nitride, and at least one of beryllium, a beryllium compound, lithium and a lithium compound, and a semi-conductor device using the same.
摘要翻译：具有高热导率的烧结氮化铝，其包含至少65重量％的氮化铝，以及铍，铍化合物，锂和锂化合物中的至少一种，以及使用其的半导体器件。

39. 发明授权

US4517584A Ceramic packaged semiconductor device 失效
标题翻译：陶瓷封装半导体器件
公开(公告)号：US4517584A
公开(公告)日：1985-05-14
申请号：US448592
申请日：1982-12-10
申请人： Yasuo Matsushita , Kousuke Nakamura , Mitsuru Ura
发明人： Yasuo Matsushita , Kousuke Nakamura , Mitsuru Ura
IPC分类号： H01L23/057 , H01L23/08 , H01L23/15 , H01L23/34 , H01L23/36 , H01L23/14
CPC分类号： H01L23/15 , H01L23/057 , H01L23/08 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152
摘要： A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from a SiC-based substrate containing Be or a compound of Be with a thin SiO.sub.2 layer being capable of reacting with glass provided thereon and with a glass layer or a thin film circuit on the SiO.sub.2 layer.
摘要翻译：具有封装在中空陶瓷封装中的半导体元件的半导体器件。包含半导体元件的部分由含有Be或具有薄SiO 2层的Be化合物的SiC基材料形成，该SiO 2层能够与设置在其上的玻璃反应并与玻璃层或薄膜电路在SiO2层上。

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