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    • 37. 发明申请
    • Field Effect Transistor
    • 场效应晶体管
    • US20100155779A1
    • 2010-06-24
    • US11992755
    • 2006-09-28
    • Yasuhiro MuraseKazuki OtaYasuhiro OkamotoKouji MatsunagaHironobu Miyamoto
    • Yasuhiro MuraseKazuki OtaYasuhiro OkamotoKouji MatsunagaHironobu Miyamoto
    • H01L29/78
    • H01L29/7787H01L29/2003H01L29/405H01L29/66462
    • In a field effect transistor, a Group III nitride semiconductor layer structure containing a hetero junction, a source electrode 101 and a drain electrode 103 formed apart from each other over the Group III nitride semiconductor layer structure, and a gate electrode 102 disposed between these electrodes, are provided. Over the surface of the Group III nitride semiconductor layer structure, a SiO2 film 122 containing oxygen as a constitutive element is provided, in contact with both side faces of the gate electrode 102. Over the surface of the Group III nitride semiconductor layer structure, a SiN film 121 is provided so as to cover the region between the SiO2 film 122 and the source electrode 101, and the region between the SiO2 film 122 and the drain electrode 103. The SiN film 121 is composed of a material different from that composing the SiO2 film 122, and contains nitrogen as a constitutive element.
    • 在场效应晶体管中,包含异质结的III族氮化物半导体层结构,在III族氮化物半导体层结构上彼此分开形成的源电极101和漏极103以及设置在这些电极之间的栅极102 ,提供。 在III族氮化物半导体层结构的表面上,提供含有氧作为构成元素的SiO 2膜122,与栅电极102的两个侧面接触。在III族氮化物半导体层结构的表面上, SiN膜121被设置为覆盖SiO 2膜122和源电极101之间的区域以及SiO 2膜122和漏电极103之间的区域。SiN膜121由与不同于构成 SiO 2膜122,并且含有氮作为构成元素。
    • 38. 发明申请
    • FIELD EFFECT TRANSISTOR
    • 场效应晶体管
    • US20110291160A1
    • 2011-12-01
    • US13147676
    • 2010-02-03
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • H01L29/778
    • H01L29/4236H01L29/1029H01L29/2003H01L29/42316H01L29/66462H01L29/66621H01L29/7783H01L29/7787
    • A field effect transistor includes a nitride-based semiconductor multi-layer structure, a source electrode (108), a drain electrode (109), a protective film (110), and a gate electrode (112) that is provided in a recess structure, which is formed by etching, directly or with a gate insulating film interposed therebetween. The nitride-based semiconductor multi-layer structure includes at least a base layer (103) made of AlXGa1-XN (0≦1), a channel layer (104) made of GaN or InGaN, a first electron supply layer (105), which is an undoped or n-type AlYGa1-YN layer, a threshold value control layer (106), which is an undoped AlZGa1-ZN layer, and a second electron supply layer (107), which is an undoped or n-type AlWGa1-WN layer, epitaxially grown in this order on a substrate (101) with a buffer layer (102) interposed therebetween. The Al composition of each layer in the nitride-based semiconductor multi-layer structure satisfies 0
    • 场效应晶体管包括氮化物基半导体多层结构,源电极(108),漏电极(109),保护膜(110)和设置在凹槽结构中的栅电极(112) ,其通过蚀刻直接形成,或者在其间插入栅极绝缘膜。 所述氮化物系半导体多层结构至少包括由Al x Ga 1-x N(0< n 1; 1)构成的基极层(103),由GaN或InGaN构成的沟道层(104),第1电子供给层(105) 其是未掺杂的或n型AlYGa1-YN层,作为未掺杂的AlZGa1-ZN层的阈值控制层(106)和作为未掺杂的或n型AlWGa1的第二电子供给层(107) -WN层,在衬底(101)上依次外延生长,缓冲层(102)插入其间。 氮化物系半导体多层结构中的各层的Al组成满足0
    • 39. 发明授权
    • Field effect transistor
    • 场效应晶体管
    • US08618578B2
    • 2013-12-31
    • US13147676
    • 2010-02-03
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • H01L29/66
    • H01L29/4236H01L29/1029H01L29/2003H01L29/42316H01L29/66462H01L29/66621H01L29/7783H01L29/7787
    • A field effect transistor includes a nitride-based semiconductor multi-layer structure, a source electrode (108), a drain electrode (109), a protective film (110), and a gate electrode (112) that is provided in a recess structure, which is formed by etching, directly or with a gate insulating film interposed therebetween. The nitride-based semiconductor multi-layer structure includes at least a base layer (103) made of AlXGa1-XN (0≦1), a channel layer (104) made of GaN or InGaN, a first electron supply layer (105), which is an undoped or n-type AlYGa1-YN layer, a threshold value control layer (106), which is an undoped AlZGa1-ZN layer, and a second electron supply layer (107), which is an undoped or n-type AlWGa1-WN layer, epitaxially grown in this order on a substrate (101) with a buffer layer (102) interposed therebetween. The Al composition of each layer in the nitride-based semiconductor multi-layer structure satisfies 0
    • 场效应晶体管包括氮化物基半导体多层结构,源电极(108),漏电极(109),保护膜(110)和设置在凹槽结构中的栅电极(112) ,其通过蚀刻直接形成,或者在其间插入栅极绝缘膜。 所述氮化物系半导体多层结构至少包括由Al x Ga 1-x N(0 1)构成的基极层(103),由GaN或InGaN构成的沟道层(104),第1电子供给层(105) 其是未掺杂的或n型AlYGa1-YN层,作为未掺杂的AlZGa1-ZN层的阈值控制层(106)和作为未掺杂的或n型AlWGa1的第二电子供给层(107) -WN层,在衬底(101)上依次外延生长,缓冲层(102)插入其间。 氮化物类半导体多层结构中的各层的Al组成满足0
    • 40. 发明授权
    • Compound semiconductor field effect transistor
    • 复合半导体场效应晶体管
    • US06534790B2
    • 2003-03-18
    • US09796803
    • 2001-03-02
    • Takehiko KatoKazuki OtaHironobu MiyamotoNaotaka IwataMasaaki Kuzuhara
    • Takehiko KatoKazuki OtaHironobu MiyamotoNaotaka IwataMasaaki Kuzuhara
    • H01L2915
    • H01L29/66462H01L29/7785
    • The present invention provides a field effect transistor (FET) having, on a semi-insulating compound semiconductor substrate, a buffer layer; an active layer that includes a channel layer made of a first conductive-type epitaxial growth layer (e.g. InGaAs); source/drain electrodes formed on a first conductive-type contact layer which is formed either on said active layer or on a lateral face thereof; a gate layer made of a second conductive-type epitaxial growth layer (e.g. p+-GaAs); and a gate electrode formed on said gate layer; which further has, between said second conductive-type gate layer and said channel layer, a semiconductor layer (e.g. InGaP) that rapidly lowers the energy of the valance band spreading from said gate layer to said channel layer. The present invention improves withstand voltage characteristic of a FET having a pn junction in a gate region (JFET) and realizes stable operations of a JFET.
    • 本发明提供一种在半绝缘化合物半导体衬底上具有缓冲层的场效应晶体管(FET) 包括由第一导电型外延生长层(例如InGaAs)制成的沟道层的有源层; 源极/漏极,形成在形成在所述有源层上或其侧面上的第一导电型接触层上; 由第二导电型外延生长层(例如p + -GaAs)制成的栅极层; 以及形成在所述栅极层上的栅电极; 在所述第二导电型栅极层和所述沟道层之间还具有快速降低从所述栅极层扩散到所述沟道层的能带的能量的半导体层(例如InGaP)。 本发明提高了在栅极区(JFET)中具有pn结的FET的耐压特性,并且实现了JFET的稳定操作。