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31. 发明授权

US10954340B2 Polyimide precursor composition 有权
公开(公告)号：US10954340B2
公开(公告)日：2021-03-23
申请号：US15749921
申请日：2016-08-08
申请人： TOKYO OHKA KOGYO CO., LTD. , ENEOS Corporation
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Shinichi Komatsu
IPC分类号： C08G73/12 , C08L79/08 , C08G73/10 , C08K5/3445
摘要： A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

32. 发明申请

US20200270456A1 SILICON-CONTAINING RESIN COMPOSITION 审中-公开
公开(公告)号：US20200270456A1
公开(公告)日：2020-08-27
申请号：US16870552
申请日：2020-05-08
申请人： TOKYO OHKA KOGYO CO., LTD.
发明人： Hiroki Chisaka , Mayumi Kuroko , Kunihiro Noda , Dai Shiota
IPC分类号： C08L83/04 , C09D183/04 , C09D183/16 , C08L83/16 , C09D7/40 , C08G77/60 , C07C69/14 , C08J5/18
摘要： A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

33. 发明授权

US10689514B2 Silicon-containing resin composition 有权
公开(公告)号：US10689514B2
公开(公告)日：2020-06-23
申请号：US15740227
申请日：2016-07-08
申请人： TOKYO OHKA KOGYO CO., LTD.
发明人： Hiroki Chisaka , Mayumi Kuroko , Kunihiro Noda , Dai Shiota
IPC分类号： C08L83/04 , C08L83/16 , C09D183/04 , C09D183/16 , C09D7/40 , C08G77/60 , C07C69/14 , C08J5/18
摘要： A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

34. 发明授权

US10239989B2 Curable composition 有权
公开(公告)号：US10239989B2
公开(公告)日：2019-03-26
申请号：US15533940
申请日：2015-12-08
申请人： TOKYO OHKA KOGYO CO., LTD.
发明人： Kunihiro Noda , Hiroki Chisaka , Yoshinori Tadokoro , Dai Shiota
IPC分类号： C08G59/42 , C08L63/00 , C08G59/40 , C08G59/50 , C08G59/56 , C08J5/04 , C08G59/68 , C08K5/09 , C08K5/10 , C08G59/52
摘要： A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.

35. 发明授权

US09891527B2 Developing solution and development processing method of photosensitive resin composition 有权
公开(公告)号：US09891527B2
公开(公告)日：2018-02-13
申请号：US14168305
申请日：2014-01-30
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Hiroki Chisaka , Kunihiro Noda , Dai Shiota
IPC分类号： G03F7/32 , G03F7/023 , G03F7/038 , G03F7/40
CPC分类号： G03F7/325 , G03F7/0233 , G03F7/0387 , G03F7/40
摘要： A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.

36. 发明授权

US09529258B2 Energy-sensitive resin composition 有权
标题翻译：能量敏感树脂组合物
公开(公告)号：US09529258B2
公开(公告)日：2016-12-27
申请号：US14758199
申请日：2013-12-25
申请人： TOKYO OHKA KOGYO CO., LTD.
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Kazuya Someya
IPC分类号： G03F7/004 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , C07D233/60 , C07C323/47 , C07D209/86 , C08K5/33 , G03F7/038 , C09D179/08 , C08G73/10 , C07D233/56 , C08K5/34
CPC分类号： G03F7/0041 , C07C323/47 , C07D209/86 , C07D233/56 , C07D233/60 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/1078 , C08K5/33 , C08K5/34 , C09D179/08 , G03F7/0045 , G03F7/0387 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , C08K5/3445
摘要： The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
摘要翻译：本发明提供一种能量敏感性树脂组合物，其中使用所述组合物的聚酰亚胺薄膜或聚酰亚胺模塑制品的制造方法以及形成所述组合物的图案的方法。该组合物即使通过在低温下进行热处理也提供具有优异的耐热性和低介电常数的聚酰亚胺树脂。该组合物含有通过使四羧酸二酐和二胺，溶剂和通过光和/或热的作用分解并产生碱和/或酸的化合物（A）反应而获得的聚酰胺酸。制造聚酰亚胺膜或聚酰亚胺模塑制品的方法包括形成包含该组合物的涂膜或模制品，并通过曝光或加热分解膜或产品中的化合物（A）。顺序形成图案的方法包括成膜，选择性地曝光，显影和加热薄膜或产品。

37. 发明授权

US09458355B2 Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution 有权
标题翻译：聚酰亚胺树脂的制造方法，聚酰亚胺涂料的制造方法，聚酰胺酸溶液的制造方法，聚酰亚胺涂料，聚酰胺酸溶液等
公开(公告)号：US09458355B2
公开(公告)日：2016-10-04
申请号：US13971003
申请日：2013-08-20
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Kazuya Someya
IPC分类号： C08G69/26 , C09D179/08 , C08L79/08 , G02F1/1337 , C08G73/10
CPC分类号： C09D179/08 , C08G69/26 , C08G73/1028 , C08G73/1032 , C08G73/1067 , C08L79/08 , C08L2666/20 , G02F1/133723
摘要： A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea.
摘要翻译：通过加热在N，N，N'，N'-四甲基脲中由四羧酸二酐组分和二胺组分反应得到的聚酰胺酸制得的聚酰亚胺树脂。

38. 发明申请

US20150337084A1 METHOD FOR PRODUCING POLYBENZOXAZOLE RESIN 有权
标题翻译：生产聚苯并噻唑树脂的方法
公开(公告)号：US20150337084A1
公开(公告)日：2015-11-26
申请号：US14716581
申请日：2015-05-19
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Masaru Shida
IPC分类号： C08G73/22
CPC分类号： C08G73/22
摘要： A method for producing a polybenzoxazole resin, in which even when a polybenzoxazole precursor is heat treated at a low temperature, a polybenzoxazole resin that is excellent in mechanical properties, such as tensile elongation, and in chemical resistance, is suppressed in terms of coloration, and is high in transparency can be produced. A polybenzoxazole resin is formed by heating a polybenzoxazole precursor which is obtained by allowing an aromatic diaminediol and a diformyl compound or a dicarboxylic acid dihalide, to react with each other in a solvent containing an amide compound or a urea compound each having a specified structure, at 120° C. to 350° C.
摘要翻译：即使在聚苯并恶唑前体在低温下进行热处理的聚苯并恶唑树脂的制造方法，在着色方面抑制机械性能如拉伸伸长率和耐化学性优异的聚苯并恶唑树脂，并且透明度高可以生产。通过加热通过使芳族二胺二醇和二酰基化合物或二羧酸二卤化物得到的聚苯并恶唑前体在含有具有特定结构的酰胺化合物或脲化合物的溶剂中进行反应而形成聚苯并恶唑树脂，在120℃至350℃

39. 发明申请

US20140234784A1 DEVELOPING SOLUTION AND DEVELOPMENT PROCESSING METHOD OF PHOTOSENSITIVE RESIN COMPOSITION 有权
标题翻译：光敏树脂组合物的开发解决方案和开发加工方法
公开(公告)号：US20140234784A1
公开(公告)日：2014-08-21
申请号：US14168305
申请日：2014-01-30
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Hiroki Chisaka , Kunihiro Noda , Dai Shiota
IPC分类号： G03F7/32
CPC分类号： G03F7/325 , G03F7/0233 , G03F7/0387 , G03F7/40
摘要： A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.
摘要翻译：含有N，N，N'，N'-四甲基脲和碳原子数1〜5的低级醇的聚酰亚胺前体的显影液。显影液增加了显影余量，导致聚酰亚胺类树脂膜的膜厚减少甚至不降低。一种感光性聚酰亚胺树脂组合物的显影处理方法，包括使至少一部分曝光的感光性聚酰亚胺前体树脂组合物与显影液一起显影; 以及图案形成方法，包括形成包含感光性聚酰亚胺前体树脂组合物的涂膜或成型体，选择性地曝光涂膜或成型，并通过显影处理方法显影曝光的涂膜或模塑。

40. 发明申请

US20140178808A1 PHOTOSENSITIVE RESIN COMPOSITION 有权
标题翻译：感光树脂组合物
公开(公告)号：US20140178808A1
公开(公告)日：2014-06-26
申请号：US14140789
申请日：2013-12-26
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Dai Shiota , Mayumi Kuroko , Tatsuro Ishikawa
IPC分类号： G03F7/004 , G03F7/20
CPC分类号： G03F7/0045 , G03F7/0755 , G03F7/0757
摘要： A photosensitive resin composition having excellent storage stability which can form a high precision pattern upon a low amount of exposure; a method of forming a pattern including a polysiloxane coating with the photosensitive resin composition; and an electronic component including a pattern including a polysiloxane coating formed with the photosensitive resin composition. A compound which generates an imidazole compound having a predetermined structure by light is added to a photosensitive resin composition including one or more hydrolyzable silane compounds, hydrolysates of the hydrolyzable silane compounds and condensates thereof and a photo-base generator or a photo-acid generator.
摘要翻译：一种具有优异的储存稳定性的感光性树脂组合物，其能够在低曝光量时形成高精度图案; 用感光性树脂组合物形成包含聚硅氧烷涂层的图案的方法; 以及包含由感光性树脂组合物形成的聚硅氧烷涂层的图案的电子部件。将含有一种或多种可水解硅烷化合物，水解性硅烷化合物及其缩合物的水解物和光产生剂或光酸发生剂的感光性树脂组合物加入到通过光产生具有预定结构的咪唑化合物的化合物。

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