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    • 31. 发明申请
    • Multilayer gate electrode, semiconductor device having the same and method of fabricating the same
    • 多层栅电极,与其相同的半导体器件及其制造方法
    • US20070052043A1
    • 2007-03-08
    • US11516633
    • 2006-09-07
    • Tae-Ho ChaChang-Won LeeHee-Sook ParkWoong-Hee SohnByung-Hee Kim
    • Tae-Ho ChaChang-Won LeeHee-Sook ParkWoong-Hee SohnByung-Hee Kim
    • H01L29/94H01L21/3205
    • H01L21/823842H01L21/823828
    • Example embodiments relate to a multilayer gate electrode, a semiconductor device having the same and methods of fabricating the same. Other example embodiments relate to a semiconductor device with a multilayer gate electrode which is relatively stable at higher temperatures, has improved resistance characteristics and improved reliability, and methods of fabricating the same. The multilayer gate electrode may include a polycrystalline semiconductor layer on the gate insulating layer and doped with conductive type impurities, an ohmic contact layer on the polycrystalline semiconductor layer and including tungsten (W1−x) and non-tungsten metal (Mx, x=about 0.01 to about 0.55), a metal barrier layer on the ohmic contact layer and a refractory metal layer on the metal barrier layer. The semiconductor device including a conductive type transistor may include a semiconductor substrate, a conductive type source/drain region in the semiconductor substrate, a gate insulating layer on a channel region between the source/drain regions and the multilayer gate electrode.
    • 示例性实施例涉及多层栅电极,具有该多层栅电极的半导体器件及其制造方法。 其他示例性实施例涉及具有多层栅电极的半导体器件,其在较高温度下相对稳定,具有改善的电阻特性和改善的可靠性,及其制造方法。 多层栅电极可以包括在栅极绝缘层上并掺杂有导电类型杂质的多晶半导体层,多晶半导体层上的欧姆接触层,并且包括钨(W 1-x N) 钨金属(M x x x,x =约0.01至约0.55),欧姆接触层上的金属阻挡层和金属阻挡层上的难熔金属层。 包括导电型晶体管的半导体器件可以包括半导体衬底,半导体衬底中的导电型源极/漏极区域,在源极/漏极区域和多层栅极电极之间的沟道区域上的栅极绝缘层。
    • 33. 发明申请
    • Methods of fabricating a semiconductor device having a metal gate pattern
    • 制造具有金属栅极图案的半导体器件的方法
    • US20060270204A1
    • 2006-11-30
    • US11498195
    • 2006-08-03
    • Ja-Hum KuChang-Won LeeSeong-Jun HeoSun-Pil YounSung-Man Kim
    • Ja-Hum KuChang-Won LeeSeong-Jun HeoSun-Pil YounSung-Man Kim
    • H01L21/4763H01L21/3205
    • H01L21/823437H01L21/28247H01L29/4941H01L29/6656
    • A method of fabricating a semiconductor device having a metal gate pattern is provided in which capping layers are used to control the relative oxidation rates of portions of the metal gate pattern during a oxidation process. The capping layer may be a multilayer structure and may be etched to form insulating spacers on the sidewalls of the metal gate pattern. The capping layer(s) allow the use of a selective oxidation process, which may be a wet oxidation process utilizing partial pressures of both H2O and H2 in an H2-rich atmosphere, to oxidize portions of the substrate and metal gate pattern while suppressing the oxidation of metal layers that may be included in the metal gate pattern. This allows etch damage to the silicon substrate and edges of the metal gate pattern to be reduced while substantially maintaining the original thickness of the gate insulating layer and the conductivity of the metal layer(s).
    • 提供一种制造具有金属栅极图案的半导体器件的方法,其中使用覆盖层来控制氧化过程中金属栅极图案的部分的相对氧化率。 覆盖层可以是多层结构,并且可以被蚀刻以在金属栅极图案的侧壁上形成绝缘间隔物。 封盖层允许使用选择性氧化工艺,其可以是使用H 2 H 2 O和H 2 H 2的分压的H氧化方法 2极化气氛,以便在抑制可能包含在金属栅极图案中的金属层的氧化的同时氧化基板和金属栅极图案的部分。 这允许对硅衬底的蚀刻损伤和金属栅极图案的边缘减小,同时基本上保持栅极绝缘层的原始厚度和金属层的导电性。
    • 39. 发明申请
    • METHODS OF MANUFACTURING NON-VOLATILE MEMORY DEVICES
    • 制造非易失性存储器件的方法
    • US20110189846A1
    • 2011-08-04
    • US13020979
    • 2011-02-04
    • Jeong Gil LeeChang-Won LeeSang-Woo LeeSun-Woo LeeKi-Hyun HwangJae-Hwa ParkEun-Ji Jung
    • Jeong Gil LeeChang-Won LeeSang-Woo LeeSun-Woo LeeKi-Hyun HwangJae-Hwa ParkEun-Ji Jung
    • H01L21/28
    • H01L21/28
    • A method of manufacturing a non-volatile memory device including a tunnel oxide layer, a preliminary charge storing layer and a dielectric layer on a semiconductor layer is disclosed. A first polysilicon layer is formed on the dielectric layer. A barrier layer and a second polysilicon layer are formed on the first polysilicon layer. The second polysilicon layer, the barrier layer, the first polysilicon layer, the dielectric layer, the preliminary charge storing layer and the tunnel oxide layer are patterned to form a tunnel layer pattern, a charge storing layer pattern, a dielectric layer pattern, a first control gate pattern, a barrier layer pattern and a second polysilicon pattern. A nickel layer is formed on the second polysilicon layer. Heat treatment is performed with respect to the second polysilicon pattern and the nickel layer to form a second control gate pattern including NiSi on the barrier layer pattern.
    • 公开了一种在半导体层上制造包括隧道氧化物层,初电电荷存储层和电介质层的非易失性存储器件的方法。 在介电层上形成第一多晶硅层。 在第一多晶硅层上形成阻挡层和第二多晶硅层。 对第二多晶硅层,势垒层,第一多晶硅层,电介质层,初电电荷存储层和隧道氧化物层进行图案化以形成隧道层图案,电荷存储层图案,介电层图案,第一 控制栅极图案,势垒层图案和第二多晶硅图案。 在第二多晶硅层上形成镍层。 对第二多晶硅图案和镍层进行热处理,以在阻挡层图案上形成包括NiSi的第二控制栅极图案。