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    • 31. 发明授权
    • Tri-state RF switch
    • 三态RF开关
    • US07477884B2
    • 2009-01-13
    • US11345237
    • 2006-02-02
    • Hyung ChoiJiwel JiaoYuelin WangXianglong Xing
    • Hyung ChoiJiwel JiaoYuelin WangXianglong Xing
    • H04B1/06
    • H01H59/0009H01H2001/0042H01P1/127
    • A tri-state RF MEMS switch includes: a first well formed in a first substrate; a first input signal line and a first output signal line forming a first gap therebetween in the first well; a post bar forming a boundary between the second well and third well in the second substrate; a second input signal line and a second output signal line, and a third input signal line and a third output signal line forming a second gap and a third gap in the second well and the third well, respectively; and a membrane disposed between the first substrate and the second substrate such that the membrane crosses the first, second and third gaps, the membrane including a first conductive pad, a second conductive pad, and a third conductive pad thereon to face the first, second and third gaps, respectively.
    • 三态RF MEMS开关包括:形成在第一衬底中的第一阱; 第一输入信号线和第一输出信号线,其在第一阱中形成第一间隙; 在第二基板中形成第二阱和第三阱之间的边界的柱条; 第二输入信号线和第二输出信号线,以及分别在第二阱和第三阱中形成第二间隙和第三间隙的第三输入信号线和第三输出信号线; 以及膜,其设置在所述第一基板和所述第二基板之间,使得所述膜跨越所述第一,第二和第三间隙,所述膜包括第一导电焊盘,第二导电焊盘和第三导电焊盘, 和第三个差距。
    • 33. 发明授权
    • Method of fabricating inkjet print heads
    • 制造喷墨打印头的方法
    • US07416675B2
    • 2008-08-26
    • US11453012
    • 2006-06-15
    • Dong-sik ShimHyung ChoiYong-seop Yoon
    • Dong-sik ShimHyung ChoiYong-seop Yoon
    • G01D15/00
    • B41J2/1603B41J2/1626B41J2/1635B41J2/1639B41J2/1643
    • A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.
    • 一种制造可用于喷墨打印机的喷墨打印头的方法。 制造喷墨打印头的方法包括:当准备喷墨打印头时,在晶片上准备多个喷墨打印头,同时在喷墨打印头周围形成副侧壁,将保护膜附着在晶片的子侧壁上 和喷墨打印头,并且对喷墨打印头进行切割并将各个喷墨打印头从晶片上分离出来。 在该方法中,喷墨打印头在晶片单元中切割。 特别地,可以防止喷墨打印头的连接垫被保护膜污染。
    • 35. 发明申请
    • Inkjet printhead and method of manufacturing the same
    • 喷墨打印头及其制造方法
    • US20070279458A1
    • 2007-12-06
    • US11653371
    • 2007-01-16
    • Moon-chul LeeDong-sik ShimHyung ChoiYong-seop Yoon
    • Moon-chul LeeDong-sik ShimHyung ChoiYong-seop Yoon
    • B41J2/05
    • B41J2/1603B41J2/1628B41J2/1629B41J2/1632B41J2/1639
    • An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.
    • 喷墨打印头和制造喷墨打印头的方法。 喷墨打印头包括基板,该基板包括在基板的上部形成为预定深度的沟槽,以及通过沟槽的底表面形成供墨的供墨孔,由金属形成的蚀刻停止层, 沟槽的内表面,多个加热器,通过加热形成在基板上的油墨产生气泡,多个电极,以形成在基板上的多个加热器施加电流,堆叠在基板上的室层 并且包括形成在各个加热器上方的多个墨室,以经由所述沟槽从所述供墨孔接收墨;以及喷嘴层,其堆叠在所述腔室层上并且包括多个喷嘴以从所述多个墨室喷射墨。
    • 38. 发明申请
    • METHOD OF FABRICATING INKJET PRINTHEAD
    • 制造喷墨打印机的方法
    • US20070131648A1
    • 2007-06-14
    • US11423982
    • 2006-06-14
    • Dong-sik ShimHyung Choi
    • Dong-sik ShimHyung Choi
    • G01D15/00G11B5/127
    • B41J2/14129B41J2/14137B41J2/1603B41J2/1626B41J2/1631B41J2/1639B41J2/1643Y10T29/49083Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49401
    • A method of fabricating an inkjet printhead. The method of fabricating an inkjet printhead includes sequentially forming an insulating layer, a heater, and an electrode on a substrate and forming a passivation layer on the insulating layer to cover the heater and the electrode; forming a trench that exposes the substrate by sequentially etching the passivation layer and the insulating layer; forming a sacrificial layer to form an ink chamber on the passivation layer to fill the trench; forming a seed layer to provide a plating on the sacrificial layer and the passivation layer; forming a nozzle mold on the seed layer positioned over the heater; forming a plating layer on the seed layer to a predetermined thickness; forming an ink feed hole by etching a rear surface of the substrate to expose the sacrificial layer which is filled in the trench; forming a nozzle by sequentially removing the nozzle mold and the seed layer positioned under the nozzle mold; and forming the ink chamber by removing the sacrificial layer which is exposed by the nozzle and the ink feed hole.
    • 一种制造喷墨打印头的方法。 制造喷墨打印头的方法包括在基板上依次形成绝缘层,加热器和电极,并在绝缘层上形成钝化层以覆盖加热器和电极; 形成通过依次蚀刻钝化层和绝缘层而使衬底暴露的沟槽; 形成牺牲层以在所述钝化层上形成墨水腔以填充所述沟槽; 形成种子层以在所述牺牲层和所述钝化层上提供电镀; 在位于加热器上方的种子层上形成喷嘴模具; 在种子层上形成预定厚度的镀层; 通过蚀刻所述衬底的后表面以暴露所述沟槽中填充的所述牺牲层来形成供墨孔; 通过依次去除位于喷嘴模具下方的喷嘴模具和籽晶层形成喷嘴; 以及通过去除由喷嘴和供墨孔暴露的牺牲层来形成墨室。
    • 39. 发明申请
    • Fuse box of semiconductor device
    • 半导体器件保险丝盒
    • US20070007620A1
    • 2007-01-11
    • US11321622
    • 2005-12-30
    • Hyung Choi
    • Hyung Choi
    • H01L29/00
    • H01L23/5256H01L2924/0002H01L2924/00
    • A fuse box of a semiconductor device is provided. More specifically, provided is a device of forming a uniformly residual oxide film by rearranging fuse boxes in consideration of an etching ratio depending on plasma density of the semiconductor device to prevent a fuse attack. During a repair etching process to open a fuse box in a chip, an etching loading effect is evenly reflected depending on pattern density of the fuse box so that the residual oxide film is regularly distributed in each fuse of all fuse boxes regardless of the size of an open region. As a result, the fuse attack resulting from an excessive etching process on the oxide film on a small fuse is prevented in fuse blowing to improve yield of FTA (Fixed To Attempt) yield.
    • 提供半导体器件的保险丝盒。 更具体地,提供了考虑到取决于半导体器件的等离子体密度的蚀刻比率来重新布置熔丝盒来形成均匀残留的氧化膜的装置,以防止熔丝攻击。 在打开芯片中的保险丝盒的修复蚀刻工艺期间,根据保险丝盒的图案密度均匀地反射刻蚀负载效应,使得残余氧化膜规则地分布在所有保险丝盒的每个保险丝中,而不管其尺寸如何 一个开放的地区。 结果,在保险丝熔断时,防止了在小熔断器上对氧化膜进行过度蚀刻处理而引起的保险丝攻击,以提高FTA(固定尝试)产量的产量。