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31. 发明授权

US5020394A Polycrystal diamond fluted tool and a process for the production of the same 失效
标题翻译：多晶金刚石槽纹工具及其生产工艺
公开(公告)号：US5020394A
公开(公告)日：1991-06-04
申请号：US420483
申请日：1989-10-12
申请人： Tsutomu Nakamura , Tetsuo Nakai
发明人： Tsutomu Nakamura , Tetsuo Nakai
IPC分类号： B23B51/00 , B23C5/00 , B23C5/10 , B23D77/02 , B23P5/00 , B23P15/32
CPC分类号： B23C5/00 , B23B51/00 , B23C5/1081 , B23D77/02 , B23P15/32 , B23B2226/315 , B23B2240/08 , B23B2251/50 , B23C2226/315 , B23C2240/08 , B23D2277/245 , B23D2277/54 , Y10S76/11 , Y10S76/12 , Y10T407/26 , Y10T407/27 , Y10T408/78
摘要： A polycrystal diamond fluted tool is provided which is capable of effecting working with much higher accuracy and longer life as compared with the sintered diamond straight fluted tool of the prior art, and is particularly suitable for finishing working with high accuracy. The tool is produced by forming, by a vapor phase synthesis method, a polycrystal diamond film on the surface of a substrate which has been subjected to helical grinding, then subjecting the product to a chemical treatment to dissolve and remove only the substrate, brazing the resulting polycrystal diamond film in a fluted form to at least a part of the rake face of a tool base metal which has been subjected to helical grinding in a similar manner to the substrate, and then subjecting the brazed tool base metal to working of a flank face to form a cutting edge.

32. 发明授权

US4505746A Diamond for a tool and a process for the production of the same 失效
标题翻译：钻石的工具和生产过程相同
公开(公告)号：US4505746A
公开(公告)日：1985-03-19
申请号：US414821
申请日：1982-09-03
申请人： Tetsuo Nakai , Shuji Yazu
发明人： Tetsuo Nakai , Shuji Yazu
IPC分类号： B01J3/06 , B24D3/06 , B24D18/00 , C22C26/00 , B22F7/02 , B24D3/02
CPC分类号： C22C26/00 , B01J3/062 , B24D3/06 , B01J2203/062 , B01J2203/0645 , B01J2203/0655 , B01J2203/066 , B01J2203/0685 , C22C2026/005 , Y10S76/12
摘要： An improved diamond compact of the present invention comprises 20 to 85% by volume of diamond grains with a grain size of at least 3 .mu.m and the balance of a binder consisting of 20 to 95% by volume of ultra-fine diamond grains with a grain size of at most 1 .mu.m, at least one member with a grain size of at most 1 .mu.m, selected from the group consisting of carbides, carbonitrides, nitrides, borides of Group 4a, 5a and 6a elements of Periodic Table, solid solutions thereof and mixed crystals thereof and at least one member selected from the group consisting of iron group metals.
摘要翻译：本发明的改进的金刚石复合体包含20至85体积％的晶粒尺寸至少为3微米的金刚石颗粒，余量为20至95体积％的超细金刚石颗粒，其中具有晶粒尺寸至多为1μm，至少一种粒径至多为1μm的成员选自碳化物，碳氮化物，氮化物，元素周期表4a，5a和6a元素的硼化物，固体溶液及其混晶，以及选自铁族金属中的至少一种。

33. 发明授权

US07528413B2 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it 有权
标题翻译：具有高导热性的烧结金刚石及其制造方法以及使用它的散热器
公开(公告)号：US07528413B2
公开(公告)日：2009-05-05
申请号：US10494947
申请日：2002-10-16
申请人： Katsuhito Yoshida , Hideaki Morigami , Takahiro Awaji , Tetsuo Nakai
发明人： Katsuhito Yoshida , Hideaki Morigami , Takahiro Awaji , Tetsuo Nakai
IPC分类号： H01L29/15 , H01L31/0312
CPC分类号： C04B35/645 , C04B35/52 , C04B35/62842 , C04B2235/3817 , C04B2235/3826 , C04B2235/3839 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/427 , C04B2235/428 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/9607 , H01L23/3732 , H01L2924/0002 , H01S5/02476 , Y10S438/929 , Y10T428/26 , Y10T428/2982 , Y10T428/30 , H01L2924/00
摘要： This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
摘要翻译：本发明涉及一种高导热性复合材料，其包括金刚石颗粒和铜基质，其可用作用于电子部件的电子散热器，特别是用于半导体激光器，高性能MPU（微处理单元）等），还涉及用于相同的生产和散热器使用相同。根据本发明的高导热性金刚石烧结体，特别地，可以提供具有高导热性以及热膨胀匹配的散热器，最适合于安装大型和高热负荷半导体芯片，例如高输出半导体激光器，高性能MPU等。此外，可以自由地控制热导率和热膨胀等性能，因此可以根据元件的特征和设计来选择最合适的散热器要安装。

34. 发明授权

US06302225B1 Polycrystal diamond tool 有权
标题翻译：多晶金刚石工具
公开(公告)号：US06302225B1
公开(公告)日：2001-10-16
申请号：US09295356
申请日：1999-04-21
申请人： Katsuhito Yoshida , Yasunobu Ogata , Junichi Shiraishi , Tetsuo Nakai
发明人： Katsuhito Yoshida , Yasunobu Ogata , Junichi Shiraishi , Tetsuo Nakai
IPC分类号： E21B1046
CPC分类号： C04B37/026 , B23B27/18 , B23K35/3006 , B23K35/302 , C04B2237/122 , C04B2237/123 , C04B2237/343 , C04B2237/348 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/403 , C04B2237/407 , C04B2237/708 , C04B2237/765 , Y10T407/1904
摘要： A polycrystal diamond tool is provided whose heat resistance, strength and anti-adhesion property are improved by modifying the porosity of a diamond sintered compact and which comprises a diamond sintered compact, sintered under ultra-high pressure and high temperature, brazed onto a tool substrate, in which the cutting edge vicinity part consists of 85 to 99 volume % of the diamond sintered compact material consisting of diamond grains bonded with each other and the balance of pores, and the other part than the cutting edge vicinity part consists of diamond grains and the balance of a brazing material.
摘要翻译：提供了一种多晶金刚石工具，其耐热性，强度和抗粘附性通过改变金刚石烧结体的孔隙率而得到改善，并且包括在超高压和高温下烧结的金刚石烧结体，钎焊到工具基板上其中切割边缘部分由相互结合的金刚石晶粒和平衡孔组成的金刚石烧结体材料的85-99体积％组成，另一部分由切割边缘部分组成，其中金刚石颗粒和平衡的钎焊材料。

35. 发明授权

US5759216A Diamond sintered body having high strength and high wear-resistance and manufacturing method thereof 失效
标题翻译：具有高强度和高耐磨性的金刚石烧结体及其制造方法
公开(公告)号：US5759216A
公开(公告)日：1998-06-02
申请号：US786114
申请日：1997-01-17
申请人： Yasuyuki Kanada , Hirohumi Mizusuna , Tsutomu Nakamura , Tetsuo Nakai
发明人： Yasuyuki Kanada , Hirohumi Mizusuna , Tsutomu Nakamura , Tetsuo Nakai
IPC分类号： B01J3/06 , C22C26/00 , C09C1/08
CPC分类号： B01J3/062 , C22C26/00 , B01J2203/062 , B01J2203/0655 , B01J2203/0685
摘要： A method of manufacturing a diamond sintered body includes the following steps: preparing a diamond powder having a particle size within a range of 0.1 to 10 .mu.m, coating the surface of each particle of the diamond powder with a sintering assistant agent including Pd within a range of 0.01 to 40 percent by weight and at least one iron family metal as a remainder, and liquid-phase sintering the coated diamond powder under a high pressure and high temperature condition. In this manner, a diamond sintered body having high strength and high wear-resistance, and containing diamond particles of 80 to 96 percent by volume, can be obtained.
摘要翻译：制造金刚石烧结体的方法包括以下步骤：制备粒度在0.1至10μm范围内的金刚石粉末，用包含Pd的烧结助剂将金刚石粉末的每个颗粒的表面涂覆在范围为0.01〜40重量％，以及至少一种铁族金属作为其余部分，并在高压和高温条件下液相烧结涂覆的金刚石粉末。以这种方式，可以获得具有高强度和高耐磨性并且含有80至96体积％的金刚石颗粒的金刚石烧结体。

36. 发明授权

US5299214A Heat radiating component and semiconductor device provided with the same 失效
标题翻译：散热部件和半导体装置相同
公开(公告)号：US5299214A
公开(公告)日：1994-03-29
申请号：US905241
申请日：1992-06-26
申请人： Tsutomu Nakamura , Takahisa Iguchi , Tetsuo Nakai
发明人： Tsutomu Nakamura , Takahisa Iguchi , Tetsuo Nakai
IPC分类号： H01L23/373 , H01L23/433 , H01L23/495 , H01S3/04
CPC分类号： H01L23/49513 , H01L23/3732 , H01L23/3736 , H01L23/4334 , H01L24/32 , H01L2224/2908 , H01L2224/29083 , H01L2224/29111 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/10329 , H01L2924/12042 , H01L2924/157 , H01L2924/15787 , H01L2924/181
摘要： A semiconductor laser is provided with a heat radiating component for radiating or dissipating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on an upper surface of a stem (4). A semiconductor laser element (1) is bonded, e.g. by brazing to the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). The heat radiating component has a thermal expansion coefficient which is the same as that of an LSI chip to be mounted thereon to provide an excellent heat radiating property.
摘要翻译：半导体激光器设置有用于在工作中产生的散热或散热的散热部件。在该散热部件中，通过气相沉积合成的多晶金刚石层（3）形成在杆（4）的上表面上。半导体激光元件（1），例如，通过钎焊金属（2）钎焊到气相沉积的多晶金刚石层（3）的表面。散热部件具有与要安装在其上的LSI芯片相同的热膨胀系数，以提供优异的散热性能。

37. 发明授权

US4890782A Process for the production of a composite tool 失效
标题翻译：生产复合工具的过程
公开(公告)号：US4890782A
公开(公告)日：1990-01-02
申请号：US186082
申请日：1988-04-25
申请人： Tetsuo Nakai , Akio Hara , Shuji Yazu
发明人： Tetsuo Nakai , Akio Hara , Shuji Yazu
IPC分类号： B23K31/02 , B23K35/00 , E21B10/56 , E21B10/567
CPC分类号： E21B10/567 , B23K31/025 , B23K35/001 , Y10T428/24942 , Y10T428/30
摘要： A composite tool with a higher bonding strength and higher heat resistance is provided comprising an insert of a hard material such as composite diamond or BN compacts and a support of a hard metal or alloy such as steel and cemented carbides, having a larger volume than the insert, the insert and support being bonded by friction welding through an interlayer of a high strength metal or alloy such as Co and Ni with a thickness of at most 1 mm.
摘要翻译：提供了具有较高粘合强度和较高耐热性的复合工具，其包括硬质材料（例如复合金刚石或BN压块）的插入物和诸如钢和硬质合金的硬质金属或合金的支撑体，其具有比插入物，插入物和支持体通过摩擦焊接通过厚度为至多1mm的高强度金属或诸如Co和Ni的合金的中间层进行结合。

38. 发明授权

US4403015A Compound sintered compact for use in a tool and the method for producing the same 失效
标题翻译：用于工具的复合烧结体及其制造方法
公开(公告)号：US4403015A
公开(公告)日：1983-09-06
申请号：US227787
申请日：1981-01-21
申请人： Tetsuo Nakai , Shuji Yazu , Akio Hara
发明人： Tetsuo Nakai , Shuji Yazu , Akio Hara
IPC分类号： B01J3/06 , B22F7/06 , B24D3/00 , B24D3/06 , B24D3/10 , B32B18/00 , C04B35/5831 , B22F3/14 , B22F7/08
CPC分类号： C04B35/5831 , B01J3/062 , B22F7/06 , B24D3/007 , B24D3/06 , B24D3/10 , C04B35/58014 , C04B35/645 , B01J2203/062 , B01J2203/0645 , B01J2203/0655 , B01J2203/066 , B01J2203/0685 , C04B2235/3843 , C04B2235/386 , C04B2235/3886 , C04B2235/5436 , Y10T428/12146
摘要： The invention enables to obtain a compound sintered compact for use in a cutting tool having particularly high properties in respect of bonded strength, hardness, wear resistance, plastic deformability and rigidity by bonding a diamond or cubic boron nitride containing hard layer to a cemented carbide substrate with interposition of an intermediate bonding layer.A powder for forming the intermediate bonding layer comprising cubic boron nitride in an amount less than 70 volume %, the residual part principally consisting of a compound selected from among carbides, nitrides, carbonitrides or borides of 4a, 5a, 6a transition metals of the periodic table, an admixture thereof, or a mutual solid solution compound thereof, after pressing or in the state of powder, is placed on the cemented carbide substrate to a thickness less than 2 mm, or preliminarily applied to said cemented carbide substrate, further on said powder being placed a powder for forming the hard sintered compact containing diamond or cubic boron nitride in an amount in excess of 20 volume % after pressing or in the state of powder, the whole being hot pressed under an ultrahigh pressure and a high temperature to sinter the diamond or cubic boron nitride containing hard layer and the intermediate layer as well as to bond said hard layer, intermediate layer and substrate to each other, thereby enabling to obtain a compound sintered compact having the aforesaid superior properties for use in a cutting tool.
摘要翻译：本发明能够获得用于具有特别高的接合强度，硬度，耐磨性，塑性变形性和刚性特性的切削工具中的复合烧结体，该金刚石或立方氮化硼含有硬质层与硬质合金基体插入中间粘合层。用于形成中间粘合层的粉末包含小于70体积％的立方氮化硼，残余部分主要由选自周期性的4a，5a，6a过渡金属的碳化物，氮化物，碳氮化物或硼化物组成的化合物表，其混合物或其相互固溶的化合物在压制或粉末状态之后，以小于2mm的厚度放置在硬质合金基体上，或者预先施加到所述硬质合金基底上，进一步在所述在粉末中放置粉末，用于形成含有金刚石或立方氮化硼的硬质烧结体，其量超过压制后的20体积％或粉末状态，整体在超高压和高温下热压烧结含有金刚石或立方氮化硼的硬质层和中间层，以及将所述硬质层，中间层和基板彼此接合，从而能够获得具有上述用于切削工具的优异性能的复合烧结体。

39. 发明申请

US20050051891A1 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it 有权
标题翻译：具有高导热性的烧结金刚石及其制造方法以及使用它的散热器
公开(公告)号：US20050051891A1
公开(公告)日：2005-03-10
申请号：US10494947
申请日：2002-10-16
申请人： Katsuhito Yoshida , Hideaki Morigami , Takahiro Awaji , Tetsuo Nakai
发明人： Katsuhito Yoshida , Hideaki Morigami , Takahiro Awaji , Tetsuo Nakai
IPC分类号： C04B35/645 , H01L23/373 , H01L23/34
CPC分类号： C04B35/645 , C04B35/52 , C04B35/62842 , C04B2235/3817 , C04B2235/3826 , C04B2235/3839 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/427 , C04B2235/428 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/9607 , H01L23/3732 , H01L2924/0002 , H01S5/02476 , Y10S438/929 , Y10T428/26 , Y10T428/2982 , Y10T428/30 , H01L2924/00
摘要： This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
摘要翻译：本发明涉及一种高导热性复合材料，其包括金刚石颗粒和铜基质，其可用作用于电子部件的电子散热器，特别是用于半导体激光器，高性能MPU（微处理单元）等），还涉及用于相同的生产和散热器使用相同。根据本发明的高导热性金刚石烧结体，特别地，可以提供具有高导热性以及热膨胀匹配的散热器，最适合于安装大型和高热负荷半导体芯片，例如高输出半导体激光器，高性能MPU等。此外，可以自由地控制热导率和热膨胀等性能，因此可以根据元件的特征和设计来选择最合适的散热器要安装。

40. 发明授权

US06528159B1 Sintered diamond tool and method for manufacturing the same 有权
标题翻译：烧结金刚石工具及其制造方法
公开(公告)号：US06528159B1
公开(公告)日：2003-03-04
申请号：US09623276
申请日：2000-09-01
申请人： Yasuyuki Kanada , Yoshihiro Kuroda , Noboru Yamazaki , Yasunobu Ogata , Kunihiro Tomita , Tetsuo Nakai , Makoto Abe
发明人： Yasuyuki Kanada , Yoshihiro Kuroda , Noboru Yamazaki , Yasunobu Ogata , Kunihiro Tomita , Tetsuo Nakai , Makoto Abe
IPC分类号： B32B900
CPC分类号： C04B41/009 , B22F2998/00 , C04B41/4961 , C04B41/5035 , C04B41/5059 , C04B41/5066 , C04B41/5096 , C04B41/52 , C04B41/5353 , C04B41/84 , C04B41/85 , C04B41/87 , C04B41/89 , C04B41/91 , C22C26/00 , C22C2204/00 , C23C30/005 , Y10T428/24975 , Y10T428/265 , Y10T428/30 , Y10T428/31678 , C04B41/4521 , C04B41/4545 , C04B41/4531 , C04B35/52 , B22F2207/03
摘要： A diamond sintered body tool (20) having superior adhesion resistance, chipping resistance and high strength includes a tool base material (22) including a diamond sintered body, and a surface layer (21) formed on a surface of the tool base material (22). The surface layer (21) includes at least one of silicon, a silicon oxide, a silicon carbide, a silicon nitride and a solid solution thereof. The tool base material (22) has an inner portion (22b) including a first content of an iron group metal, and a surface portion (22a) surrounding the inner portion (22b ) and including a second content of the iron group metal lower than the first content.
摘要翻译：具有优异的耐粘附性，耐崩裂性和高强度的金刚石烧结体工具（20）包括：工具基材（22），其包括金刚石烧结体，以及在工具基材（22）的表面上形成的表面层）。表面层（21）包括硅，氧化硅，碳化硅，氮化硅及其固溶体中的至少一种。工具基材（22）具有包含铁族金属的第一含量的内部部分（22b）和围绕内部部分（22b）的表面部分（22a），并且包含铁族金属的第二含量低于第一个内容。

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