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31. 发明申请

US20080268134A1 ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有增加的稳定性的电极及其制造方法
公开(公告)号：US20080268134A1
公开(公告)日：2008-10-30
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： H01M4/04
CPC分类号： A61N1/0543 , A61N1/36046
摘要： The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
摘要翻译：本发明提供具有增加的稳定性的可植入电极，其具有聚集结构，其中电极的表面被包括填充有棒或柱的开口的材料覆盖。本发明提供了具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。本发明提供一种具有增加的稳定性的电极的制造方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。本发明提供了一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

32. 发明授权

US08501547B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US08501547B2
公开(公告)日：2013-08-06
申请号：US13567366
申请日：2012-08-06
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L21/56
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

33. 发明授权

US08322027B1 Flexible circuit electrode array and method of manufacturing the same 有权
标题翻译：柔性电路电极阵列及其制造方法
公开(公告)号：US08322027B1
公开(公告)日：2012-12-04
申请号：US11926498
申请日：2007-10-29
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
IPC分类号： H05K3/00 , H05K3/10 , H05K1/00
CPC分类号： H05K3/06 , A61N1/0543 , H05K1/118 , H05K3/0041 , H05K3/28 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2203/0554 , H05K2203/0789 , H05K2203/0793 , H05K2203/095 , H05K2203/1163 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155
摘要： A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.
摘要翻译：一种制造柔性电路电极阵列的方法，包括：a）在所述绝缘体聚合物基底层上沉积包含基底涂层，导电层和顶部涂层的金属迹线层; b）在所述金属迹线层上施加一层光致抗蚀剂，并图案化所述金属迹线层并在所述绝缘体聚合物基底层上形成金属迹线; c）激活所述绝缘体聚合物基层并沉积顶部绝缘体聚合物层并与所述基础绝缘体聚合物层形成单个绝缘聚合物层; d）在所述绝缘体聚合物层的表面上施加薄金属层和光致抗蚀剂层，并选择性地蚀刻所述绝缘体层和所述顶部涂层以获得至少一个通孔; 和e）用电极材料填充所述通孔。放置一层聚合物。将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。因此阵列及其供电电缆由单体形成。或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。该方法提供了聚合物基底层和聚合物顶层之间的极好的粘合性，并且痕迹金属和电极的绝缘性。

34. 发明授权

US08258635B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US08258635B2
公开(公告)日：2012-09-04
申请号：US12726274
申请日：2010-03-17
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L23/29
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

35. 发明授权

US07877866B1 Flexible circuit electrode array and method of manufacturing the same 有权
标题翻译：柔性电路电极阵列及其制造方法
公开(公告)号：US07877866B1
公开(公告)日：2011-02-01
申请号：US11545354
申请日：2006-10-10
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok
IPC分类号： H05K3/00 , H05K3/10 , H01R9/00
CPC分类号： H05K3/06 , A61N1/0543 , H05K1/118 , H05K3/0041 , H05K3/28 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2203/0554 , H05K2203/0789 , H05K2203/0793 , H05K2203/095 , H05K2203/1163 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155
摘要： A method of manufacturing a flexible circuit electrode array that provides excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
摘要翻译：一种制造柔性电路电极阵列的方法，其提供聚合物基层和聚合物顶层之间的优异粘附性以及痕量金属和电极的绝缘。放置一层聚合物。将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。因此阵列及其供电电缆由单体形成。或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。

36. 发明授权

US07709961B2 Implantable microelectronic device and method of manufacture 有权
标题翻译：植入式微电子器件及其制造方法
公开(公告)号：US07709961B2
公开(公告)日：2010-05-04
申请号：US11924486
申请日：2007-10-25
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L29/40
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

37. 发明申请

US20100197082A1 Implantable Microelectronic Device and Method of Manufacture 有权
标题翻译：可植入微电子器件及其制造方法
公开(公告)号：US20100197082A1
公开(公告)日：2010-08-05
申请号：US12726274
申请日：2010-03-17
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L21/56
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译：公开了可植入气密微电子器件及其制造方法。本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔层。在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触，装置。优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

38. 发明授权

US07912556B2 Electrode array for even neural pressure 有权
标题翻译：电极阵列甚至神经压力
公开(公告)号：US07912556B2
公开(公告)日：2011-03-22
申请号：US12397974
申请日：2009-03-04
申请人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
发明人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
IPC分类号： A61N1/00
CPC分类号： A61N1/0543 , A61N1/0558
摘要： An electrode array attached to neural tissue, such as the retina, necessarily has graded pressure exerted on the tissue, with higher pressure near the attachment point. Greater pressure improves contact between the electrodes and neural tissue while too much pressure may damage neural tissue. Hence it is advantageous to obtain equal pressure across the array field. In the present invention multiple and selective attachment points are provided on an electrode array allowing a surgeon to select the attachment points providing the best electrode tissue contact.
摘要翻译：附着到神经组织（例如视网膜）上的电极阵列必须具有施加在组织上的分级压力，附近点附近具有更高的压力。更大的压力改善了电极和神经组织之间的接触，而太多的压力可能损伤神经组织。因此，有利的是在阵列场上获得相等的压力。在本发明中，在电极阵列上提供多个选择性附着点，允许外科医生选择提供最佳电极组织接触的附着点。

39. 发明申请

US20090228086A1 Electrode Array for Even Neural Pressure 有权
标题翻译：用于均匀神经压力的电极阵列
公开(公告)号：US20090228086A1
公开(公告)日：2009-09-10
申请号：US12397974
申请日：2009-03-04
申请人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
发明人： Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Jordan Matthew Neysmith
IPC分类号： A61N1/05
CPC分类号： A61N1/0543 , A61N1/0558
摘要： An electrode array attached to neural tissue, such as the retina, necessarily has graded pressure exerted on the tissue, with higher pressure near the attachment point. Greater pressure improves contact between the electrodes and neural tissue while too much pressure may damage neural tissue. Hence it is advantageous to obtain equal pressure across the array field. In the present invention multiple and selective attachment points are provided on an electrode array allowing a surgeon to select the attachment points providing the best electrode tissue contact.
摘要翻译：附着到神经组织（例如视网膜）上的电极阵列必须具有施加在组织上的分级压力，附近点附近具有更高的压力。更大的压力改善了电极和神经组织之间的接触，而太多的压力可能损伤神经组织。因此，有利的是在阵列场上获得相等的压力。在本发明中，在电极阵列上提供多个选择性附着点，允许外科医生选择提供最佳电极组织接触的附着点。

40. 发明申请

US20090264972A1 Flexible Circuit Electrode Array 有权
标题翻译：柔性电路电极阵列
公开(公告)号：US20090264972A1
公开(公告)日：2009-10-22
申请号：US12163658
申请日：2008-06-27
申请人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little
发明人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little
IPC分类号： A61N1/05 , B29C70/88 , B05D5/12
CPC分类号： A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要： A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) depositing a second soft polymer layer on the top polymer layer; (f) providing holes in the second soft polymer layer and in the top polymer layer for bond pads and electrodes; and (g) preparing electrodes in the provided holes.
摘要翻译：一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及通过软聚合物的基底和顶层的部分或全部涂层。一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层中提供孔; （f）在顶部聚合物层上沉积第二软聚合物层; （g）在第二软聚合物层中为接合焊盘和电极提供孔; 和（h）在所提供的孔中制备电极。一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层上沉积第二软聚合物层; （f）在第二软聚合物层和顶部聚合物层中提供用于接合焊盘和电极的孔; 和（g）在所提供的孔中制备电极。

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