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31. 发明授权

US5876478A Metal mold for glass forming 失效
标题翻译：用于玻璃成型的金属模具
公开(公告)号：US5876478A
公开(公告)日：1999-03-02
申请号：US754551
申请日：1996-11-21
申请人： Hiroto Imamura , Michio Endo , Syoichi Sekiguchi , Shigeki Ogura , Isao Arikata , Mitsuji Hirata , Koji Akafuji , Hirokazu Taniguchi , Toru Ono
发明人： Hiroto Imamura , Michio Endo , Syoichi Sekiguchi , Shigeki Ogura , Isao Arikata , Mitsuji Hirata , Koji Akafuji , Hirokazu Taniguchi , Toru Ono
IPC分类号： C03B9/34 , C03B9/347 , C03B9/48 , C03B40/00 , C22C9/00 , C22C30/00 , C22C30/02 , C22C38/20 , C22C38/42 , C03B40/33
CPC分类号： C03B40/00 , C03B9/342 , C03B9/344 , C03B9/347 , C03B9/48 , C22C30/00 , C22C30/02 , C22C38/20 , C22C38/42 , C22C9/00
摘要： The present invention aims to provide a metal mold for glass, which needs not apply any swab in molding of glass, enabling no-swabbing glass forming. The alloy for the mold comprises by weight Cu: 10 to 80%, Al: 4 to 11%, Cr: 3 to 16%, Ni: 2 to 36%, and at least one rare earth element: 0.02 to 2.0% with the balance consisting of Fe and further comprises at least one member selected from the group consisting of Ti: Al%.times.0.5 to 2, V: Al%.times.0.2 to 1, Zr: Al%.times.0.1 to 0.3, and Nb: Al%.times.0.1 to 0.3. The alloy is gradually cooled from the solidification initiation temperature to 50.degree. C. at a cooling rate of 10.degree. C./ min. The surface of the mold is coated with an Al-containing coating or roughened to an average roughness of 0.3 to 5 .mu.m. A solid lubricating film is provided in a fitting portion of the mold, or alternatively a self-lubricating solid is embedded in the fitting portion of the mold.
摘要翻译：本发明的目的在于提供一种用于玻璃的金属模具，其不需要在玻璃成型中使用任何拭子，从而能够进行无擦拭的玻璃成形。用于模具的合金包括Cu：10至80％，Al：4至11％，Cr：3至16％，Ni：2至36％，以及至少一种稀土元素：0.02至2.0％余量由Fe组成，进一步包含选自Ti：Al％x0.5〜2，V：Al％x0.2〜1，Zr：Al％×0.1〜0.3，Nb： Al％x0.1〜0.3。合金以10℃/ min的冷却速度从凝固起始温度逐渐冷却至50℃。模具的表面涂覆有含Al涂层或粗糙化至0.3至5μm的平均粗糙度。固体润滑膜设置在模具的装配部分中，或者自动润滑固体嵌入在模具的装配部分中。

32. 发明授权

US5656104A Metal mold for glass forming 失效
标题翻译：用于玻璃成型的金属模具
公开(公告)号：US5656104A
公开(公告)日：1997-08-12
申请号：US479806
申请日：1995-06-07
申请人： Hiroto Imamura , Michio Endo , Syoichi Sekiguchi , Shigeki Ogura , Isao Arikata , Mitsuji Hirata , Koji Akafuji , Hirokazu Taniguchi , Toru Ono
发明人： Hiroto Imamura , Michio Endo , Syoichi Sekiguchi , Shigeki Ogura , Isao Arikata , Mitsuji Hirata , Koji Akafuji , Hirokazu Taniguchi , Toru Ono
IPC分类号： C03B9/34 , C03B9/347 , C03B9/48 , C03B40/00 , C22C9/00 , C22C30/00 , C22C30/02 , C22C38/20 , C22C38/42 , C23C8/62 , C03B11/00
CPC分类号： C03B40/00 , C03B9/342 , C03B9/344 , C03B9/347 , C03B9/48 , C22C30/00 , C22C30/02 , C22C38/20 , C22C38/42 , C22C9/00
摘要： The present invention aims to provide a metal mold for glass, which needs not apply any swab in molding of glass, enabling no-swabbing glass forming. The alloy for the mold comprises by weight Cu: 10 to 80%, Al: 4 to 11%, Cr: 3 to 16%, Ni: 2 to 36%, and at least one rare earth element: 0.02 to 2.08 with the balance consisting of Fe and further comprises at least one member selected from the group consisting of Ti: Al %.times.0.5 to 2, V: Al %.times.0.2 to 1, Zr: Al %.times.0.1 to 0.3, and Nb: Al %.times.0.1 to 0.3. The alloy is gradually cooled from the solidification initiation temperature to 500.degree. C. at a cooling rate of 10.degree. C./min. The surface of the mold is coated with an Al-containing coating or roughened to an average roughness of 0.3 to 5 .mu.m. A solid lubricating film is provided in a fitting portion of the mold, or alternatively a self-lubricating solid is embedded in the fitting portion of the mold.
摘要翻译：本发明的目的在于提供一种用于玻璃的金属模具，其不需要在玻璃成型中使用任何拭子，从而能够进行无擦拭的玻璃成形。用于模具的合金包括Cu：10〜80％，Al：4〜11％，Cr：3〜16％，Ni：2〜36％，和至少一种稀土元素：0.02〜2.08，余量由Fe组成，进一步含有选自Ti：Al％x0.5〜2，V：Al％x0.2〜1，Zr：Al％×0.1〜0.3，Nb：Al ％x0.1〜0.3。合金以10℃/ min的冷却速度从凝固起始温度逐渐冷却至500℃。模具的表面涂覆有含Al涂层或粗糙化至0.3至5μm的平均粗糙度。固体润滑膜设置在模具的装配部分中，或者自动润滑固体嵌入在模具的装配部分中。

33. 发明授权

US08686266B2 Keyboard device 有权
标题翻译：键盘设备
公开(公告)号：US08686266B2
公开(公告)日：2014-04-01
申请号：US13288113
申请日：2011-11-03
申请人： Hirokazu Taniguchi
发明人： Hirokazu Taniguchi
IPC分类号： G10C3/12
CPC分类号： G10H1/346
摘要： The present invention includes a keyboard chassis 1; keys 2 which are arranged on the keyboard chassis 1 and rotate in an up and down direction by bending a bendable section 22 positioned in the rear; and a key rotation holding section 30 for holding the rotation fulcrum of a key 2 stable when it rotates in the up and down direction. Accordingly, the rotation fulcrum of the key 2 is kept stable by a first supporting section 31 and a second supporting section 32 of the key rotation holding section 30 when the key 2 is depressed and the bendable section 22 bends in the up and down direction, whereby the key 2 is stably rotated. Therefore, regardless of whether the front portion of the key 2 is being depressed or the rear portion thereof is being depressed, the rotation movement of the key 2 will always remain stable.
摘要翻译：本发明包括键盘机箱1; 键2，其布置在键盘机架1上并通过弯曲位于后部的可弯曲部分22而沿上下方向旋转; 以及当沿着上下方向旋转时，用于保持键2的旋转支点稳定的按键旋转保持部30。因此，当键2被按下并且可弯曲部22沿上下方向弯曲时，键2的旋转支点由键旋转保持部30的第一支撑部31和第二支撑部32保持稳定，钥匙2稳定旋转。因此，无论键2的前部是否被按压或其后部被按压，键2的旋转运动总是保持稳定。

34. 发明申请

US20120175669A1 LIGHT EMITTING DEVICE USING GaN LED CHIP 失效
标题翻译：使用GaN LED芯片的发光装置
公开(公告)号：US20120175669A1
公开(公告)日：2012-07-12
申请号：US13418827
申请日：2012-03-13
申请人： Takahide Joichi , Hiroaki Okagawa , Shin Hiraoka , Toshihiko Shima , Hirokazu Taniguchi
发明人： Takahide Joichi , Hiroaki Okagawa , Shin Hiraoka , Toshihiko Shima , Hirokazu Taniguchi
IPC分类号： H01L33/32
CPC分类号： H01L33/32 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/405 , H01L33/62 , H01L2224/16225 , H01L2224/32014 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device is constituted by flip-chip mounting a GaN-based LED chip. The GaN-based LED chip includes a light-transmissive substrate and a GaN-based semiconductor layer formed on the light-transmissive substrate, wherein the GaN-based semiconductor layer has a laminate structure containing an n-type layer, a light emitting layer and a p-type layer in this order from the light-transmissive substrate side, wherein a positive electrode is formed on the p-type layer, the electrode containing a light-transmissive electrode of an oxide semiconductor and a positive contact electrode electrically connected to the light-transmissive electrode, and the area of the positive contact electrode is half or less of the area of the upper surface of the p-type layer.
摘要翻译：发光器件通过倒装芯片安装GaN基LED芯片构成。 GaN基LED芯片包括透光基板和形成在透光基板上的GaN基半导体层，其中GaN基半导体层具有包含n型层，发光层和从透光性基板侧依次形成p型层，其中在p型层上形成正极，所述电极含有氧化物半导体的透光电极和与其连接的正极接触电极透光电极，正极接触电极的面积为p型层的上表面的面积的一半以下。

35. 发明授权

US08158990B2 Light emitting device using GaN LED chip 有权
标题翻译：发光器件采用GaN LED芯片
公开(公告)号：US08158990B2
公开(公告)日：2012-04-17
申请号：US12311548
申请日：2007-10-05
申请人： Takahide Joichi , Hiroaki Okagawa , Shin Hiraoka , Toshihiko Shima , Hirokazu Taniguchi
发明人： Takahide Joichi , Hiroaki Okagawa , Shin Hiraoka , Toshihiko Shima , Hirokazu Taniguchi
IPC分类号： H01L27/15
CPC分类号： H01L33/32 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/405 , H01L33/62 , H01L2224/16225 , H01L2224/32014 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device is constituted by flip-chip mounting a GaN-based LED chip. The GaN-based LED chip includes a light-transmissive substrate and a GaN-based semiconductor layer formed on the light-transmissive substrate, wherein the GaN-based semiconductor layer has a laminate structure containing an n-type layer, a light emitting layer and a p-type layer in this order from the light-transmissive substrate side, wherein a positive electrode is formed on the p-type layer, the electrode containing a light-transmissive electrode of an oxide semiconductor and a positive contact electrode electrically connected to the light-transmissive electrode, and the area of the positive contact electrode is half or less of the area of the upper surface of the p-type layer.
摘要翻译：发光器件通过倒装芯片安装GaN基LED芯片构成。 GaN基LED芯片包括透光基板和形成在透光基板上的GaN基半导体层，其中GaN基半导体层具有包含n型层，发光层和从透光性基板侧依次形成p型层，其中在p型层上形成正极，所述电极含有氧化物半导体的透光电极和与其连接的正极接触电极透光电极，正极接触电极的面积为p型层的上表面的面积的一半以下。

36. 发明申请

US20110120598A1 High-strength steel sheets with excellent resistance to delayed fracture after forming, method for manufacturing the same, and high-strength automotive part manufactured of the same 审中-公开
$High-strength steel sheets with excellent resistance to delayed fracture after forming, method for manufacturing the same, and high-strength automotive part manufactured of the same$
标题翻译：成形后的延迟断裂性优异的高强度钢板及其制造方法以及制造其的高强度汽车部件
公开(公告)号：US20110120598A1
公开(公告)日：2011-05-26
申请号：US12928310
申请日：2010-12-07
申请人： Toshiki Nonaka , Nobuhiro Fujita , Hirokazu Taniguchi
发明人： Toshiki Nonaka , Nobuhiro Fujita , Hirokazu Taniguchi
IPC分类号： C21D8/02 , C22C38/02
CPC分类号： C22C38/02 , C21D9/46 , C21D2211/00 , C21D2211/004 , C22C1/06 , C22C38/004 , C22C38/04 , C22C38/06 , C22C38/12 , C22C38/14 , C22C38/16
摘要： Steel sheets containing residual austenite of not more than 7 vol. %, crystallized and/or precipitated compounds with particle diameters of 0.01 to 5.0 μm of 100 to 100000 particle/mm2 and C of 0.05 to 0.3 mass %, Si of not more than 3.0 mass %, Mn of 0.01 to 3.0 mass %, P of not more than 0.02 mass %, S of not more than 0.02 mass %, Al of 0.01 to 3.0 mass %, N of not more than 0.01 mass % and Mg of 0.0002 to 0.01 mass %, with the remainder comprising iron and unavoidable impurities.
摘要翻译：钢板含残余奥氏体不超过7体积％％，粒径为0.01〜5.0μm的结晶化和/或析出的化合物为100〜100000个/ mm 2，C为0.05〜0.3质量％，Si：3.0质量％以下，Mn：0.01〜3.0质量％，P：为0.02质量％以下，S为0.01质量％以下且3.0质量％以下的Al为0.01质量％以下，Al为0.01质量％以下的Al为0.0002质量％以下且0.01质量％以下，其余为铁和不可避免的杂质。

37. 发明授权

US07922835B2 High strength steel sheet excellent in formability 有权
标题翻译：成型性优异的高强度钢板
公开(公告)号：US07922835B2
公开(公告)日：2011-04-12
申请号：US10560989
申请日：2003-06-24
申请人： Toshiki Nonaka , Hirokazu Taniguchi , Masaaki Mizutani , Nobuhiro Fujita
发明人： Toshiki Nonaka , Hirokazu Taniguchi , Masaaki Mizutani , Nobuhiro Fujita
IPC分类号： C22C38/02 , C22C38/06 , C22C38/04 , B32B15/01
CPC分类号： C22C38/02 , C21D8/0426 , C21D8/0473 , C21D9/48 , C21D2211/005 , C21D2211/008 , C22C38/04 , C22C38/06 , C22C38/12 , Y10T428/12757 , Y10T428/12799
摘要： A high strength steel sheet excellent in formability which has a chemical composition in mass %: C: 0.03 to 0.20%, Si: 0.005 to 0.3%, Mn: 1.0 to 3.1%, P: 0.001 to 0.06%, S: 0.001 to 0.01%, N: 0.0005 to 0.01%, Al: 0.2 to 1.2%, Mo≦0.5%, and the balance: Fe and inevitable impurities, with the proviso that the values of mass % for Si and Al satisfy the following formula (1): (0.0012×[objective value of TS]−0.29−[Si])/2.45
摘要翻译：化学组成为质量％：C：0.03〜0.20％，Si：0.005〜0.3％，Mn：1.0〜3.1％，P：0.001〜0.06％，S：0.001〜0.01的成型性优异的高强度钢板％，N：0.0005〜0.01％，Al：0.2〜1.2％，Mo＆NlE; 0.5％，余量为Fe和不可避免的杂质，条件是Si和Al的质量％的值满足下式（1）：（0.0012×[TS的目标值-0.29- [Si]）/ 2.45

38. 发明申请

US20090226918A1 Gene overexpressed in cancer 审中-公开
公开(公告)号：US20090226918A1
公开(公告)日：2009-09-10
申请号：US12384165
申请日：2009-04-01
申请人： Hiroyuki Aburatani , Yoshitaka Hippo , Hirokazu Taniguchi , Yong xin Chen , Shumpei Ishikawa , Shin-ichi Fukumoto , Takahiro Shimamura , Naoka Kamimura , Ying qiu Guo , Shogo Yamamoto , Yukio Ito , Hirotaka Ito , Toshihiko Ohtomo
发明人： Hiroyuki Aburatani , Yoshitaka Hippo , Hirokazu Taniguchi , Yong xin Chen , Shumpei Ishikawa , Shin-ichi Fukumoto , Takahiro Shimamura , Naoka Kamimura , Ying qiu Guo , Shogo Yamamoto , Yukio Ito , Hirotaka Ito , Toshihiko Ohtomo
IPC分类号： C12Q1/68 , C07K14/47 , C07K16/18 , C12N15/12 , C12N15/85 , C12N5/10 , G01N33/574
CPC分类号： C07K14/47 , C12Q1/6886 , C12Q2600/136
摘要： Disclosed are a protein encoded by a gene having a nucleotide sequence represented by any of SEQ ID NOs: 1 to 65 or a fragment thereof, an antibody recognizing the protein or antigen-binding fragment thereof, and a polynucleotide having a sequence comprising at least 12 consecutive nucleotides of a nucleotide sequence represented by any of SEQ ID NOs: 1 to 65 or a nucleotide sequence complementary thereto. The gene and the protein of the invention is useful for diagnosing and treating cancer.

39. 发明申请

US20080000555A1 High Strength Thin-Gauge Steel Sheet Excellent in Elongation and Hole Expandability and Method of Production of Same 审中-公开
标题翻译：高强度薄钢板，伸长率和孔膨胀性及其生产方法优异
公开(公告)号：US20080000555A1
公开(公告)日：2008-01-03
申请号：US11663581
申请日：2005-10-05
申请人： Toshiki Nonaka , Hirokazu Taniguchi , Koichi Goto
发明人： Toshiki Nonaka , Hirokazu Taniguchi , Koichi Goto
IPC分类号： C22C38/06 , C21D9/46
CPC分类号： C22C38/02 , B21B3/02 , C21D1/25 , C21D8/041 , C21D8/0426 , C21D8/0436 , C21D8/0473 , C21D9/46 , C21D2211/001 , C21D2211/002 , C21D2211/005 , C21D2211/008 , C22C38/001 , C22C38/002 , C22C38/005 , C22C38/04 , C22C38/06 , C22C38/12 , C22C38/14 , C22C38/18 , C22C38/22 , C22C38/26 , C22C38/28 , C22C38/32 , C22C38/38
摘要： The present invention provides high strength thin-gauge steel sheet with excellent elongation and hole expandability having a tensile strength of 500 MPa or more and a method of production of high strength thin-gauge steel sheet with excellent elongation and hole expandability enabling production of this on an industrial scale, that is, high strength thin-gauge steel sheet comprised of, by mass %, C: 0.03 to 0.25%, Si: 0.4 to 2.0%, Mn: 0.8 to 3.1%, P≦0.02%, S≦0.02%, Al≦2.0%, N≦0.01%, and a balance of Fe and unavoidable impurities and having a microstructure comprised of ferrite with an area fraction of 10 to 85% and residual austenite with a volume fraction of 1 to 10%, an area fraction of 10% to 60% of tempered martensite, and a balance of bainite.
摘要翻译：本发明提供了拉伸强度为500MPa以上的伸长率和孔扩展性优异的高强度薄钢板的制造方法以及具有优异的伸长率和扩孔性的高强度薄钢板的制造方法，工业规模，即以质量％计含有C：0.03〜0.25％，Si：0.4〜2.0％，Mn：0.8〜3.1％，P <0.02％，S < = 0.02％，Al≤2.0％，N≤0.01％，余量为Fe和不可避免的杂质，并且具有由面积分数为10〜85％的铁素体组成的微结构，体积分数为1〜 10％，回火马氏体的10％至60％的面积分数，以及贝氏体的余量。

40. 发明授权

US5393816A Rubber composition 失效
标题翻译：橡胶组成
公开(公告)号：US5393816A
公开(公告)日：1995-02-28
申请号：US988843
申请日：1992-12-10
申请人： Hitoshi Kondo , Hirokazu Taniguchi , Yuzo Sakai
发明人： Hitoshi Kondo , Hirokazu Taniguchi , Yuzo Sakai
IPC分类号： B29C33/72 , C08K3/00 , C08K5/053 , C08K5/06 , C08K5/17 , C08J5/10 , C08K5/54 , C08L7/00
CPC分类号： C08K5/06 , B29C33/722 , C08K3/0008 , C08K5/053 , C08K5/17
摘要： A rubber composition for cleaning a metal mold comprises a rubber, an aminoalcohol, a glycol, an adsorptive, and if desired, an organic silane of the formula, Z.sup.1 --Alk.sup.1 --S.sub.n --Alk.sup.2 --Z.sup.2 where Z.sup.1 and Z.sup.2 are --Si(R.sup.1) (R.sup.2)(R.sup.3) where R.sup.1, R.sup.2 and R.sup.3 are C.sub.1-4 alkoxy, Alk.sup.1 and Alk.sup.2 are C.sub.1 -C.sub.6 hydrocarbylene, n is 2-6, or an organic peroxide having a predetermined half-life due to decomposition.Metal molds are cleaned by bringing the above-mentioned rubber composition into contact with a surface of a dirtied metal mold and heating.
摘要翻译：用于清洁金属模的橡胶组合物包括橡胶，氨基醇，二醇，吸附剂，如果需要的话，有机硅烷，其中Z1和Z2是-Si（R1-Alk1-Sn-Alk2-Z2））（R2）（R3）其中R1，R2和R3是C1-4烷氧基，Alk1和Alk2是C1-C6亚烃基，n是2-6，或由于分解而具有预定的半衰期的有机过氧化物。通过使上述橡胶组合物与脏的金属模具的表面接触并加热来清洁金属模具。

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