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31. 发明授权

US6166011A FKBP inhibitors 失效
公开(公告)号：US6166011A
公开(公告)日：2000-12-26
申请号：US354193
申请日：1999-07-15
申请人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
发明人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
IPC分类号： C07D401/14 , A61K31/4184 , A61K31/423 , A61K31/428 , A61K31/445 , A61K31/5377 , A61P21/00 , A61P21/04 , A61P25/14 , A61P25/16 , A61P25/28 , A61P43/00 , C07D211/60 , C07D401/04 , C07D413/04 , C07D413/14 , C07D471/14 , A61K31/535
CPC分类号： C07D401/04 , A61K31/423 , A61K31/428 , C07D211/60 , C07D413/04 , C07D413/14 , C07D471/14
摘要： Compounds of formula (I), their salts and solvates, wherein the substituents are as described herein, are FKBP inhibitors. ##STR1##

32. 发明授权

US5244143A Apparatus and method for injection molding solder and applications thereof 失效
标题翻译：注射成型焊料的设备和方法及其应用
公开(公告)号：US5244143A
公开(公告)日：1993-09-14
申请号：US869676
申请日：1992-04-16
申请人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
发明人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
IPC分类号： B23K3/00 , B23K1/20 , B23K3/06 , B29C45/00 , H05K3/34
CPC分类号： B23K3/0607 , B23K1/20 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2224/111 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir for molten solder which is disposed over a cavity in an injection plate. The injection plate is disposed over a mold having an array of cavities therein into which solder in injection molded. The mold is disposed over a workpiece, such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity in the injection plate disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

33. 发明授权

US5242569A Thermocompression bonding in integrated circuit packaging 失效
标题翻译：集成电路封装中的热压接
公开(公告)号：US5242569A
公开(公告)日：1993-09-07
申请号：US664399
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.mm的强电负极电镀浴中镀金而制成。当前密度。提供用于电镀不同区域的电镀装置，具有不同的电负性条件，具有单独的独立供电的阳极。

34. 发明授权

US08519867B2 Method and system for reducing transmitter power consumption while avoiding delay of displayed information 有权
标题翻译：减少发射机功耗同时避免显示信息延迟的方法和系统
公开(公告)号：US08519867B2
公开(公告)日：2013-08-27
申请号：US12977675
申请日：2010-12-23
申请人： Michael J. Palmer , Matthew Grubis
发明人： Michael J. Palmer , Matthew Grubis
IPC分类号： G08C19/16
CPC分类号： A61B5/0002 , A61B5/0006 , A61B2560/0209
摘要： The system and method of the present application includes a wireless transmitter adapted to receive physiological signals from a patient and to wirelessly transmit the physiological signals to a receiver, where a display device prepares the physiological signal for display on a display monitor. In one embodiment, both the wireless transmitter and receiver further include an estimation algorithm module. The estimation algorithm module in each of the wireless transmitter and the receiver calculate a physiological signal based on a collected signal. The system displays the calculated, estimated signal unless the error of the estimated signal reaches a predetermined threshold. When the estimated signal is being displayed, no transmission from the wireless transmitter is necessary.
摘要翻译：本申请的系统和方法包括适于从患者接收生理信号并将生理信号无线传送到接收器的无线发射器，其中显示装置准备生理信号以在显示监视器上显示。在一个实施例中，无线发射机和接收机都包括估计算法模块。每个无线发射机和接收机中的估计算法模块基于收集的信号计算生理信号。系统显示计算的估计信号，除非估计信号的误差达到预定的阈值。当估计信号被显示时，不需要来自无线发射机的传输。

35. 发明授权

US06828910B2 Apparatus for monitoring gas concentrations 有权
标题翻译：用于监测气体浓度的装置
公开(公告)号：US06828910B2
公开(公告)日：2004-12-07
申请号：US10417040
申请日：2003-04-16
申请人： Patrick Allen VanRyzin , Michael J. Palmer , Darrell E. Johnson , William James Sheets
发明人： Patrick Allen VanRyzin , Michael J. Palmer , Darrell E. Johnson , William James Sheets
IPC分类号： G08B2300
CPC分类号： A61B5/0836 , A61B5/097 , A61B2560/04 , A61B2560/0443 , A61M16/021 , A61M2016/0413 , A61M2230/43 , A61M2230/432
摘要： A patient monitoring system has a patient monitor with a screen and mainstream gas input connector configured to receive a mainstream gas concentration signal from a mainstream gas analyzer. A sidestream gas analyzer has an output connector and is configured to transmit a sidestream gas concentration signal via the output connector. The patient monitor receives the sidestream gas concentration signal via the mainstream gas input connector for display on the screen.
摘要翻译：患者监测系统具有患者监护仪，其具有屏幕和主流气体输入连接器，其构造成从主流气体分析仪接收主流气体浓度信号。旁路气体分析仪具有输出连接器，并且被配置为通过输出连接器传输侧流气体浓度信号。病人监护仪通过主流气体输入连接器接收侧流气体浓度信号，以便在屏幕上显示。

36. 发明授权

US06686357B1 FKBP inhibitors 失效
公开(公告)号：US06686357B1
公开(公告)日：2004-02-03
申请号：US09699752
申请日：2000-10-30
申请人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
发明人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
IPC分类号： A61K31535
CPC分类号： C07D211/60 , A61K31/423 , A61K31/428 , C07D401/04 , C07D413/04 , C07D413/14 , C07D471/14
摘要： Compounds of formula (I), their salts and solvates, wherein the substituents are as described herein, are FKBP inhibitors.

37. 发明授权

US06591135B2 Portable patient monitor with defibrillator/pacemaker interface and battery power management 失效
标题翻译：带除颤器/起搏器接口和电池电源管理的便携式患者监护仪
公开(公告)号：US06591135B2
公开(公告)日：2003-07-08
申请号：US09835459
申请日：2001-04-16
申请人： Michael J. Palmer , James M. Gray , David L. Schieble , Alan E. Clapp , Brian Bayer , Wilfried Loehning , Andreas Schulz , Horst Schlosser
发明人： Michael J. Palmer , James M. Gray , David L. Schieble , Alan E. Clapp , Brian Bayer , Wilfried Loehning , Andreas Schulz , Horst Schlosser
IPC分类号： A61N118
CPC分类号： A61N1/37 , A61B5/04 , A61N1/378 , A61N1/39 , A61N1/3975
摘要： A method and apparatus are provided for distributing power within a cardiac treatment and monitoring system which includes a defibrillator releasably coupled to a patient monitoring unit. The method includes the steps of determining a battery reserve capacity within the patient monitoring unit and distributing power from the patient monitoring system to a defibrillator when the determined battery reserve capacity exceeds a threshold value.
摘要翻译：提供了一种用于在心脏治疗和监测系统内分配功率的方法和装置，其包括可释放地联接到患者监测单元的除颤器。该方法包括以下步骤：当所确定的电池储备容量超过阈值时，确定患者监测单元内的电池储备容量并将电力从患者监测系统分配到除颤器。

38. 发明授权

US06495549B1 FKBP inhibitors 失效
标题翻译： FKBP抑制剂
公开(公告)号：US06495549B1
公开(公告)日：2002-12-17
申请号：US09699878
申请日：2000-10-30
申请人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
发明人： Martin J. Wythes , Michael J. Palmer , Mark I. Kemp , Malcolm C. MacKenny , Robert J. Maguire , James F. Blake, Jr.
IPC分类号： A61K31535
CPC分类号： C07D211/60 , A61K31/423 , A61K31/428 , C07D401/04 , C07D413/04 , C07D413/14 , C07D471/14
摘要： Compounds of formula (I), their salts and solvates, wherein the substituents are as described herein, are FKBP inhibitors.
摘要翻译：式（I）化合物，其盐和溶剂化物，其中取代基如本文所述，是FKBP抑制剂。

39. 发明授权

US5132351A Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent 失效
标题翻译：包含金属盐，聚苯醚和溶剂的化学焊料
公开(公告)号：US5132351A
公开(公告)日：1992-07-21
申请号：US728865
申请日：1991-07-11
申请人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
发明人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
IPC分类号： B23K1/00 , B23K35/22 , B23K35/34 , B23K101/40 , H05K3/10 , H05K3/34
CPC分类号： B23K35/34 , H05K3/3484 , H05K2203/121 , H05K3/105 , Y10T29/49169
摘要： A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

40. 发明授权

US5120418A Lead frame plating apparatus for thermocompression bonding 失效
标题翻译：用于热塑性接合的导线框架镀膜设备
公开(公告)号：US5120418A
公开(公告)日：1992-06-09
申请号：US664388
申请日：1991-03-04
申请人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
发明人： Sung K. Kang , Michael J. Palmer , Timothy C. Reiley , Robert D. Topa
IPC分类号： B23K20/02 , B23K20/233 , B23K33/00 , H01L21/603
CPC分类号： H01L24/80 , B23K20/023 , B23K20/233 , B23K33/00 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14
摘要： A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.
摘要翻译：用于集成电路封装中的热压接的接触构件在导体端具有均匀的织构可变形层，硬度值在Knoop尺度上大约为90的软金的范围内，粗糙的表面形态具有大约 1微米调制频率和脊之间的深度为平均集成电路板的1/4至1/2。可变形层通过在0.03-0.05mA / sq.cm范围内的强电负电镀浴中镀金而制成。当前密度。提供了用于电镀不同区域的电镀装置，具有不同的电负性条件，具有独立供电的阳极。

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