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31. 发明授权

US06589810B1 BGA package and method of fabrication 有权
公开(公告)号：US06589810B1
公开(公告)日：2003-07-08
申请号：US09546706
申请日：2000-04-10
申请人： Walter Moden
发明人： Walter Moden
IPC分类号： H01L2144
CPC分类号： H01L23/49838 , H01L21/561 , H01L21/563 , H01L23/3114 , H01L23/4951 , H01L23/49572 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05124 , H01L2224/05155 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/16237 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dense grid pattern, and an encapsulating resin encapsulating the die and conductors. The package is fabricated using a lead frame having lead fingers that form the conductors. The die is back bonded to a polymer tape placed across the lead fingers, and then wire bonded to bonding pads on the conductors. In addition, the encapsulating resin is molded to include openings for the ball contacts which are aligned with the ball bonding pads. An alternate embodiment BGA package includes a polymer substrate adhesively bonded to a face of the die. The polymer substrate includes conductors having beam leads aligned with an opening through the polymer substrate. The opening provides access for a bonding tool for bonding bumps on the beam leads to bond pads on the die.

32. 发明授权

US06179659B2 Electrical contact device and associated method of manufacture 有权
标题翻译：电接点装置及相关制造方法
公开(公告)号：US06179659B2
公开(公告)日：2001-01-30
申请号：US09132248
申请日：1998-08-11
申请人： Walter Moden
发明人： Walter Moden
IPC分类号： H01R1340
CPC分类号： H01R13/2435 , H01R13/2442 , H01R13/405 , H01R43/24 , Y10T29/49121 , Y10T29/4914 , Y10T29/49146 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222 , Y10T29/53178 , Y10T29/53183
摘要： The invention provides an electrical contact device, a pre-assembly for producing the electrical contact device, and a method of forming the electrical contact device. The electrical contact device includes a plurality of fine pitch electrical leads disposed in parallel spaced apart relation. An insulating member encapsulates portions of the electrical leads which extend from opposite sides of the insulating member. The insulating member retains the electrical leads in position and electrically isolated from one another. The contact device is used to facilitate connection with the leads of an IC package.
摘要翻译：本发明提供一种电接触装置，用于制造电接触装置的预组件以及形成电接触装置的方法。电接触装置包括以平行隔开的关系设置的多个细间距电引线。绝缘构件封装从绝缘构件的相对侧延伸的电引线的部分。绝缘构件将电引线保持在适当位置并且彼此电隔离。该接触装置用于促进与IC封装的引线的连接。

33. 发明授权

US6095822A Component module holder 失效
标题翻译：组件模块座
公开(公告)号：US6095822A
公开(公告)日：2000-08-01
申请号：US6395
申请日：1998-01-13
申请人： David J. Corisis , Larry D. Kinsman , Walter Moden
发明人： David J. Corisis , Larry D. Kinsman , Walter Moden
IPC分类号： H01L23/32 , H01L25/10 , H05K3/30 , H01R9/09
CPC分类号： H01L23/32 , H01R12/7023 , H01R12/714 , H05K3/301 , H01L25/105 , H01L2924/0002 , H01L2924/09701
摘要： A component module holder is adapted to hold a plurality of integrated circuit devices in alignment with one another in a way that enables the devices to be directly plugged to a printed circuit board. In this condition, the holder is secured to said printed circuit board with the contacts on said integrated circuit devices making contacts with appropriate contacts on the printed circuit board. This direct contact between the packaged integrated circuit device leads and a board may reduce the die bond pad to board pad stub length, improving speed. This arrangement may also allow the integrated circuit devices to be replaced and upgraded as a whole as needed. The holder may be utilized, for example, to upgrade system integrated circuit devices in computer systems by providing a plurality of connected, integrated circuit dynamic random access memory elements directly pluggable onto a computer system motherboard.
摘要翻译：组件模块保持器适于将多个集成电路设备彼此对准，使得设备能够直接插入印刷电路板。在这种情况下，保持器被固定到所述印刷电路板上，所述集成电路装置上的触点与印刷电路板上的适当触点接触。封装的集成电路器件引线和电路板之间的这种直接接触可以将管芯接合焊盘减小到板焊盘短截线长度，从而提高速度。这种安排还可以根据需要整体地替换和升级集成电路设备。例如，可以通过提供可以直接插到计算机系统主板上的多个连接的集成电路动态随机存取存储器元件来将保持器用于例如升级计算机系统中的系统集成电路装置。

34. 发明申请

US20060252180A1 Method for a low profile multi-IC chip package connector 审中-公开
标题翻译：低配置多芯片芯片封装连接器的方法
公开(公告)号：US20060252180A1
公开(公告)日：2006-11-09
申请号：US11479712
申请日：2006-06-30
申请人： Walter Moden , Jerrold King , Jerry Brooks
发明人： Walter Moden , Jerrold King , Jerry Brooks
IPC分类号： H01L21/00
CPC分类号： H05K1/181 , H01L25/105 , H01L2225/1029 , H01L2225/1064 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H05K1/145 , H05K1/147 , H05K2201/049 , H05K2201/10515 , H05K2201/10689 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49169 , H01L2924/00
摘要： A method for a low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.
摘要翻译：用于高速应用的低轮廓多IC芯片封装的方法包括用于电连接一组堆叠的初级半导体封装的等效外引线的连接器。在一个实施例中，连接器包括两部分柔性绝缘聚合物片，其一端形成有总线。在另一个实施例中，连接器包括由导电聚合物形成的多个总线。在另外的实施例中，初级封装堆叠在保持架内并且使它们的外部引线与保持架内的总线不连接地接触，或者替代地直接固定到主电路板上的引线或焊盘上。

35. 发明申请

US20050253243A1 Semiconductor device structure with adhesion-enhanced semiconductor die 审中-公开
标题翻译：半导体器件结构具有粘附增强半导体芯片
公开(公告)号：US20050253243A1
公开(公告)日：2005-11-17
申请号：US11188157
申请日：2005-07-22
申请人： Jerrold King , J. Brooks , Walter Moden
发明人： Jerrold King , J. Brooks , Walter Moden
IPC分类号： H01L23/31 , H01L23/495
CPC分类号： H01L23/3142 , H01L23/4951 , H01L24/48 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/0102 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , Y10S438/926 , Y10S438/928 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor die includes a substantially oxide-free metal layer on at least a portion of a surface thereof. The substantially oxide-free metal may enhance adhesion of a packaging material, or mold compound, to the semiconductor die, prevent the occurrence of voids or presence of moisture between the packaging material and the adjacent surface of the semiconductor die, or otherwise prevent delamination of the packaging material from the adjacent surface of the semiconductor die. The substantially oxide-free metal may be copper, palladium, another substantially oxide-free metal, or a combination of substantially oxide-free metals.
摘要翻译：半导体管芯在其表面的至少一部分上包括基本上无氧化物的金属层。基本上不含氧化物的金属可以增强包装材料或模塑料对半导体管芯的粘合性，防止在包装材料和半导体管芯的相邻表面之间产生空隙或存在湿气，或以其它方式防止来自半导体管芯的相邻表面的包装材料。基本上无氧化物的金属可以是铜，钯，另一种基本上不含氧化物的金属，或基本上不含氧化物的金属的组合。

36. 发明申请

US20050007806A1 Apparatus and method for mounting microelectronic devices on a mirrored board assembly 有权
标题翻译：将微电子器件安装在镜像板组件上的装置和方法
公开(公告)号：US20050007806A1
公开(公告)日：2005-01-13
申请号：US10910979
申请日：2004-08-03
申请人： Chris Martin , Brent Keeth , Brian Johnson , Walter Moden
发明人： Chris Martin , Brent Keeth , Brian Johnson , Walter Moden
IPC分类号： G11C5/00 , H05K1/18 , G11C7/00
CPC分类号： H05K1/181 , G11C5/04 , G11C5/06 , H05K1/112 , H05K2201/09409 , H05K2201/10159 , H05K2201/10545 , H05K2201/10689 , Y02P70/611
摘要： The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to the controller, the module including a pair of memory devices oppositely positioned on respective surfaces of a substrate and interconnected by members extending through the substrate that couple terminals of the devices, the terminals being selected to include a group of terminals that are configured to communicate functionally compatible signals.
摘要翻译：本发明涉及一种用于形成微电子存储器件的系统，模块以及装置和方法。在一个实施例中，系统包括处理器和耦合到处理器的控制器，其中至少一个存储器模块耦合到控制器，该模块包括一对存储器件，其相对地定位在衬底的相应表面上并且通过延伸穿过耦合器件的端子的基板，所述端子被选择为包括被配置为传送功能兼容的信号的一组端子。

37. 发明申请

US20050007745A1 Reduced-sized memory card package, length-extending, adaptor and method of forming adaptor 失效
标题翻译：减小尺寸的存储卡封装，长度延长，适配器和形成适配器的方法
公开(公告)号：US20050007745A1
公开(公告)日：2005-01-13
申请号：US10911847
申请日：2004-08-03
申请人： Derek Gochnour , Walter Moden , Michael Morrison
发明人： Derek Gochnour , Walter Moden , Michael Morrison
IPC分类号： H01R31/06 , H05K1/00
CPC分类号： G06K19/07739 , H01R12/721 , H01R31/06
摘要： An apparatus and method of removably interconnecting a reduced-sized memory card with an extension member. A locking mechanism may be formed in a peripheral end portion of the reduced-sized memory card that may include an entry surface and a ledge. The extension member may include a biasing portion that slidably engages the entry surface and removable interconnects with the ledge. With this arrangement, the extension member may easily be secured and removed from the reduced-sized memory card, allowing easy interchangeability between a standard-sized socket of one electronic device and a reduced-sized socket of another electronic device.
摘要翻译：一种可拆卸地将小型存储卡与扩展构件互连的装置和方法。可以在缩小尺寸的存储卡的外围端部中形成锁定机构，该外围端部可以包括入口表面和突出部。延伸构件可以包括可滑动地接合进入表面的偏置部分和与凸缘的可移除的互连。通过这种布置，扩展构件可以容易地从减小尺寸的存储卡中被固定和移除，从而允许一个电子设备的标准尺寸的插座与另一个电子设备的小型插座之间的容易的互换性。

38. 发明授权

US06506625B1 Semiconductor package having stacked dice and leadframes and method of fabrication 有权
公开(公告)号：US06506625B1
公开(公告)日：2003-01-14
申请号：US09844134
申请日：2001-04-30
申请人： Walter Moden
发明人： Walter Moden
IPC分类号： H01L2144
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4917 , H01L2224/73215 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/01026 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and wire bonded to separate leadframe segments. A first leadframe segment includes lead fingers configured to support a first semiconductor die of the stacked pair, and to form terminal leads of the package. A second leadframe segment is attached to the first leadframe segment, and includes lead fingers that support a second semiconductor die of the stacked pair. The lead fingers of the second leadframe are in physical and electrical contact with the leadfingers of the first leadframe. In addition, tip portions of the lead fingers of the first leadframe segment are staggered relative to tip portions of the lead fingers of the second leadframe segment to provide space for bond wires. The lead fingers support the dice during encapsulation, and also provide a heat conductive path for transferring heat from the dice during operation. The package can be constructed using lead-on-chip leadframes and conventional semiconductor packaging equipment.

39. 发明授权

US06310390B1 BGA package and method of fabrication 有权
标题翻译： BGA封装及其制造方法
公开(公告)号：US06310390B1
公开(公告)日：2001-10-30
申请号：US09288423
申请日：1999-04-08
申请人： Walter Moden
发明人： Walter Moden
IPC分类号： H01C23495
CPC分类号： H01L23/49838 , H01L21/561 , H01L21/563 , H01L23/3114 , H01L23/4951 , H01L23/49572 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05124 , H01L2224/05155 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/16237 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dense grid pattern, and an encapsulating resin encapsulating the die and conductors. The package is fabricated using a lead frame having lead fingers that form the conductors. The die is back bonded to a polymer tape placed across the lead fingers, and then wire bonded to bonding pads on the conductors. In addition, the encapsulating resin is molded to include openings for the ball contacts which are aligned with the ball bonding pads. An alternate embodiment BGA package includes a polymer substrate adhesively bonded to a face of the die. The polymer substrate includes conductors having beam leads aligned with an opening through the polymer substrate. The opening provides access for a bonding tool for bonding bumps on the beam leads to bond pads on the die.
摘要翻译：提供一种BGA封装和一种制造该封装的方法。该封装包括半导体管芯，与导体上的接合焊盘接合的内部导体导线，以致密栅格图案形成在导体上的球形接合焊盘附着的外部球形触点以及封装芯片和导体的封装树脂。使用具有形成导体的引线指的引线框来制造封装。将模具背面粘合到横跨引线指状物放置的聚合物带上，然后将引线键合到导体上的接合焊盘。此外，封装树脂被模制成包括与球接触垫对准的球接触开口。一种替代实施方案BGA封装包括粘合到模具的表面上的聚合物基底。聚合物基板包括具有与通过聚合物基板的开口对准的光束引线的导体。该开口提供用于将梁引线上的凸块与模具上的接合焊盘接合的接合工具。

40. 发明授权

US06303981B1 Semiconductor package having stacked dice and leadframes and method of fabrication 失效
标题翻译：具有堆叠骰子和引线框架的半导体封装及其制造方法
公开(公告)号：US06303981B1
公开(公告)日：2001-10-16
申请号：US09388323
申请日：1999-09-01
申请人： Walter Moden
发明人： Walter Moden
IPC分类号： H01L23495
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06136 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4917 , H01L2224/73215 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/01026 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and wire bonded to separate leadframe segments. A first leadframe segment includes lead fingers configured to support a first semiconductor die of the stacked pair, and to form terminal leads of the package. A second leadframe segment is attached to the first leadframe segment, and includes lead fingers that support a second semiconductor die of the stacked pair. The lead fingers of the second leadframe are in physical and electrical contact with the leadfingers of the first leadframe. In addition, tip portions of the lead fingers of the first leadframe segment are staggered relative to tip portions of the lead fingers of the second leadframe segment to provide space for bond wires. The lead fingers support the dice during encapsulation, and also provide a heat conductive path for transferring heat from the dice during operation. The package can be constructed using lead-on-chip leadframes and conventional semiconductor packaging equipment.
摘要翻译：提供一种半导体封装以及一种制造该封装的方法。封装包括一个塑料体和一对封装在塑料体中的堆叠的半导体芯片，以及引线接合到分离的引线框架段。第一引线框段包括构造成支撑堆叠对的第一半导体管芯并且形成封装的端子引线的引线。第二引线框架段附接到第一引线框架段，并且包括支撑堆叠对的第二半导体管芯的引线指。第二引线框的引线指与第一引线框的引线脚物理和电接触。此外，第一引线框架段的引线指尖的尖端部分相对于第二引线框架引线的尖端部分交错，以提供接合线的空间。引导指在封装期间支撑骰子，并且还提供用于在操作期间从骰子传递热量的导热路径。封装可以使用片上引线框架和常规半导体封装设备构建。

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