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31. 发明申请

US20100186891A1 NIR-INERT SUBSTRATES COMPRISING BIS-OXODIHYDROINDOLYLEN-BENZODIFURANONES 审中-公开
标题翻译：包含双 - 二氧杂环己烷二苯并呋喃酮的近红外基质
公开(公告)号：US20100186891A1
公开(公告)日：2010-07-29
申请号：US12669049
申请日：2008-07-16
申请人： Thomas Ruch , Philippe Bugnon , Paul Brown , Véronique Hall-Goulle
发明人： Thomas Ruch , Philippe Bugnon , Paul Brown , Véronique Hall-Goulle
IPC分类号： B32B37/06 , C08K5/00 , B32B5/16 , B32B9/04 , B32B15/04 , B32B3/10 , B32B1/02 , B05D5/00 , C08K5/3417 , C07D405/14
CPC分类号： C08K5/3417 , B05D5/06 , B05D7/52 , B32B37/04 , B32B37/182 , B32B38/0008 , C07D493/04 , C09B57/00 , C09B67/0013 , C09D5/028 , C09D5/035 , C09D7/41 , C09D11/037 , C09D11/18 , C09D11/322 , Y10T428/13 , Y10T428/1372 , Y10T428/24802 , Y10T428/25 , Y10T428/31504 , Y10T428/31678
摘要： A method for producing infra-red inert substrates, including moulded polymeric articles, films, fibers and coatings and other organic and inorganic materials, by incorporating into the substrate or onto the surface of the substrate an effective amount of a dispersed bis-oxodihydroindolylen-benzodifuranone colourant. The thus obtained, also claimed substrates so produced are reflective and transparent to much of the near infra red radiation not reflected. There are multiple applications for cases of devices comprising electronic components, outdoor construction elements, outdoor furniture, automotive, marine or aerospace parts, laminates, artificial leather or textile materials, as well as in polychrome printing processes and optical fibers. The thus obtained substrates can also be subjected to laser welding. New bis-oxo-dihydroindolylen-benzodifuranone compounds are also claimed.
摘要翻译：一种生产红外惰性基质的方法，包括模制的聚合物制品，薄膜，纤维和涂料以及其它有机和无机材料，通过将底物或基材表面掺入有效量的分散的双氧代二氢茚二酮 - 苯并二呋喃酮着色剂如此获得的，也要求保护的如此制造的基板对于大多数未被反射的近红外辐射是反射和透明的。对于包括电子部件，室外结构元件，户外家具，汽车，海洋或航空零件，层压板，人造革或纺织材料以及多色印刷工艺和光纤的装置的情况，存在多种应用。由此获得的基板也可以进行激光焊接。还要求保护新的双 - 氧代 - 二氢吲哚 - 苯并二呋喃酮化合物。

32. 发明授权

US07738259B2 Shared via decoupling for area arrays components 失效
标题翻译：通过区域阵列组件的去耦共享
公开(公告)号：US07738259B2
公开(公告)日：2010-06-15
申请号：US10761343
申请日：2004-01-22
申请人： Alex L. Chan , Paul Brown , Charles M. Elliott
发明人： Alex L. Chan , Paul Brown , Charles M. Elliott
IPC分类号： H05K7/00
CPC分类号： H05K1/0231 , H05K1/112 , H05K2201/10545 , H05K2201/10636 , H05K2201/10734 , Y02P70/611
摘要： A solution for mounting decoupling capacitors on a printed wiring board (PWB) used for mounting a high performance ball grid array (BGA) device is described. The via array that connects the BGA device is modified, the modification being that at least a portion of one row of said vias array is missing at least two adjacent vias. The missing vias are replaced by respective shared vias in an adjacent row, and the shared vias are connected to either a power supply or a power return. The shared vias are also provided with via pads on the other side of said PWB, and a decoupling capacitor can be electrically connected across the pair of via pads to decouple the power supply and the power return at the two adjacent vias.
摘要翻译：描述了在用于安装高性能球栅阵列（BGA）设备的印刷电路板（PWB）上安装去耦电容的解决方案。连接BGA器件的通孔阵列被修改，修改是所述通孔阵列的一行的至少一部分缺少至少两个相邻的通孔。缺失的通孔被相邻行中的相应共享通孔替换，并且共享通孔连接到电源或电源回路。共享通孔还设置有在所述PWB的另一侧上的通孔焊盘，并且去耦电容器可以跨越所述一对通孔焊盘电连接，以在两个相邻通孔处去耦合电源和功率返回。

33. 发明申请

US20080232911A1 METHOD AND ASSEMBLY FOR ROTATING A CUTTING INSERT DURING A TURNING OPERATION AND INSERTS USED THEREIN 审中-公开
标题翻译：用于旋转切削刀片的方法和装配在其中使用切削刀片和刀片
公开(公告)号：US20080232911A1
公开(公告)日：2008-09-25
申请号：US12053749
申请日：2008-03-24
申请人： Gregory A. Hyatt , Adam South , Ruy Frota de Souza Filho , Paul Brown , Linn Andras , Ted R. Massa
发明人： Gregory A. Hyatt , Adam South , Ruy Frota de Souza Filho , Paul Brown , Linn Andras , Ted R. Massa
IPC分类号： B26D1/00 , B23B7/00
CPC分类号： B23B1/00 , B23B27/12 , B23B27/1603 , B23B31/4006 , B23B2200/0438 , B23B2200/0461 , B23B2200/081 , B23B2200/161 , B23B2200/204 , B23B2205/12 , B23B2260/042 , B23B2265/16 , Y10T82/2529 , Y10T407/23 , Y10T407/235
摘要： A cutting insert rotated about its axis may be utilized during a metalworking operation and applied against the rotating workpiece to enhance tool performance. A method, including an assembly with a rotatable insert mounted to a toolholder may be utilized to achieve this result.
摘要翻译：在金属加工操作期间可以利用围绕其轴线旋转的切削刀片，并且相对于旋转工件施加加强刀具性能。可以使用包括具有安装到刀夹的可旋转刀片的组件的方法来实现该结果。

34. 发明申请

US20080001113A1 VALVE DOOR WITH BALL COUPLING 有权
标题翻译：阀门与球连接
公开(公告)号：US20080001113A1
公开(公告)日：2008-01-03
申请号：US11767518
申请日：2007-06-24
申请人： SAM HYUNGSAM KIM , Jae-Chull Lee , William N. Sterling , Paul Brown
发明人： SAM HYUNGSAM KIM , Jae-Chull Lee , William N. Sterling , Paul Brown
IPC分类号： F16K1/16
CPC分类号： F16K51/02 , F16K1/2007 , F16K1/2021 , F16K1/2028 , F16K1/205 , F16K1/2078 , F16K1/24
摘要： Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.
摘要翻译：提供了用于密封腔室中的基底输送通道的装置的实施例。在一个实施例中，用于密封腔室中的衬底传送通道的设备包括通过球窝接头联接到致动器的细长门构件。球形接头构造成允许门构件相对于杠杆臂围绕球窝接头的中心移动。在一个实施例中，细长门的密封面是弯曲的。在另一个实施例中，该腔室是化学气相沉积室，负载锁定室，计量室，热处理室或物理蒸汽分配室，负载锁定室，衬底传送室或真空室之一。

35. 发明申请

US20070138701A1 Injection molding utilizing base-wall-section flow guides 有权
标题翻译：使用基壁部分导流管的注射成型
公开(公告)号：US20070138701A1
公开(公告)日：2007-06-21
申请号：US11705388
申请日：2007-02-12
申请人： Paul Brown , Jens Sorensen
发明人： Paul Brown , Jens Sorensen
IPC分类号： B29C45/00 , B29C45/37 , B29C45/80
CPC分类号： B29C45/80 , B29C45/0046 , B29C45/33 , B29C45/376 , B29C2945/76006 , B29C2945/7626 , B29C2945/76381 , B29C2945/76568 , B29C2945/76742 , B29C2945/76859 , B29C2945/76933 , B29L2031/7132
摘要： During injection molding of a plastic product having a base wall and a sidewall, fluid plastic material is injected into a base-wall section of a mold cavity. The base-wall section of the mold cavity includes at least one flow guide that is defined by a first mold part, a second mold part, and a third mold part that is movable relative to the first and second mold parts to either decrease or increase the conduction of injected plastic material through the at least one flow guide. Conduction within the at-least-one flow guide is adjusted dynamically while the injected plastic material is being conducted into the sidewall section of the mold cavity by moving the movable third mold part in response to sensed variations in injection pressures in different portions of the sidewall section of the mold cavity.
摘要翻译：在具有底壁和侧壁的塑料制品的注射成型过程中，将流体塑料材料注入模腔的底壁部分。模腔的底壁部分包括由第一模具部件，第二模具部件和第三模具部件限定的至少一个流动引导件，第一模具部件和第三模具部件可相对于第一和第二模具部件移动以减少或增加注射的塑料材料通过至少一个流动引导件的传导。动态地调节至少一个流动引导件内的传导，同时注入的塑料材料通过响应于在侧壁的不同部分中的感测到的注入压力的变化而移动可移动的第三模具部件而被引导到模具腔的侧壁部分模腔的截面。

36. 发明申请

US20070034405A1 Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) 失效
标题翻译：使用微孔的行/列在BGA互连网格（微通道）中创建PCB布线通道
公开(公告)号：US20070034405A1
公开(公告)日：2007-02-15
申请号：US11200041
申请日：2005-08-10
申请人： Paul Brown
发明人： Paul Brown
IPC分类号： H05K1/11
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H05K1/114 , H05K3/429 , H05K2201/09227 , H05K2201/09509 , H05K2201/10734 , H01L2924/00
摘要： A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the second and subsequent internal layers of the board between selected rows or columns of through-board vias used to connect the remaining contacts and a BGA package adapted to be used with the printed circuit board.
摘要翻译：一种具有微通孔的印刷电路板，用于将所选行或列中的触点的一部分连接到电路板的第一内层，从而在所选行或列之间的板的第二和随后的内层上创建路由通道用于连接剩余触点的通孔通孔和适合与印刷电路板一起使用的BGA封装。

37. 发明申请

US20060294328A1 Memory micro-tiling request reordering 有权
标题翻译：内存微贴请求重新排序
公开(公告)号：US20060294328A1
公开(公告)日：2006-12-28
申请号：US11159741
申请日：2005-06-23
申请人： James Akiyama , William Clifford , Paul Brown
发明人： James Akiyama , William Clifford , Paul Brown
IPC分类号： G06F13/28
CPC分类号： G06F13/1626 , G06F13/1684 , G09G5/393 , G09G2360/122 , G09G2360/125
摘要： According to one embodiment, a memory controller is disclosed. The memory controller includes assignment logic, a reorder table and a transaction assembler. The assignment logic receives a request to access a memory channel and assigns the request to access one of two or more independently addressable subchannels within the channel. The reorder table includes two or more table elements. Each table element includes a shared address component and an independent address component corresponding to each of the two or more independently addressable subchannels. The transaction assembler combines the shared and independent address components in a reorder table element and issue a single memory transaction.
摘要翻译：根据一个实施例，公开了一种存储器控制器。存储器控制器包括分配逻辑，重排序表和事务汇编器。分配逻辑接收访问存储器通道的请求，并分配请求以访问通道内的两个或更多个可独立寻址的子信道中的一个。重排序表包括两个或多个表元素。每个表格元素包括共享地址组件和对应于两个或更多个可独立寻址的子信道中的每一个的独立地址组件。事务汇编器将重新排序表元素中的共享和独立地址组件合并并发出单个内存事务。

38. 发明申请

US20050216228A1 Method and system for correcting a fault in a semiconductor manufacturing system 审中-公开
标题翻译：用于校正半导体制造系统中的故障的方法和系统
公开(公告)号：US20050216228A1
公开(公告)日：2005-09-29
申请号：US10799879
申请日：2004-03-15
申请人： Eric Kauffman , Paul Brown
发明人： Eric Kauffman , Paul Brown
IPC分类号： G05B19/418 , H01L21/66 , G06F17/60
CPC分类号： H01L22/20 , G05B19/4184 , G05B2219/31357 , G05B2219/32408 , G05B2219/45031 , G06Q10/06 , G06Q10/0637 , G06Q10/20 , H01L2924/0002 , Y02P90/14 , H01L2924/00
摘要： A method and system for correcting a fault in a semiconductor manufacturing system is described. Fault correction for a service component is achieved using an interactive case study with a service operator. The interactive case study can identify one or more cases where the current service activity data substantially matches past service activity data, and utilize this correlation to assist the service operator in conducting the service component repair. If necessary, the interactive case study can identify one or more tests to perform in order to narrow down the number of matching cases. As tests are performed and results are retrieved by the interactive case study, the number of matching cases is reduced. For instance, the interactive case study can assist in identifying a manufacturing system part to replace in a manufacturing system tool in order to correct the problem.
摘要翻译：描述了用于校正半导体制造系统中的故障的方法和系统。使用与服务运营商的交互式案例研究来实现服务组件的故障校正。交互式案例研究可以识别当前服务活动数据与过去的服务活动数据基本一致的一种或多种情况，并且利用该相关性来帮助服务操作者进行服务组件修复。如果需要，交互式案例研究可以识别要执行的一个或多个测试，以缩小匹配案例的数量。随着测试的进行和交互案例研究检索结果，减少了匹配案例的数量。例如，交互式案例研究可以帮助识别在制造系统工具中替换的制造系统部件，以便纠正问题。

39. 发明申请

US20050162839A1 Shared via decoupling for area arrays components 失效
标题翻译：通过区域阵列组件的去耦共享
公开(公告)号：US20050162839A1
公开(公告)日：2005-07-28
申请号：US10761343
申请日：2004-01-22
申请人： Alex Chan , Paul Brown , Charles Elliott
发明人： Alex Chan , Paul Brown , Charles Elliott
IPC分类号： H05K1/02 , H05K1/11 , H05K7/06
CPC分类号： H05K1/0231 , H05K1/112 , H05K2201/10545 , H05K2201/10636 , H05K2201/10734 , Y02P70/611
摘要： A solution for mounting decoupling capacitors on a printed wiring board (PWB) used for mounting a high performance ball grid array (BGA) device is described. The via array that connects the BGA device is modified, the modification being that at least a portion of one row of said vias array is missing at least two adjacent vias. The missing vias are replaced by respective shared vias in an adjacent row, and the shared vias are connected to either a power supply or a power return. The shared vias are also provided with via pads on the other side of said PWB, and a decoupling capacitor can be electrically connected across the pair of via pads to decouple the power supply and the power return at the two adjacent vias.
摘要翻译：描述了在用于安装高性能球栅阵列（BGA）设备的印刷电路板（PWB）上安装去耦电容的解决方案。连接BGA器件的通孔阵列被修改，修改是所述通孔阵列的一行的至少一部分缺少至少两个相邻的通孔。缺失的通孔被相邻行中的相应共享通孔替换，并且共享通孔连接到电源或电源回路。共享通孔还设置有在所述PWB的另一侧上的通孔焊盘，并且去耦电容器可以跨越所述一对通孔焊盘电连接，以在两个相邻通孔处去耦合电源和功率返回。

40. 发明申请

US20050156354A1 Injection molding utilizing base-wall-section flow guides 失效
标题翻译：使用基壁部分导流管的注射成型
公开(公告)号：US20050156354A1
公开(公告)日：2005-07-21
申请号：US11030922
申请日：2005-01-07
申请人： Paul Brown , Jens Sorensen
发明人： Paul Brown , Jens Sorensen
IPC分类号： B29C45/30 , B29C45/00 , B29C45/36 , B29C45/37
CPC分类号： B29C45/80 , B29C45/0046 , B29C45/33 , B29C45/376 , B29C2945/76006 , B29C2945/7626 , B29C2945/76381 , B29C2945/76568 , B29C2945/76742 , B29C2945/76859 , B29C2945/76933 , B29L2031/7132
摘要： During injection molding of a plastic product having a base wall and a sidewall, alignment of the mold parts that shape the mold cavity is maintained by conducting injected plastic material through a sequence of variable-opening throttles in a base-wall-section flow guide of the mold cavity. The openings of the throttles vary in response to variations in the thickness of a region of the sidewall section into which injected plastic material is conducted from the base-wall-section flow guide so that upon an increase in the thickness of such region the openings of the throttles in the base-wall-section flow guide decrease and so that upon a decrease in the thickness of such region the openings of the throttles in the base-wall-section flow guide increase.
摘要翻译：在具有底壁和侧壁的塑料制品的注射成型过程中，通过将注入的塑料材料通过一系列可变开口的节流阀在基壁部分导流器模腔。节流孔的开口响应于侧壁部分的厚度的变化而变化，侧壁部分的区域从注射的塑料材料从底壁部分导流器传导到该区域中，使得当该区域的厚度增加时，基壁部分导流管中的节流阀减小，从而当这种区域的厚度减小时，基壁部分导流件中的节流孔的开口增加。

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