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    • 38. 发明授权
    • Method of measuring dielectric layer thickness using SIMS
    • 使用SIMS测量介电层厚度的方法
    • US06248603B1
    • 2001-06-19
    • US09615393
    • 2000-07-13
    • Clive Martin JonesJin Zhao
    • Clive Martin JonesJin Zhao
    • H01L2166
    • G01N23/00H01L22/12
    • Semiconductor structures having dielectric material layers that are below 3 nanometers in thickness can now be measured with greater precision and in less time using a SIMS device. In an example embodiment of the present invention, a method of measuring the thickness of a dielectric material layer of a semiconductor structure formed on a substrate includes directing a high energy ion beam at a portion of the substrate and sputtering off a plurality of targeted ions from the substrate. The thickness of the dielectric material layer is then determined as a function of a dosage level of the targeted ion and a density of the targeted ion in the dielectric material.
    • 具有低于3纳米厚度的介电材料层的半导体结构现在可以使用SIMS器件以更高的精度和更少的时间来测量。 在本发明的示例性实施例中,测量形成在衬底上的半导体结构的电介质材料层的厚度的方法包括在衬底的一部分处引导高能量离子束,并溅射多个靶离子 底物。 然后确定介电材料层的厚度作为目标离子的剂量水平和介电材料中目标离子的密度的函数。