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    • 36. 发明申请
    • Pain relief composition comprising paramagnetic silver nanoparticles
    • 包含顺磁性银纳米颗粒的疼痛消除组合物
    • US20080193559A1
    • 2008-08-14
    • US11821796
    • 2007-06-26
    • Young-Nam Kim
    • Young-Nam Kim
    • A61K33/38C22C5/06A61P19/02
    • A61K33/38A61K33/00A61K33/24A61K45/06B82Y5/00B82Y30/00
    • The present invention relates to a pain relief composition comprising paramagnetic silver nanoparticles. More specifically, the composition is characterized in that it comprises from 0.03 to 0.05% by weight of paramagnetic silver nanoparticles having specific properties that were not revealed by conventional diamagnetic silver nanoparticles. The pain relief composition according to the present invention shows excellent effect of relieving pain of arthritis due to antibiotic property and anti-toxicity of paramagnetic silver nanoparticles. By using the paramagnetic silver nanoparticles having small particle size, the composition is rapidly absorbed into cells upon being applied to skin. In addition, by virtue of using silver (Ag), no complication such as skin coloration or edema was observed. According to the present invention, pain is relieved by simple application, so that the usage is easy as compared to surgical treatment such as arthroscopic operation to provide high satisfaction to a patient.
    • 本发明涉及包含顺磁性银纳米颗粒的疼痛缓解组合物。 更具体地,组合物的特征在于其包含0.03至0.05重量%的具有特定性质的顺磁性银纳米颗粒,其未被常规抗磁性银纳米颗粒显示。 根据本发明的止痛组合物显示出由于抗生素性质和顺磁性银纳米颗粒的抗毒性而减轻关节炎疼痛的优异效果。 通过使用具有小粒径的顺磁性银纳米颗粒,组合物在施用于皮肤时被快速吸收到细胞中。 另外,通过使用银(Ag),没有观察到皮肤着色或浮肿等并发症。 根据本发明,通过简单的应用减轻了疼痛,因此与诸如关节镜手术的手术治疗相比,使用容易,以向患者提供高度的满意度。
    • 38. 发明申请
    • Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
    • 化学机械抛光装置的抛光垫及其制造方法
    • US20070197143A1
    • 2007-08-23
    • US11706241
    • 2007-02-15
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • B24B1/00B24D11/00
    • B24B37/24B24D18/0063
    • The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
    • 用于抛光物体的抛光垫的表面具有包括亲水材料的第一部分和包括疏水材料的第二部分。 抛光表面的第一部分位于抛光垫的第一区域中,并且抛光表面的第二部分位于抛光垫的与垫的径向方向上与第一区域并置的第二区域中。 亲水材料可以是聚合物树脂,其在聚合物的键合位置含有具有OH和/或-O的亲水性官能团。 疏水性材料可以是在聚合物的结合位置含有H和/或F的疏水官能团的聚合物树脂。 抛光垫通过挤出亲水和疏水材料的相应线来制造。 挤出机和背衬相对于彼此移动,使得线形成亲水和疏水材料的同心环。