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    • 31. 发明申请
    • Light Emitter with Coating Layers
    • 带涂层的发光体
    • US20140124806A1
    • 2014-05-08
    • US12607053
    • 2009-10-27
    • Steven D. Lester
    • Steven D. Lester
    • H01L33/00
    • H01L33/46H01L33/32H01L33/44
    • An AlInGaN light emitting device having a coating is used to improve the extraction of light from a device. A coating has a very low optical loss and an index of refraction greater than 2, preferably having an index of refraction close to or greater than the index of refraction of GaN. The coating can be made from Ta2O5, Nb2O5, TiO2, or SiC and has can have a thickness between 0.01 and 10 microns. A surface of the coating material may be textured or shaped to increase its surface area and improve light extraction. A coating can be applied directly to one or multiple surfaces of the light emitting device or can be applied onto a contact material and can serve as a passivation or as a protection layer for a device.
    • 具有涂层的AlInGaN发光器件用于改进从器件提取光。 涂层具有非常低的光学损耗和大于2的折射率,优选具有接近或大于GaN的折射率的折射率。 涂层可以由Ta2O5,Nb2O5,TiO2或SiC制成,并且可以具有0.01至10微米的厚度。 涂层材料的表面可以被纹理化或成形以增加其表面积并改善光提取。 涂层可以直接施加到发光器件的一个或多个表面上,或者可以施加到接触材料上,并且可以用作器件的钝化或保护层。
    • 32. 发明申请
    • Light emitter with metal-oxide coating
    • 具有金属氧化物涂层的发光体
    • US20130228808A1
    • 2013-09-05
    • US11296006
    • 2005-12-06
    • Steven D. Lester
    • Steven D. Lester
    • H01L33/44
    • H01L33/46H01L33/32H01L33/44
    • A light emitting device based on a AlInGaN materials system wherein a coating is used to improve the extraction of light from a device. A coating has a very low optical loss and an index of refraction greater than 2. In a preferred embodiment the coating is made from Ta2O5, Nb2O5, TiO2, or SiC and has a thickness between about 0.01 and 10 microns. A surface of a coating material may be textured or shaped to increase its surface area and improve light extraction. A surface of the coating material can also be shaped to engineer the directionality of light escaping the layer. A coating can be applied directly to a surface or multiple surfaces of a light emitting device or can be applied onto a contact material. A coating may also serve as a passivation or protection layer for a device.
    • 一种基于AlInGaN材料系统的发光器件,其中使用涂层来改善从器件提取光。 涂层具有非常低的光学损耗和大于2的折射率。在优选实施例中,涂层由Ta 2 O 5,Nb 2 O 5,TiO 2或SiC制成,并且具有约0.01至10微米的厚度。 涂层材料的表面可以被纹理化或成形以增加其表面积并改善光提取。 涂层材料的表面也可以被成形为设计逃逸层的光的方向性。 涂层可以直接施加到发光器件的表面或多个表面,或者可以施加到接触材料上。 涂层还可以用作器件的钝化或保护层。
    • 33. 发明授权
    • GaN based LED having reduced thickness and method for making the same
    • 具有减小厚度的GaN基LED及其制造方法
    • US08384099B2
    • 2013-02-26
    • US12860162
    • 2010-08-20
    • Steven D. LesterFrank T. Shum
    • Steven D. LesterFrank T. Shum
    • H01L29/206
    • H01L33/0079H01L33/22
    • A device having a carrier, a light-emitting structure, and first and second electrodes is disclosed. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength in the active layer when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The first and second electrodes are bonded to the surfaces of the p-type and n-type GaN layers that are not adjacent to the active layer. The n-type GaN layer has a thickness less than 1.25 μm. The carrier is bonded to the light emitting structure during the thinning of the n-type GaN layer. The thinned light-emitting structure can be transferred to a second carrier to provide a device that is analogous to conventional LEDs having contacts on the top surface of the LED.
    • 公开了一种具有载体,发光结构以及第一和第二电极的装置。 发光结构包括夹在p型GaN层和n型GaN层之间的有源层,当来自n型GaN层的电子和空穴以及有源层发射预定波长的光的有源层和 p型GaN层分别结合在一起。 第一和第二电极结合到不与有源层相邻的p型和n型GaN层的表面。 n型GaN层的厚度小于1.25μm。 在n型GaN层的薄化期间,载体与发光结构结合。 减薄的发光结构可以转移到第二载体以提供类似于在LED的顶表面上具有接触的常规LED的装置。
    • 40. 发明授权
    • GaN LEDs with improved output coupling efficiency
    • GaN LED具有改善的输出耦合效率
    • US6091085A
    • 2000-07-18
    • US26465
    • 1998-02-19
    • Steven D. Lester
    • Steven D. Lester
    • H01L33/00H01L33/02H01L33/22
    • H01L33/025H01L33/007H01L33/22H01L21/24
    • An LED having a higher light coupling efficiency than prior art devices, particularly those based on GaN. An LED according to the present invention includes a substrate having a top surface, a first layer of a semiconducting material deposited on the top surface of the substrate, a light generation region deposited on the first layer, and a second layer of semiconducting material deposited on the first layer. Electrical contacts are connected to the first and second layers. In one embodiment, the top surface of the substrate includes protrusions and/or depressions for scattering light generated by the light generation region. In a second embodiment, the surface of the second layer that is not in contact with the first layer includes a plurality of protrusions having facets positioned such that at least a portion of the light generated by light generation layer strikes the facets and exits the surface of the second layer. In a third embodiment, the second layer includes a plurality of channels extending from the surface of the second layer that is not in contact with the light generation layer. The channels are filled with a material having an index of refraction less that that of the semiconducting material.
    • 具有比现有技术的器件,特别是基于GaN的器件更高的光耦合效率的LED。 根据本发明的LED包括具有顶表面的衬底,沉积在衬底的顶表面上的半导体材料的第一层,沉积在第一层上的发光区域和沉积在第一层上的第二层半导体材料 第一层。 电触头连接到第一和第二层。 在一个实施例中,衬底的顶表面包括用于散射由光产生区域产生的光的突起和/或凹陷。 在第二实施例中,不与第一层接触的第二层的表面包括多个突起,其具有面,所述多个突起的定位使得由光产生层产生的光的至少一部分撞击小面并离开表面 第二层。 在第三实施例中,第二层包括从不与光产生层接触的第二层的表面延伸的多个通道。 通道填充有折射率小于半导体材料折射率的材料。