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31. 发明授权

US08962701B2 Integrated bioprocessing for fuel production 有权
公开(公告)号：US08962701B2
公开(公告)日：2015-02-24
申请号：US13326017
申请日：2011-12-14
申请人： Paul D. Oldenburg , Michel Daage , Virginia M. Roberts , Paul J. Berlowitz , David C. Long , James R. Bielenberg
发明人： Paul D. Oldenburg , Michel Daage , Virginia M. Roberts , Paul J. Berlowitz , David C. Long , James R. Bielenberg
IPC分类号： C07C27/00 , C07C51/43 , C07C1/00
CPC分类号： C07C29/1518 , C10G2/32 , C10J2300/0916 , C10J2300/1659 , C10J2300/1665 , C10J2300/1681 , C10K1/005 , C10K3/04 , C11B1/04 , C11B1/10 , C11C3/003 , C12P7/6463 , Y02E50/18 , Y02E50/343 , Y02P20/125 , Y02P20/145 , Y02P20/582 , C07C31/04
摘要： Systems and methods are provided for enhancing the integration of processes for recovering products from algae-derived biomass. The enhanced process integration allows for increased use of input streams and other reagents that are derived from renewable sources. This increases the overall renewable character of the products extracted from the algae-derived biomass. The process integration can include exchange of input streams or energy between an algae processing system and a system for processing non-algal biomass. One example of improving process integration is using oxygenates that are generated in a renewable manner as a reagent for enhancing the algae processing system.

32. 发明授权

US08487148B2 Hydrothermal treatment of biomass with heterogeneous catalyst 有权
标题翻译：用非均相催化剂水热处理生物质
公开(公告)号：US08487148B2
公开(公告)日：2013-07-16
申请号：US13285519
申请日：2011-10-31
申请人： Virginia M. Roberts , Michel Daage , Paul D. Oldenburg , James R. Bielenberg , Paul J. Berlowitz , David C. Long , Halou Oumar-Mahamat
发明人： Virginia M. Roberts , Michel Daage , Paul D. Oldenburg , James R. Bielenberg , Paul J. Berlowitz , David C. Long , Halou Oumar-Mahamat
IPC分类号： C10M169/04
CPC分类号： C10G3/42 , C10G3/47 , C10G3/48 , C10G3/50 , C10G2300/1014 , C10G2300/1018 , C10G2300/301 , C10G2300/4018 , C10J2300/0916 , Y02P20/145 , Y02P30/20
摘要： Biomass based feeds are processed under hydrothermal treatment conditions, e.g., to produce a hydrocarbon liquid product and a solids portion. The hydrothermal treatment can be performed in the presence of heterogeneous catalyst particles that can optionally include a catalyst metal or metal salt. The presence of the heterogeneous catalyst can modify the nature of the hydrocarbon products produced from the hydrothermal treatment.
摘要翻译：基于生物质的饲料在水热处理条件下进行处理，例如产生烃液体产物和固体部分。水热处理可以在可任选地包括催化剂金属或金属盐的非均相催化剂颗粒的存在下进行。非均相催化剂的存在可以改变由水热处理产生的烃产物的性质。

33. 发明授权

US07819027B2 Method and structure for a pull test for controlled collapse chip connections and ball limiting metallurgy 有权
标题翻译：用于控制塌陷芯片连接和限球冶金的拉力试验方法和结构
公开(公告)号：US07819027B2
公开(公告)日：2010-10-26
申请号：US11766869
申请日：2007-06-22
申请人： Virendra R. Jadhav , Vijayeshwar D. Khanna , David C. Long , David L. Questad
发明人： Virendra R. Jadhav , Vijayeshwar D. Khanna , David C. Long , David L. Questad
IPC分类号： G01L5/24
CPC分类号： G01N19/04 , G01N3/00 , G01N3/08 , G01N2203/0017 , G01N2203/0296 , Y10T29/49995
摘要： A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.
摘要翻译：设置在基板上方的受控崩溃芯片连接（C4）的拉伸强度测试结构包括：被配置用于用C4定位基板的固定座; 具有通孔通道的顶部固定板; 测试销用于插入通孔通道; 其中基板的尺寸公差被用于定位基板的固定基座的至少两个侧面上的开口，并且在将顶部固定板固定到固定基座之前以及在顶部固定板通过孔通道与C4对准期间 ; 其中所述测试销是应变硬化金属线; 其中在焊料回流工艺期间，测试销的下端连接到C4; 并且其中测试销的远端在垂直于测试结构的方向上拉动以确定C4的拉伸强度。

34. 发明申请

US20090145973A1 STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION APPLICATIONS 有权
标题翻译：用于实施加密应用的安全多模块模块的结构
公开(公告)号：US20090145973A1
公开(公告)日：2009-06-11
申请号：US12348364
申请日：2009-01-05
申请人： Mukta G. Farooq , Benjamin V. Fasano , Jason L. Frankel , Harvey C. Hamel , Suresh D. Kadakia , David C. Long , Frank L. Pompeo , Sudipta K. Ray
发明人： Mukta G. Farooq , Benjamin V. Fasano , Jason L. Frankel , Harvey C. Hamel , Suresh D. Kadakia , David C. Long , Frank L. Pompeo , Sudipta K. Ray
IPC分类号： G06K19/06
CPC分类号： G06K19/07381 , H01L23/04 , H01L23/055 , H01L23/10 , H01L23/576 , H01L25/0655 , H01L2224/16225 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15192 , H01L2924/3011 , H05K1/0275 , H05K1/0306 , H05K1/144 , H05K2201/09263 , H05K2201/10151
摘要： A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.
摘要翻译：防篡改集成电路（IC）模块包括陶瓷芯片载体; 一个或多个集成电路芯片，附接到芯片载体的顶表面; 一个陶瓷基帽结构，附着在芯片载体的顶表面上，并覆盖一个或多个集成电路芯片; 以及嵌入在所述芯片载体和所述盖结构内的导电栅格结构，所述导电栅格结构具有设置在x方向，y方向和z方向上的多个曲折线; 其中所述导电栅格结构被配置为检测穿透所述IC模块的尝试。

35. 发明申请

US20090090229A1 METHOD AND APPARATUS FOR CONTROLLING SIZE AND ALIGNMENT OF PRECISION GROUND PLATES 失效
标题翻译：用于控制精密接地板尺寸和对准的方法和装置
公开(公告)号：US20090090229A1
公开(公告)日：2009-04-09
申请号：US11866470
申请日：2007-10-03
申请人： Anthony F. Coneski , Michael J. Domitrovits , David C. Long
发明人： Anthony F. Coneski , Michael J. Domitrovits , David C. Long
IPC分类号： B26D7/06
CPC分类号： B26D7/2628 , B26F1/02 , B26F1/04 , H05K1/0306 , H05K3/005 , H05K2203/0173 , H05K2203/1105 , Y10T83/2092 , Y10T83/9423 , Y10T83/943 , Y10T83/944
摘要： An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate.
摘要翻译：用于保持精密接地板之间的对准的装置包括：第一板，包括具有多个通道的主体部分。第一板还包括安装成将主体部分加热至选定温度的第一加热装置。包括具有多个通道的主体部分的第二板位于第一板附近。第二板包括安装成将主体部分加热至选定温度的第二加热装置。可操作地连接到第一和第二加热装置的控制器选择性地在第一和第二板中的每一个中建立期望的温度，以促进第一板中的多个通道和第二板中的多个通道之间的期望对准。

36. 发明申请

US20080313879A1 METHOD AND STRUCTURE FOR A PULL TEST FOR CONTROLLED COLLAPSE CHIP CONNECTIONS AND BALL LIMITING METALLURGY 有权
标题翻译：用于控制熔滴连接和极限冶金的拉拔试验的方法和结构
公开(公告)号：US20080313879A1
公开(公告)日：2008-12-25
申请号：US11766869
申请日：2007-06-22
申请人： Virendra R. Jadhav , Vijayeshwar D. Khanna , David C. Long , David L. Questad
发明人： Virendra R. Jadhav , Vijayeshwar D. Khanna , David C. Long , David L. Questad
IPC分类号： G01N3/08 , G01N3/62
CPC分类号： G01N19/04 , G01N3/00 , G01N3/08 , G01N2203/0017 , G01N2203/0296 , Y10T29/49995
摘要： A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.
摘要翻译：设置在基板上方的受控崩溃芯片连接（C4）的拉伸强度测试结构包括：被配置用于用C4定位基板的固定座; 具有通孔通道的顶部固定板; 测试销用于插入通孔通道; 其中基板的尺寸公差被用于定位基板的固定基座的至少两个侧面上的开口，并且在将顶部固定板固定到固定基座之前以及在顶部固定板通过孔通道与C4对准期间 ; 其中所述测试销是应变硬化金属线; 其中在焊料回流工艺期间，测试销的下端连接到C4; 并且其中测试销的远端在垂直于测试结构的方向上拉动以确定C4的拉伸强度。

37. 发明申请

US20080225484A1 THERMAL PILLOW 有权
标题翻译：热枕头
公开(公告)号：US20080225484A1
公开(公告)日：2008-09-18
申请号：US11687037
申请日：2007-03-16
申请人： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
发明人： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511 , H01L2224/0401
摘要： Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.
摘要翻译：使用柔性热枕头增强电子部件传热的方法，装置和组件。柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。

38. 发明授权

US07118385B1 Apparatus for implementing a self-centering land grid array socket 失效
标题翻译：用于实现自定心的土地格栅阵列插座的装置
公开(公告)号：US07118385B1
公开(公告)日：2006-10-10
申请号：US11162779
申请日：2005-09-22
申请人： Paul Bodenweber , David C. Long , Jason S. Miller , Robert P. Westerfield, Jr. , Yuet-Ying Yu
发明人： Paul Bodenweber , David C. Long , Jason S. Miller , Robert P. Westerfield, Jr. , Yuet-Ying Yu
IPC分类号： H01R12/00
CPC分类号： H05K7/1061
摘要： A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.
摘要翻译：用于集成电路封装的自对准插座包括外框架和触头阵列，其被配置为与集成电路封装的底部上的对应导电焊盘对准。外框架还包括构造在其上的第一多个对准球轴承，球轴承安装在悬臂弹簧杆上。

39. 发明授权

US07045011B2 Dual-layer compliant polymeric nozzle 失效
标题翻译：双层合规聚合物喷嘴
公开(公告)号：US07045011B2
公开(公告)日：2006-05-16
申请号：US10604257
申请日：2003-07-07
申请人： David C. Long , Jason S. Miller , Randall J. Werner
发明人： David C. Long , Jason S. Miller , Randall J. Werner
IPC分类号： B05B15/04
CPC分类号： H05K3/1233 , H05K2203/0126
摘要： An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.
摘要翻译：一种集成电路丝网印刷喷嘴，其具有喷嘴体，所述喷嘴体上的第一内层，所述第一层上的第二外层，以及通过所述喷嘴体，所述第一层和所述第二层的开口。第一和第二层可以是保持在体内的插入物。该开口允许糊料材料通过丝网印刷喷嘴流到模板掩模。此外，第二外层包括适于接触模板掩模的接触表面。本发明的一个特征是第一层比第二层更软（具有较低的硬度）。这允许第二层比第一层更耐用，并且第一层为第二层提供额外的灵活性。因此，本发明提供了一种具有柔软喷嘴的柔软性的硬外表面的高耐久性特性的喷嘴。

40. 发明授权

US06917194B2 External verification of package processed linewidths and spacings in semiconductor packages 失效
标题翻译：封装加工线宽的外部验证和半导体封装中的间距
公开(公告)号：US06917194B2
公开(公告)日：2005-07-12
申请号：US10604933
申请日：2003-08-27
申请人： Thomas J. Fleischman , David C. Long
发明人： Thomas J. Fleischman , David C. Long
IPC分类号： G01R31/02
CPC分类号： G01R31/023
摘要： Disclose is a method that forms non-functional test structures in kerf regions outside functional wiring modules of the ceramic greensheets and across edges of the functional wiring modules, and an associated structure. In order to check or test the spacing and size of wires in functional wiring modules, the invention only needs to examine the non-functional test structures as exposed by cutting the multi-module greensheet along the laminate trim line or by dicing of the greensheet into individual modules. The non-functional wires have the same design spacing, size, and angles as wires in the functional wiring modules. Therefore, the non-functional test structures comprise representative wires of wires in the functional wiring modules.
摘要翻译： Disclose是一种在陶瓷毛坯的功能接线模块和功能接线模块的边缘之间的切口区域中形成非功能测试结构的方法，以及相关联的结构。为了检查或测试功能接线模块中导线的间距和尺寸，本发明仅需要检查通过沿着层叠装饰线切割多模块毛坯而暴露的非功能测试结构，或者通过将毛坯切割成单个模块。非功能导线与功能接线模块中的导线具有相同的设计间距，尺寸和角度。因此，非功能测试结构包括功能布线模块中的代表性的导线。

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