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31. 发明授权

US09129816B2 Contact test structure and method 有权
标题翻译：接触测试结构和方法
公开(公告)号：US09129816B2
公开(公告)日：2015-09-08
申请号：US13422846
申请日：2012-03-16
申请人： Jie Chen , Hsien-Wei Chen , Tsung-Yuan Yu , Ying-Ju Chen
发明人： Jie Chen , Hsien-Wei Chen , Tsung-Yuan Yu , Ying-Ju Chen
IPC分类号： H01L21/66 , H01L23/00 , H01L23/482
CPC分类号： H01L22/34 , H01L22/30 , H01L22/32 , H01L23/4824 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/05008 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05555 , H01L2224/05569 , H01L2224/05572 , H01L2224/05583 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/0603 , H01L2224/06179 , H01L2224/06505 , H01L2224/11015 , H01L2224/13006 , H01L2224/13022 , H01L2224/13026 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/14153 , H01L2224/14155 , H01L2924/01029 , H01L2924/00014 , H01L2924/207 , H01L2924/014
摘要： A system and method for testing electrical connections is provided. In an embodiment one or more floating pads may be manufactured in electrical connection with an underbump metallization structure. A test may then be performed to measure the electrical characteristics of the underbump metallization structure through the floating pad in order to test for defects. Alternatively, a conductive connection may be formed on the underbump metallization and the test may be performed on the conductive connection and the underbump metallization together.
摘要翻译：提供了一种用于测试电气连接的系统和方法。在一个实施例中，可以制造一个或多个浮动焊盘，以与下部焊接金属化结构电连接。然后可以进行测试以通过浮动垫测量底部金属化结构的电特性，以测试缺陷。或者，可以在下凸点金属化上形成导电连接，并且可以在导电连接和下凸点金属化一起进行测试。

32. 发明授权

US08581400B2 Post-passivation interconnect structure 有权
标题翻译：后钝化互连结构
公开(公告)号：US08581400B2
公开(公告)日：2013-11-12
申请号：US13272540
申请日：2011-10-13
申请人： Shih-Wei Liang , Hsien-Wei Chen , Ying-Ju Chen , Tsung-Yuan Yu , Mirng-Ji Lii
发明人： Shih-Wei Liang , Hsien-Wei Chen , Ying-Ju Chen , Tsung-Yuan Yu , Mirng-Ji Lii
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44
CPC分类号： H01L24/11 , H01L21/76841 , H01L23/3114 , H01L23/3171 , H01L23/3192 , H01L23/525 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/02235 , H01L2224/02255 , H01L2224/0226 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05571 , H01L2224/05609 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/11334 , H01L2224/11849 , H01L2224/13006 , H01L2224/13022 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81411 , H01L2224/81413 , H01L2224/81416 , H01L2224/81439 , H01L2224/81447 , H01L2224/81455 , H01L2224/81815 , H01L2924/00014 , H01L2924/12042 , H01L2924/15788 , H01L2924/014 , H01L2924/00012 , H01L2924/01082 , H01L2924/01046 , H01L2924/01079 , H01L2924/01047 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device includes a passivation layer, a first protective layer, an interconnect layer, and a second protective layer successively formed on a semiconductor substrate. The interconnect layer has an exposed portion, on which a barrier layer and a solder bump are formed. At least one of the passivation layer, the first protective layer, the interconnect layer and the second protective layer includes at least one slot formed in a region outside a conductive pad region.
摘要翻译：半导体器件包括依次形成在半导体衬底上的钝化层，第一保护层，互连层和第二保护层。互连层具有暴露部分，其上形成有阻挡层和焊料凸块。钝化层，第一保护层，互连层和第二保护层中的至少一个包括形成在导电焊盘区域外的区域中的至少一个槽。

33. 发明授权

US08994181B2 Bond pad structure to reduce bond pad corrosion 有权
标题翻译：焊盘结构减少焊垫的腐蚀
公开(公告)号：US08994181B2
公开(公告)日：2015-03-31
申请号：US13212536
申请日：2011-08-18
申请人： Ying-Ju Chen , Hsien-Wei Chen , Tsung-Yuan Yu , Shih-Wei Liang
发明人： Ying-Ju Chen , Hsien-Wei Chen , Tsung-Yuan Yu , Shih-Wei Liang
IPC分类号： H01L23/48 , H01L23/29 , H01L23/31 , H01L23/522 , H01L23/00
CPC分类号： H01L23/291 , H01L23/3192 , H01L23/5226 , H01L24/05 , H01L2224/02166 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05008 , H01L2224/05096 , H01L2224/05552 , H01L2224/05553 , H01L2224/05557 , H01L2224/05558 , H01L2224/05567 , H01L2224/05572 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/131 , H01L2224/13147 , H01L2224/45144 , H01L2224/45147 , H01L2224/48624 , H01L2224/48647 , H01L2224/48666 , H01L2224/48681 , H01L2224/48684 , H01L2224/48824 , H01L2224/48847 , H01L2224/48866 , H01L2224/48881 , H01L2224/48884 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： Mechanisms of forming a bond pad structure are provided. The bond pad has a recess region, which is formed by an opening in the passivation layer underneath the bond pad. An upper passivation layer covers at least the recess region of the bond pad to reduce trapping of patterning and/or etching residues in the recess region. As a result, the likelihood of bond pad corrosion is reduced.
摘要翻译：提供了形成接合焊盘结构的机理。接合焊盘具有凹陷区域，该凹陷区域由接合焊盘下方的钝化层中的开口形成。上钝化层至少覆盖接合焊盘的凹陷区域，以减少凹陷区域中图案化和/或蚀刻残留物的捕获。结果，焊盘腐蚀的可能性降低。

34. 发明授权

US08871629B2 Methods of and semiconductor devices with ball strength improvement 有权
标题翻译：具有球强度改善的半导体器件的方法
公开(公告)号：US08871629B2
公开(公告)日：2014-10-28
申请号：US13291550
申请日：2011-11-08
申请人： Tsung-Yuan Yu , Hsien-Wei Chen , Ying-Ju Chen , Shih-Wei Liang
发明人： Tsung-Yuan Yu , Hsien-Wei Chen , Ying-Ju Chen , Shih-Wei Liang
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/14 , G06F2217/40 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/02311 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/131 , H01L2224/13111 , H01L2224/1405 , H01L2224/14133 , H01L2224/14517 , H01L2224/16145 , H01L2224/16225 , H01L2224/17517 , H01L2224/81815 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/1203 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/3511 , H01L2924/3512 , H01L2924/37001 , H01L2924/01047 , H01L2924/0105 , H01L2924/01024 , H01L2924/01079 , H01L2924/01028 , H01L2924/00 , H01L2224/05552
摘要： In a method of improving ball strength of a semiconductor device, a ball pattern of a plurality of connection balls to be formed as electrical connections for the semiconductor device is received. The pattern includes a number of columns and rows crossing each other. The balls are arranged at intersections of the columns and rows. An arrangement of balls in a region of the ball pattern is modified so that the region includes no isolated balls.
摘要翻译：在提高半导体器件的球强度的方法中，接收要形成为半导体器件的电连接的多个连接球的球形图案。该图案包括彼此交叉的多个列和行。球排列在列和行的交点处。在球形图案的区域中的球的布置被修改，使得该区域不包括孤立的球。

35. 发明授权

US08692378B2 UBM structures for wafer level chip scale packaging 有权
标题翻译： UBM结构用于晶圆级芯片级封装
公开(公告)号：US08692378B2
公开(公告)日：2014-04-08
申请号：US13312538
申请日：2011-12-06
申请人： Tsung-Yuan Yu , Hsien-Wei Chen , Ying-Ju Chen , Shih-Wei Liang
发明人： Tsung-Yuan Yu , Hsien-Wei Chen , Ying-Ju Chen , Shih-Wei Liang
IPC分类号： H01L23/34
CPC分类号： H01L24/11 , H01L23/3192 , H01L23/562 , H01L24/05 , H01L24/06 , H01L24/13 , H01L2224/02166 , H01L2224/02375 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05541 , H01L2224/05552 , H01L2224/05572 , H01L2224/0603 , H01L2224/06131 , H01L2924/00014 , H01L2924/206 , H01L2924/00012
摘要： A wafer level chip scale semiconductor device comprises a semiconductor die, a first under bump metal structure and a second under bump metal structure. The first under bump metal structure having a first enclosure is formed on a corner region or an edge region of the semiconductor die. A second under bump metal structure having a second enclosure is formed on an inner region of the semiconductor die. The first enclosure is greater than the second enclosure.
摘要翻译：晶片级芯片级半导体器件包括半导体管芯，第一下凸块金属结构和第二凸块下金属结构。具有第一外壳的第一下凸块金属结构形成在半导体管芯的拐角区域或边缘区域上。具有第二外壳的第二下凸块金属结构形成在半导体管芯的内部区域上。第一个外壳大于第二个外壳。

36. 发明授权

US08237160B2 Probe pad on a corner stress relief region in a semiconductor chip 有权
标题翻译：在半导体芯片的拐角应力释放区域的探针垫
公开(公告)号：US08237160B2
公开(公告)日：2012-08-07
申请号：US13198408
申请日：2011-08-04
申请人： Hsien-Wei Chen , Chung-Ying Yang , Ying-Ju Chen , Shih-Wei Liang , Ching-Jung Yang
发明人： Hsien-Wei Chen , Chung-Ying Yang , Ying-Ju Chen , Shih-Wei Liang , Ching-Jung Yang
IPC分类号： H01L23/58
CPC分类号： H01L27/0203 , H01L22/34 , H01L23/585 , H01L24/05 , H01L2224/02166 , H01L2224/05093 , H01L2224/05553 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： A semiconductor chip includes a corner stress relief (CSR) region. An enhanced structure connects sides of a seal ring structure to surround the CSR region. A device under test (DUT) structure is disposed on the CSR region. A set of probe pad structures is disposed on the CSR region. Two of the set of probe pad structures are electrically connect to the DUT structure.
摘要翻译：半导体芯片包括角部应力消除（CSR）区域。增强的结构将密封环结构的侧面连接到包围CSR区域。被测设备（DUT）结构设置在CSR区域上。一组探针垫结构设置在CSR区域上。探针焊盘结构中的两个电连接到DUT结构。

37. 发明授权

US09208222B2 Note management methods and systems 有权
标题翻译：注意管理方法和系统
公开(公告)号：US09208222B2
公开(公告)日：2015-12-08
申请号：US13301192
申请日：2011-11-21
申请人： David Folchi , Ying-Ju Chen
发明人： David Folchi , Ying-Ju Chen
IPC分类号： G06F17/30
CPC分类号： G06F17/30716 , G06F17/30551
摘要： Note management methods and systems are provided. First, inputs are received along a timeline, and at least one note is generated according to the inputs. The at least one note is recorded and arranged along the timeline. In some embodiments, a thumbnail is generated for a respective predefined interval on the timeline according to the at least one note in the respective predefined interval, and the thumbnail of the respective predefined interval is displayed along the timeline.
摘要翻译：备注管理方法和系统。首先，沿着时间线接收输入，并且根据输入生成至少一个音符。至少一个音符沿时间轴记录和排列。在一些实施例中，根据相应预定义间隔中的至少一个音符，在时间线上针对相应的预定义间隔生成缩略图，并且沿着时间线显示相应预定义间隔的缩略图。

38. 发明授权

US08315607B2 Method and system for filtering incoming messages to a mobile device 有权
标题翻译：用于过滤传入消息到移动设备的方法和系统
公开(公告)号：US08315607B2
公开(公告)日：2012-11-20
申请号：US12419177
申请日：2009-04-06
申请人： Ying-Ju Chen , John C. Wang
发明人： Ying-Ju Chen , John C. Wang
IPC分类号： H04M3/42
CPC分类号： H04W4/14 , G06Q10/107 , H04L51/12 , H04L51/14 , H04L51/38 , H04M1/575 , H04M1/72547
摘要： A system for managing and filtering incoming messages to a mobile device is configured to receive incoming messages using multiple formats, such as e-mail, Short Messaging System (SMS) messages, Multimedia Message System (MMS) messages, or other electronic messaging formats. One or more message filters are used to consolidate and display high importance messages by the device in a single location. The message filters may be configured to select incoming messages based on factors such as the identity of the sender and the destination account. After receiving a new message, the system compares characteristics of the incoming message to the key characteristics defined by one or more of the filters. If an incoming message matches one of the filters, the system adds the matching message to a list of high importance messages. The system provides a separate user interface to display the high importance messages.
摘要翻译：用于管理和过滤传入消息到移动设备的系统被配置为使用诸如电子邮件，短消息系统（SMS）消息，多媒体消息系统（MMS）消息或其他电子消息格式等多种格式来接收传入消息。一个或多个消息过滤器用于在单个位置中整合和显示设备的高重要性消息。消息过滤器可以被配置为基于诸如发送者和目的地帐户的身份的因素来选择传入消息。系统收到新消息后，将传入消息的特征与一个或多个过滤器定义的关键特征进行比较。如果传入消息与其中一个过滤器匹配，则系统将匹配消息添加到高重要性消息列表中。该系统提供单独的用户界面来显示高重要性消息。

39. 发明申请

US20090273699A1 IMAGE PROCESSING METHOD, ELECTRONIC DEVICE THEREOF, AND RECORDING MEDIUM THEREOF 审中-公开
标题翻译：图像处理方法，其电子设备及其记录介质
公开(公告)号：US20090273699A1
公开(公告)日：2009-11-05
申请号：US12241050
申请日：2008-09-30
申请人： Yu-Chao Lin , Che-Hung Lee , Ying-Ju Chen , Kuan-Wei Li , Yi-Fan Yang
发明人： Yu-Chao Lin , Che-Hung Lee , Ying-Ju Chen , Kuan-Wei Li , Yi-Fan Yang
IPC分类号： H04N5/222
CPC分类号： H04N5/232 , H04N5/772
摘要： An image processing method, an electronic device thereof, and a recording medium thereof are provided, which are applicable for processing an image captured by an electronic device. In this method, a default direction is defined first, and a current usage direction of the electronic device is obtained then. If the usage direction is not consistent with the default direction, the image is adjusted to a correct direction according to both the usage direction and the default direction. Finally, the adjusted image is recorded. Therefore, regardless of the direction along which the user holds the electronic device when capturing the image, the recorded image is always in the correct direction. The rotation operations performed to the images that are not in the correct direction can be omitted when browsing the images, so as to greatly increase the convenience and smoothness in browsing images.
摘要翻译：提供了一种图像处理方法，其电子设备及其记录介质，其可应用于处理由电子设备捕获的图像。在该方法中，首先定义默认方向，然后获得电子设备的当前使用方向。如果使用方向与默认方向不一致，则根据使用方向和默认方向将图像调整到正确的方向。最后，记录调整后的图像。因此，无论在拍摄图像时用户握住电子设备的方向如何，记录的图像总是在正确的方向上。在浏览图像时，可以省略对不正确方向的图像进行的旋转操作，从而大大增加浏览图像的方便性和平滑度。

40. 发明申请

US20080242734A1 Use of Biocistronic DNA Constructs for Identifying Compounds that Inhibit IRES-Dependent Translation 审中-公开
标题翻译：使用生物顺反子DNA构建体鉴定抑制IRES依赖性翻译的化合物
公开(公告)号：US20080242734A1
公开(公告)日：2008-10-02
申请号：US11781564
申请日：2007-07-23
申请人： Tzong-Yuan Wu , Shin-Jhan Zeng , Ying-Ju Chen , Tsu-An Hsu , Shin-Ru Shih , Suey-Sheng Kao , Tzyy-Rong Jinn
发明人： Tzong-Yuan Wu , Shin-Jhan Zeng , Ying-Ju Chen , Tsu-An Hsu , Shin-Ru Shih , Suey-Sheng Kao , Tzyy-Rong Jinn
IPC分类号： A61K31/13 , A61P25/24
CPC分类号： C12Q1/6897 , C12N15/67
摘要： The present invention relates to use of bicistronic DNA constructs for identifying compounds that inhibits IRES-dependent translation activity of an infectious enterovirus (EV) or encephalomyocarditis virus (EMCV) without affecting CAP-dependent translation activity of a host subject. The compounds thus identified are useful in preparation of a medicament for treating EV or EMCV infection.
摘要翻译：本发明涉及双顺反子DNA构建体用于鉴定抑制感染性肠病毒（EV）或脑心肌炎病毒（EMCV）的IRES依赖性翻译活性而不影响宿主受试者的依赖于CAP的翻译活性的化合物的用途。所鉴定的化合物可用于制备用于治疗EV或EMCV感染的药物。

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