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31. 发明授权

US06862333B2 CMD and CMD-carrying CCD device 有权
标题翻译： CMD和CMD携带CCD设备
公开(公告)号：US06862333B2
公开(公告)日：2005-03-01
申请号：US10447827
申请日：2003-05-29
申请人： Shunji Kashima , Kyoichi Yahata , Izumi Kobayashi
发明人： Shunji Kashima , Kyoichi Yahata , Izumi Kobayashi
IPC分类号： H01L29/762 , G11C11/35 , G11C19/28 , H01L21/339 , H01L27/148 , H04N5/335 , H04N5/369 , H04N5/372
CPC分类号： G11C19/282
摘要： This invention controls the signal amplification rate in a simple way with high precision in a CMD or CMD-carrying CCD device. CMD 12 has plural sections, such as M sections (U1-UM), each of which is a CMD unit U that can perform a charge multiplication operation, set in series. Each section of CMD unit Ui has plural (such as 4) electrodes G1, G2, G3, G4 set in a row via an insulating film, such as silicon oxide film 100, on a silicon insulating film. Among driving voltages P1, P2, P3, P4 applied on the electrodes G1, G2, G3 and G4, P1 and P2 are applied in the same cycle as the transfer clock, P4 for impact ionization is applied in intermittent cycles with respect to P1 and P2, and P3 is applied as a DC voltage at a prescribed level.
摘要翻译：本发明在具有CMD或CMD的CCD器件中以高精度以简单的方式控制信号放大率。 CMD12具有多个部分，例如M部分（U1-UM），其中每个部分是可以执行充电倍增操作的CMD单元U，其串联设置。 CMD单元Ui的每个部分在硅绝缘膜上具有通过绝缘膜（例如氧化硅膜100）在列中设置的多个（例如4个）电极G1，G2，G3，G4。在施加在电极G1，G2，G3和G4上的驱动电压P1，P2，P3，P4中，P1和P2以与传送时钟相同的周期施加，用于冲击电离的P4相对于P1和P2间歇循环应用 P2和P3作为直流电压施加在规定的水平。

32. 发明授权

US5910952A Call restriction system for an ATM exchange 失效
标题翻译： ATM交换机的呼叫限制系统
公开(公告)号：US5910952A
公开(公告)日：1999-06-08
申请号：US701490
申请日：1996-08-22
申请人： Keiji Mizuma , Izumi Kobayashi
发明人： Keiji Mizuma , Izumi Kobayashi
IPC分类号： H04Q3/00 , H04L12/70 , H04L12/801 , H04L12/811 , H04L12/851 , H04L12/911 , H04Q11/04 , H04L12/56
CPC分类号： H04L49/30 , H04L49/254 , H04L49/255 , H04L49/3081 , H04L49/50 , H04Q11/0478 , H04L2012/5614 , H04L2012/5619 , H04L2012/563 , H04L2012/5672
摘要： A call restriction system for an ATM exchange reduces the load on the call control processor and achieves a step-wise variation in the degree of call restriction in response to the degree of load in an ATM exchange. The exchange has at least one circuit interface section to which are connected a plurality of physical circuits The exchange terminates the physical circuits and a call control processor which is connected to the circuit interface section or sections and performs call-processing control. A signal control processing unit within the circuit interface section performs call restriction with respect to each individual physical circuit, either in response to an instruction from the call control processor or independently.
摘要翻译：用于ATM交换机的呼叫限制系统减少了呼叫控制处理器的负担，并且响应于ATM交换机中的负载程度而实现了呼叫限制程度的逐步变化。交换机具有至少一个电路接口部分，多个物理电路连接到该电路接口部分。交换机终止物理电路，以及连接到电路接口部分或执行呼叫处理控制的呼叫控制处理器。电路接口部分中的信号控制处理单元响应于来自呼叫控制处理器的指令或独立地执行关于每个单独物理电路的呼叫限制。

33. 发明授权

US5403815A Triazine derivative and a herbicide comprising the same as an effective ingredient 失效
标题翻译：三嗪衍生物和除草剂，其包含与有效成分相同的除草剂
公开(公告)号：US5403815A
公开(公告)日：1995-04-04
申请号：US180654
申请日：1994-01-12
申请人： Masahiro Nishii , Izumi Kobayashi , Masatoshi Uemura , Tetsuo Takematsu
发明人： Masahiro Nishii , Izumi Kobayashi , Masatoshi Uemura , Tetsuo Takematsu
IPC分类号： C07D405/12 , A01N43/68 , C07D251/18 , C07D407/12 , C07D409/12
CPC分类号： C07D405/12 , A01N43/68 , C07D251/18 , C07D409/12
摘要： A triazine compound of the formula ##STR1## wherein Y.sup.1 is a hydrogen atom or a methyl group and Z is an oxygen atom or a sulfur atom, X.sup.1 is a halogen atom and R is a hydrogen atom, a methyl group or an ethyl group. The triazine compound is useful as a herbicide for combatting weeds.
摘要翻译：式“IMAGE”的三嗪化合物，其中Y1为氢原子或甲基，Z为氧原子或硫原子，X1为卤素原子，R为氢原子，甲基或乙基。三嗪化合物可用作除草剂来防治杂草。

34. 发明授权

US4475394A Ultrasonic method of determining nature of flaws by incremental scanning 失效
标题翻译：通过增量扫描确定缺陷性质的超声波方法
公开(公告)号：US4475394A
公开(公告)日：1984-10-09
申请号：US340718
申请日：1982-01-19
申请人： Hiroyuki Takeda , Kunio Kudo , Izumi Kobayashi , Yohsuke Ojiri , Mitsuyuki Oda , Sakae Sugiyama
发明人： Hiroyuki Takeda , Kunio Kudo , Izumi Kobayashi , Yohsuke Ojiri , Mitsuyuki Oda , Sakae Sugiyama
IPC分类号： G01N29/07 , G01N29/11 , G01N29/265 , G01N29/44 , G01N29/48 , G01N29/04
CPC分类号： G01N29/4445 , G01N29/07 , G01N29/11 , G01N29/265 , G01N29/343 , G01N29/48 , G01N2291/044
摘要： In ultrasonic flaw inspection for determining the size of a flaw by emitting an ultrasonic wave to a subject via a probe and receiving an ultrasonic echo from said flaw existing inside said subject, changes in the propagation distances of the ultrasonic echoes before and after movement of said probe through a micro-small distance are compared with each other and the ultrasonic echoes are determined to result from the same flaw if the change width falls within a predetermined value determined by the angle of incidence of the ultrasonic wave and the directional angle.
摘要翻译：在超声波探伤中，通过经由探头向对象发射超声波，并从所述对象内存在的所述缺陷接收超声回波来确定缺陷的尺寸，所述超声回波的传播距离的变化在所述如果变化宽度落在由超声波的入射角和方向角度确定的预定值内，则通过微小距离的探测被彼此比较，并且超声波回波被确定为由相同的缺陷引起的。

35. 发明授权

US07923303B2 Method of resin sealing electronic part 有权
标题翻译：树脂密封电子零件的方法
公开(公告)号：US07923303B2
公开(公告)日：2011-04-12
申请号：US12616691
申请日：2009-11-11
申请人： Yoshito Akutagawa , Izumi Kobayashi , Naoyuki Watanabe , Susumu Moriya , Toshiyuki Honda , Noboru Hayasaka
发明人： Yoshito Akutagawa , Izumi Kobayashi , Naoyuki Watanabe , Susumu Moriya , Toshiyuki Honda , Noboru Hayasaka
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.
摘要翻译：一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

36. 发明授权

US07616250B2 Image capturing device 有权
标题翻译：图像捕捉设备
公开(公告)号：US07616250B2
公开(公告)日：2009-11-10
申请号：US10994634
申请日：2004-11-23
申请人： Naoyuki Watanabe , Toshiyuki Honda , Yoshito Akutagawa , Susumu Moriya , Izumi Kobayashi
发明人： Naoyuki Watanabe , Toshiyuki Honda , Yoshito Akutagawa , Susumu Moriya , Izumi Kobayashi
IPC分类号： H04N5/225 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.
摘要翻译：公开了一种图像捕获装置，其包括具有光接收表面的光接收元件，设置在光接收元件的光接收表面上的板状透明构件，以及至少设置在板状透明体的周边的树脂会员。板状透明构件包括位于光接收元件侧的第一主平面和与第一主平面相对的第二主平面。第一主飞机面积比第二主飞机大。

37. 发明申请

US20070196957A1 Method of resin sealing electronic part 有权
标题翻译：树脂密封电子零件的方法
公开(公告)号：US20070196957A1
公开(公告)日：2007-08-23
申请号：US11483593
申请日：2006-07-11
申请人： Yoshito Akutagawa , Izumi Kobayashi , Naoyuki Watanabe , Susumu Moriya , Toshiyuki Honda , Noboru Hayasaka
发明人： Yoshito Akutagawa , Izumi Kobayashi , Naoyuki Watanabe , Susumu Moriya , Toshiyuki Honda , Noboru Hayasaka
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.
摘要翻译：一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

38. 发明授权

US07202460B2 Camera module for compact electronic equipments 有权
标题翻译：相机模块，用于小型电子设备
公开(公告)号：US07202460B2
公开(公告)日：2007-04-10
申请号：US10634752
申请日：2003-08-06
申请人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Toshiyuki Honda
发明人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Toshiyuki Honda
IPC分类号： H01L27/00
CPC分类号： H01L21/4832 , H01L21/563 , H01L21/568 , H01L23/3107 , H01L24/73 , H01L27/146 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/19041 , H04N5/2257 , H01L2924/00012 , H01L2924/00014
摘要： In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.
摘要翻译：在所谓的多芯片型的相机模块中，安装有成像装置和用于处理的半导体元件。半导体元件被模制树脂封装。突出部件由模制树脂在模制树脂的安装表面上形成。在模制树脂的安装表面上形成形成图案布线的金属膜。金属膜也形成在突出部分上，以便与突出部分一起构成外部连接端子。半导体元件的电极电连接到图案布线。突出部分包括围绕半导体元件定位的第一突出部分和形成在安装表面上的半导体元件的安装区域中的第二突出部分。

39. 发明申请

US20060243884A1 Camera module 失效
标题翻译：相机模块
公开(公告)号：US20060243884A1
公开(公告)日：2006-11-02
申请号：US11391706
申请日：2006-03-29
申请人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
发明人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
IPC分类号： H01L27/00
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.
摘要翻译：相机模块包括由附接有图像拾取透镜的透镜单元和附接有成像元件以与图像拾取透镜相对的包装构成的模块结构。在成像元件和图像拾取透镜之间布置有滤光器。滤光器的平坦表面的一部分通过粘合剂固定到过滤器固定部分。滤光器在由滤光器的侧表面形成的端部与平坦表面与过滤器固定部或粘合剂不接触的状态下粘附到过滤器固定部。从滤光器的切割表面产生的微粒子落在滤光片固定部分的外侧。

40. 发明授权

US06890028B2 Headrest apparatus for vehicle 失效
标题翻译：汽车头枕装置
公开(公告)号：US06890028B2
公开(公告)日：2005-05-10
申请号：US10314392
申请日：2002-12-09
申请人： Chinmoy Pal , Izumi Kobayashi
发明人： Chinmoy Pal , Izumi Kobayashi
IPC分类号： A47C7/38 , B60N2/42 , B60N2/48 , B60R21/055
CPC分类号： B60N2/865 , B60N2/853 , B60N2/888
摘要： A vehicle headrest apparatus includes a headrest member including a head restraint section to restrain the head of a seat occupant; and a forward move mechanism to move the head restraint section forward in case of a rear end collision of a vehicle. There is further provided an inclining mechanism to incline the head restraint section forward during a forward movement of the head restraint section, by increasing an amount of a forward movement of an upper part of the head restraint section greater than an amount of a forward movement of a lower part of the head restraint section.
摘要翻译：一种车头枕装置，包括头枕构件，该头枕构件包括用于限制座椅乘员头部的头枕部分; 以及向前移动机构，用于在车辆的后端碰撞的情况下将头枕部分向前移动。另外还设置有倾斜机构，用于通过增加头枕部分的上部部分向前移动的量，使头部约束部分向前移动，使头部约束部分向前移动，头枕部分的下部。

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