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    • 31. 发明申请
    • Thermal Flow Meter
    • 热流量计
    • US20150192441A1
    • 2015-07-09
    • US14407663
    • 2013-05-15
    • Hitachi Automotive Systems, Ltd.
    • Noboru TokuyasuKeiji HanzawaTakeshi MorinoRyosuke DoiAkira UenodanShinobu Tashiro
    • G01F1/69G01F5/00
    • G01F1/69G01F1/6842G01F1/6845G01F1/6965G01F5/00G01F15/14
    • In order to provide a thermal flow meter (300) for improving workability of a flow rate measurement device having a temperature measurement function for the measurement target gas (30) and measurement accuracy for measuring a temperature, the thermal flow meter is structured such that a flow rate measurement circuit package (400) having a protrusion (424) for measuring a gas temperature is formed through resin molding, an inlet port (343) opened to the upstream side of the measurement target gas (30) is formed, a protrusion (424) is arranged inside the inlet port, an inlet port (344) and an outlet port (345) are formed in the front and rear covers (303 and 304) along the protrusion (424), and the measurement target gas (30) received from the inlet port (343) flows along the protrusion (424). Since the measurement target gas (30) subjected to the measurement flows along the protrusion (424), it is possible to reduce influence of the heat from other heat resources and improve measurement accuracy.
    • 为了提供一种用于提高具有测量对象气体(30)的温度测量功能的流量测量装置和测量温度的测量精度的热流量计(300),热流量计的结构使得 通过树脂成型形成具有用于测量气体温度的突起(424)的流量测量电路封装(400),形成向测量对象气体(30)的上游侧开口的入口(343),突出部 424)布置在入口内部,沿着突起(424)在前盖和后盖(303和304)中形成入口端口(344)和出口端口(345),测量目标气体(30) 从所述入口端口(343)接收的所述突出部(424)沿着所述突起(424)流动。 由于经受测量的测量目标气体(30)沿着突起(424)流动,所以可以减少来自其他热源的热量的影响并提高测量精度。
    • 32. 发明申请
    • Thermal Airflow Sensor
    • 热气流传感器
    • US20150168195A1
    • 2015-06-18
    • US14408012
    • 2013-06-10
    • Hitachi Automotive Systems, Ltd.
    • Ryosuke DoiKeiji HanzawaNoboru Tokuyasu
    • G01F1/692
    • G01F1/692G01F1/6845G01F5/00G01P5/12
    • An object of the present invention is to provide a thermal airflow sensor with high detection accuracy. In achieving the above object, this invention provides a thermal flow sensor including: a flow rate detection element that has a diaphragm formed by processing a semiconductor substrate, a heating resistor provided on the diaphragm, and resistance temperature detectors installed upstream and downstream of the heating resistor; and a support member that adhesively holds the flow rate detection element with a sheet adhesive interposed therebetween. The support member includes a communicating hole of which one end has an opening to a cavity provided on the back side of the diaphragm. The sheet adhesive has a ventilating hole formed in an opening area of the communicating hole in the support member.
    • 本发明的目的是提供一种具有高检测精度的热气流传感器。 为实现上述目的,本发明提供了一种热流量传感器,其特征在于,包括:流量检测元件,其具有通过处理半导体基板而形成的振动膜,设置在所述隔膜上的加热电阻器,以及安装在所述加热器的上游和下游的电阻温度检测器 电阻器 以及支撑构件,其将片状粘合剂粘合地保持在流量检测元件上。 支撑构件包括连通孔,其一端具有设置在隔膜背侧的空腔的开口。 片状粘合剂具有形成在支撑构件中的连通孔的开口区域中的通气孔。
    • 36. 发明申请
    • THERMAL FLOW METER
    • 热流量计
    • US20150160054A1
    • 2015-06-11
    • US14407142
    • 2013-05-29
    • Hitachi Automotive Systems, Ltd.
    • Shinobu TashiroKeiji HanzawaNoboru TokuyasuTakeshi MorinoRyosuke DoiAkira Uenodan
    • G01F1/684
    • G01F1/684F02D41/187G01F1/6842G01F1/6845G01F1/696G01F1/6965G01F1/698G01F1/699G01F5/00G01F15/006G01F15/02G01F15/04G01F15/043G01F15/14G01F15/185
    • The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.
    • 本发明提供了一种热流量计300,其减小了用于将电路封装件400相对于壳体302保持和固定的固定部分3721施加到电路封装400上并且具有高可靠性的应力。 在本发明的热流量计中,通过第一树脂成型工序形成嵌入有流量测量电路的电路封装400,通过第二树脂成型工序与固定部302一起形成固定部3721, 封装400由固定部分3721包围,由此电路封装件400被保持并固定到壳体302.为了减少基于固定部分3721的温度变化产生的应力对电路的影响 封装400中,固定部3721由厚部4714和薄部4710构成。由于薄部4710的树脂的厚度小,因此产生的应力小,施加于电路封装400的力 可以减少