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    • 34. 发明授权
    • Vehicular sun visor
    • 车载遮阳板
    • US08740282B2
    • 2014-06-03
    • US12216283
    • 2008-07-02
    • Yutaka Okazaki
    • Yutaka Okazaki
    • B60J3/02
    • B60J3/0239B60J3/0252B60J3/0265
    • A coming-off preventing contacting piece 6 that extendingly projects in the radial direction of a shaft 3 throughout the entire periphery is formed in an insertion-side part 3a of the shaft 3 that turnably supports a sun visor body 1, and a contacted piece 7 with which the coming-off preventing contacting piece 6 contactingly engages is formed on the sun visor body 1 side to prevent the sun visor body 1 from coming off the shaft 3. Thereby, even if the sun visor body 1 receives a high expandingly deploying force of a curtain airbag, the concentrated load per unit area applied to the coming-off preventing contacting piece 6 is kept low, and therefore the coming-off preventing contacting piece 6 is restrained from being broken.
    • 在轴3的插入侧部分3a中形成有一个在轴3的径向方向延伸穿过整个周边的防脱接触件6,其可转动地支撑遮阳板体1,并且接触件7 防晒接触片6与遮阳板主体1接触地形成,从而防止遮阳板1从轴3脱落。因此,即使遮阳板体1受到高的展开力 帘式气囊的每单位面积的集中负荷保持为低,因此防止脱落接触片6被破坏。
    • 37. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08012812B2
    • 2011-09-06
    • US12174252
    • 2008-07-16
    • Yutaka Okazaki
    • Yutaka Okazaki
    • H01L21/336
    • H01L27/1266H01L27/1214H01L27/1277H01L29/41733H01L29/78621H01L29/78648
    • A separation layer is formed over a substrate, an insulating film 107 is formed over the separation layer, a bottom gate insulating film 103 is formed over the insulating film 107, an amorphous semiconductor film is formed over the bottom gate insulating film 103, the amorphous semiconductor film is crystallized to form a crystalline semiconductor film over the bottom gate insulating film 103, a top gate insulating film 105 is formed over the crystalline semiconductor film, top gate electrodes 106a and 106b are formed over the top gate insulating film 105, the separation layer is separated from the insulating film 107, the insulating film 107 is processed to expose the bottom gate insulating film 103, and bottom gate electrodes 115a and 115b in contact with exposed the gate insulating film 103 are formed.
    • 在基板上形成分离层,在分离层上形成绝缘膜107,在绝缘膜107上形成底栅绝缘膜103,在栅极绝缘膜103的上方形成非晶半导体膜, 半导体膜在底栅绝缘膜103上结晶化以形成晶体半导体膜,在晶体半导体膜上形成顶栅绝缘膜105,顶栅极电极106a和106b形成在顶栅绝缘膜105上,分离 层与绝缘膜107分离,处理绝缘膜107以暴露底栅绝缘膜103,形成与露出的栅极绝缘膜103接触的底栅电极115a和115b。
    • 39. 发明授权
    • Focal plane shutter apparatus
    • 焦平面快门装置
    • US07212244B2
    • 2007-05-01
    • US10280089
    • 2002-10-25
    • Shuji IchinoseTakao OgawaYutaka Okazaki
    • Shuji IchinoseTakao OgawaYutaka Okazaki
    • H04N5/238G03B9/40
    • G03B9/40
    • A focal plane shutter apparatus is constructed by a light shielding blade, a fitting pin attached to the blade and an arm which is slidably engaged with the fitting pin to open or close the blade. A surface hardness of the fitting pin is higher than that of the arm. Concretely, the surface hardness of the arm is Hv300 to 600, and the surface hardness of the fitting pin is Hv450 to 1000. The arm and the fitting pin are subjected to chemical polishing treatment. Furthermore, the fitting pin is plated with nickel, chromium, palladium or rhodium. The fitting pin and arm have a substantially equal material hardness, or the material hardness of the fitting pin is higher. As the case may be, the fitting pin or arm may be plated with gold. Such an arrangement can suppress generation and accumulation of abrasion powder in the focal plane shutter apparatus assembled into a digital camera.
    • 焦平面快门装置由遮光叶片,安装在叶片上的装配销和与装配销可滑动地接合以打开或关闭叶片的臂构成。 装配销的表面硬度高于手臂的表面硬度。 具体地说,臂的表面硬度为Hv300〜600,配合销的表面硬度为Hv450〜1000。臂和配合销进行化学抛光处理。 此外,配合销镀镍,铬,钯或铑。 配合销和臂具有大致相同的材料硬度,或装配销的材料硬度较高。 根据情况,配件销或臂可以镀金。 这种布置可以抑制组装成数码相机的焦平面快门装置中磨损粉末的产生和积累。