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31. 发明授权

US07557911B2 Appearance inspection apparatus 有权
标题翻译：外观检查仪
公开(公告)号：US07557911B2
公开(公告)日：2009-07-07
申请号：US11830320
申请日：2007-07-30
申请人： Kenji Oka , Shigeru Matsui
发明人： Kenji Oka , Shigeru Matsui
IPC分类号： G01N21/00
CPC分类号： G01N21/8851 , G01N21/9501
摘要： An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section.
摘要翻译：外观检查装置分析由检测器获得的检测信号的检测特性的差异，以灵活地满足各种检查目的，而不改变电路或软件。该装置包括信号合成部，其根据设定条件合成来自检测器的检测信号。输入操作部分通过信号合成部分设置检测信号的合成条件，并且信息显示部分显示由信号合成部分根据由输入设置的条件合成的合成信号构成的合成图操作部分。

32. 发明授权

US07460220B2 Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected 失效
标题翻译：半导体基板的制造方法以及检查被检查体的图案的缺陷的方法和装置
公开(公告)号：US07460220B2
公开(公告)日：2008-12-02
申请号：US11605242
申请日：2006-11-29
申请人： Shunji Maeda , Yasuhiko Nakayama , Minoru Yoshida , Hitoshi Kubota , Kenji Oka
发明人： Shunji Maeda , Yasuhiko Nakayama , Minoru Yoshida , Hitoshi Kubota , Kenji Oka
IPC分类号： G01N21/00
CPC分类号： G01N21/95607 , G01N21/8806 , G01N21/9501 , G01N21/956 , G01N2021/95615 , G01N2201/0618 , G01N2201/0634
摘要： A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.
摘要翻译：一种检查样本的方法，包括：从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本，并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号，并且检测在样本上形成的多个图案之间的图案的缺陷，其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成从光源。

33. 发明授权

US07181634B2 Apparatus for switching between a combination of operating modes such that the power consumed is reduced relative to the time of switching 有权
标题翻译：用于在操作模式的组合之间切换使得消耗的功率相对于切换时间减小的装置
公开(公告)号：US07181634B2
公开(公告)日：2007-02-20
申请号：US10739512
申请日：2003-12-18
申请人： Takayuki Katoh , Seiichi Kawano , Kenji Oka , Noritishi Yoshiyama
发明人： Takayuki Katoh , Seiichi Kawano , Kenji Oka , Noritishi Yoshiyama
IPC分类号： G06F1/28
CPC分类号： G06F1/3203
摘要： An information processor having a plurality of operating modes differing in power consumption and capable of changing the operating mode according to the amount of processing has periodic switching detection means of performing detection as to whether the information processor is periodically switching from a low-power-consumption operating mode in which the power consumption is lower to a high-power-consumption operating mode in which the power consumption is higher in the plurality of operating modes, and operating mode changing means of changing the operating modes between which the information processor switches to a combination of the operating modes such that the difference between the power consumptions is reduced relative to that at the time of switching between the low-power-consumption operating mode and the high-power-consumption operating mode if the switching cycle detected by the periodic switching detection means is shorter than a set cycle determined in advance.
摘要翻译：具有多个功耗不同并能够根据处理量改变操作模式的操作模式的信息处理器具有执行关于信息处理器是否周期性地从低功耗切换的检测的周期性切换检测装置操作模式，其中功耗低于在多个操作模式中功耗较高的高功耗操作模式;以及操作模式改变装置，其将信息处理器切换到其之间的操作模式如果通过周期性切换检测到的切换周期，则在低功耗操作模式和高功耗操作模式之间切换时，功率差之间的差异减小，检测装置比预先确定的设定循环短。

34. 发明申请

US20060238760A1 Method and apparatus for observing and inspecting defects 有权
标题翻译：观察和检查缺陷的方法和装置
公开(公告)号：US20060238760A1
公开(公告)日：2006-10-26
申请号：US11475667
申请日：2006-06-26
申请人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
发明人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
IPC分类号： G01J4/00
CPC分类号： G01N21/21 , G01N21/9501 , G01N21/956 , G01N21/95607 , G02B21/0016
摘要： A defect inspecting apparatus is disclosed that can detect finer defects with high resolution optical images of those defects, and which makes the difference in contrast greater between fine line patterns of a semiconductor device. The defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要翻译：公开了能够利用这些缺陷的高分辨率光学图像检测更细的缺陷的缺陷检查装置，并且使得半导体器件的细线图案之间的对比度差异更大。缺陷检查装置包括用于安装样品的样品安装装置; 照明和检测装置，用于照亮安装在安装件上的图案样品，并检测由其获得的反射光的光学图像。还包括用于显示由该照明和检测装置检测的光学图像的显示器; 用于在显示器上设置和显示照明和检测装置的光学参数的光学参数设置装置; 以及光学参数调整装置，用于根据由所述光学参数设定装置设定的光学参数来调整对所述照明和检测装置设定的光学参数; 用于存储比较图像数据的存储装置; 以及缺陷检测装置，用于通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。

35. 发明申请

US20050138449A1 Method, service and program for variation reduction in an information processor having multiple power levels 有权
标题翻译：具有多个功率电平的信息处理器的变化减少的方法，服务和程序
公开(公告)号：US20050138449A1
公开(公告)日：2005-06-23
申请号：US10739515
申请日：2003-12-18
申请人： Takayuki Katoh , Seiichi Kawano , Kenji Oka , Noritoshi Yoshiyama
发明人： Takayuki Katoh , Seiichi Kawano , Kenji Oka , Noritoshi Yoshiyama
IPC分类号： G06F1/26 , G06F1/32
CPC分类号： G06F1/3203 , G06F1/263
摘要： An information processor having a plurality of operating modes differing in power consumption and capable of changing the operating mode according to the amount of processing has periodic switching detection means of performing detection as to whether the information processor is periodically switching from a low-power-consumption operating mode in which the power consumption is lower to a high-power-consumption operating mode in which the power consumption is higher in the plurality of operating modes, and operating mode changing means of changing the operating modes between which the information processor switches to a combination of the operating modes such that the difference between the power consumptions is reduced relative to that at the time of switching between the low-power-consumption operating mode and the high-power-consumption operating mode if the switching cycle detected by the periodic switching detection means is shorter than a set cycle determined in advance.
摘要翻译：具有多个功耗不同并能够根据处理量改变操作模式的操作模式的信息处理器具有执行关于信息处理器是否周期性地从低功耗切换的检测的周期性切换检测装置操作模式，其中功耗低于在多个操作模式中功耗较高的高功耗操作模式;以及操作模式改变装置，其将信息处理器切换到其之间的操作模式如果通过周期性切换检测到的切换周期，则在低功耗操作模式和高功耗操作模式之间切换时，功率差之间的差异减小，检测装置比预先确定的设定循环短。

36. 发明授权

US06888959B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US06888959B2
公开(公告)日：2005-05-03
申请号：US09791682
申请日：2001-02-26
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/956 , G06T7/00 , H01L21/66 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： In order to inspect a substance to be detected such as a foreign substance in accordance with the condition of the surface of a sample to be inspected such as a semiconductor substrate manufactured in various manufacturing processes under a suitable inspection condition, this method includes the steps of: inspecting a substance to be detected on a sample to be inspected under a plurality inspection conditions, which are previously set, as a single unit to detect at least the data of a detected substance for each of the plurality of inspection conditions; checking the data of the detected substance for the respective inspection conditions against each other to make check data; analyzing the detected substance based on the check data of the detected substance to classify the detected substance; adding the data of classified detected substance to the coordinate data of the detected substance for the respective inspection conditions to make data relating to the classified detected substance for the respective inspection conditions; and selecting a suitable inspection condition based on the data relating to the classified detected substance for the respective inspection conditions.
摘要翻译：为了在适当的检查条件下，根据在各种制造工序中制造的半导体衬底等被检测样品的表面状况，检查异物等异物，该方法包括以下步骤：在预先设定的多个检查条件下检查待检测样品上检测到的物质作为单个单元，至少检测多个检查条件中检测物质的数据; 检查相应检查条件的检测物质的数据，以进行检查数据; 基于检测到的物质的检查数据分析检测到的物质以对检测到的物质进行分类; 将各种检测条件的检测物质的坐标数据相加，对各检查条件进行分类检测物质的数据的添加; 以及基于与各检查条件的分类检测物质有关的数据来选择合适的检查条件。

37. 发明授权

US06690469B1 Method and apparatus for observing and inspecting defects 失效
标题翻译：观察和检查缺陷的方法和装置
公开(公告)号：US06690469B1
公开(公告)日：2004-02-10
申请号：US09397334
申请日：1999-09-14
申请人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
发明人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
IPC分类号： G01J400
CPC分类号： G01N21/21 , G01N21/9501 , G01N21/956 , G01N21/95607 , G02B21/0016
摘要： A defect inspecting apparatus is disclosed that can detect finer defects with high resolution optical images of those defects, and which makes the difference in contrast greater between fine line patterns of a semiconductor device. The defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要翻译：公开了能够利用这些缺陷的高分辨率光学图像检测更细的缺陷的缺陷检查装置，并且使得半导体器件的细线图案之间的对比度差异更大。缺陷检查装置包括用于安装样品的样品安装装置; 照明和检测装置，用于照亮安装在安装件上的图案样品，并检测由其获得的反射光的光学图像。还包括用于显示由该照明和检测装置检测的光学图像的显示器; 用于在显示器上设置和显示照明和检测装置的光学参数的光学参数设置装置; 以及光学参数调整装置，用于根据由所述光学参数设定装置设定的光学参数来调整对所述照明和检测装置设定的光学参数; 用于存储比较图像数据的存储装置; 以及缺陷检测装置，用于通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。

38. 发明授权

US06507417B1 Method and apparatus for picking up 2D image of an object to be sensed 失效
标题翻译：拾取被感测物体的2D图像的方法和装置
公开(公告)号：US06507417B1
公开(公告)日：2003-01-14
申请号：US09105222
申请日：1998-06-26
申请人： Hiroshi Makihira , Shunji Maeda , Kenji Oka , Minoru Yoshida , Yasuhiko Nakayama
发明人： Hiroshi Makihira , Shunji Maeda , Kenji Oka , Minoru Yoshida , Yasuhiko Nakayama
IPC分类号： H04N104
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： An image pickup device for sensing a two-dimensional (2D) image while causing a projected image of an object to be sensed being projected onto a linear image sensor to relatively move with respect to the linear image sensor in a direction (V scanning) perpendicular to the internal scan (H scan) direction of the linear image sensor. This device includes a position detector circuit that detects the position of the object to be sensed, and a pixel size modifier circuit for changing or modifying the setup configuration of a pixel size in the V scan direction of the linear image sensor on the basis of a position detection signal indicative of the position of the to-be-sensed object as detected by the position detector circuit. The pixel size modifier circuit is operable based on the object position detection signal to periodically change the interval of H-scanning start pulses of the linear image sensor.
摘要翻译：用于感测二维（2D）图像同时使待检测对象的投影图像投影到线性图像传感器上的图像拾取装置相对于线性图像传感器在垂直方向（V扫描）上相对移动到线性图像传感器的内部扫描（H扫描）方向。该装置包括检测待感测物体的位置的位置检测器电路和用于基于线性图像传感器的V扫描方向改变或修改像素尺寸的设置配置的像素尺寸修正器电路位置检测信号，其指示由位置检测器电路检测到的待感测对象的位置。像素尺寸修正器电路可以基于物体位置检测信号进行操作，以周期性地改变线性图像传感器的H扫描开始脉冲的间隔。

39. 发明授权

US06456951B1 Method and apparatus for processing inspection data 有权
标题翻译：检验数据处理方法和装置
公开(公告)号：US06456951B1
公开(公告)日：2002-09-24
申请号：US09553944
申请日：2000-04-21
申请人： Shunji Maeda , Yasuhiro Yoshitake , Kenji Oka , Masataka Shiba , Atsushi Shimoda
发明人： Shunji Maeda , Yasuhiro Yoshitake , Kenji Oka , Masataka Shiba , Atsushi Shimoda
IPC分类号： G06F1132
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： The present invention is related to an inspection data processing method for processing inspection data composed of coordinates data and characteristic quantity data about a defect generated on a subject of inspection detected with a visual inspection apparatus. The inspection data processing method comprises the following steps: a preparation step of storing a first fatality judgment data group corresponding to the kinds of areas on the subject of inspection and a second fatality judgment data group corresponding to categories of defects beforehand; a first fatality judgment step of judging a first fatality level of a defect corresponding to the kind of an area where the defect exists; a category giving step of giving category to the defect in the inspection data; and a second fatality judgment step of judging a second fatality of the defect based on second fatality judgment data selected according to the category which are given based on the first fatality level of defects judged in the first fatality judgment step.
摘要翻译：本发明涉及一种用于处理检查数据的检查数据处理方法，该检查数据由关于在用目视检查装置检测到的检查对象上产生的缺陷的坐标数据和特征量数据组成。检查数据处理方法包括以下步骤：预先存储与检查对象的区域的种类对应的第一死亡判定数据组和对应于缺陷类别的第二死亡判定数据组的准备步骤; 判断与存在缺陷的区域的种类相对应的缺陷的第一死亡水平的第一死亡判定步骤; 类别给出检查数据中的缺陷类别的步骤; 以及第二死亡判定步骤，基于根据在第一死亡判定步骤中判断的缺陷的第一死亡水平给出的根据类别选择的第二死亡判定数据来判断缺陷的第二死亡。

40. 发明授权

US5774222A Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected 失效
标题翻译：半导体衬底的制造方法以及用于检查待检查物体上的图案缺陷的方法和装置
公开(公告)号：US5774222A
公开(公告)日：1998-06-30
申请号：US539886
申请日：1995-10-06
申请人： Shunji Maeda , Yasuhiko Nakayama , Minoru Yoshida , Hitoshi Kubota , Kenji Oka
发明人： Shunji Maeda , Yasuhiko Nakayama , Minoru Yoshida , Hitoshi Kubota , Kenji Oka
IPC分类号： G01N21/95 , G01N21/956 , G01N21/88
CPC分类号： G01N21/8806 , G01N21/9501 , G01N21/956 , G01N21/95607 , G01N2021/95615 , G01N2201/0618 , G01N2201/0634
摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.
摘要翻译：一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

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