会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 33. 发明授权
    • Deposited film forming process
    • 沉积成膜工艺
    • US06335281B1
    • 2002-01-01
    • US09334176
    • 1999-06-16
    • Yoshio SegiHideaki MatsuokaHiroyuki KatagiriYasuyoshi Takai
    • Yoshio SegiHideaki MatsuokaHiroyuki KatagiriYasuyoshi Takai
    • H01L2144
    • C23C16/54C23C16/4581C23C16/46
    • In a deposited film forming process or apparatus, a deposited film is formed on a film-forming substrate by reduced-pressure vapor phase growth. The film-forming substrate is set on an auxiliary substrate and an auxiliary-substrate cap member is set at the upper part thereof. A maximum temperature difference between temperature at the upper end of the film-forming substrate and the temperature at the lower end of the auxiliary-substrate cap member provided on the film-forming substrate at its upper part is so controlled as to be not greater than a prescribed value so that a film deposited on the auxiliary-substrate cap member is improved in adhesion. Any deposits of films on the part other than the film-forming substrate can be prevented from coming off and scattering on the film-forming substrate so that deposited films having uniform film thickness and film quality can steadily be formed and also faulty images can occur less frequently. It is also possible to achieve improvements of various properties of films formed, film forming rate, reproducibility, and productivity so that yield can dramatically be improved in mass production.
    • 在沉积膜形成工艺或装置中,通过减压气相生长在成膜基板上形成沉积膜。 成膜基板设置在辅助基板上,辅助基板盖部件设置在其上部。 成膜基板的上端的温度与设置在成膜基板上部的辅助基板盖部件的下端的温度之间的最大温度差被控制为不大于 规定值,使得沉积在辅助基板盖构件上的膜提高了粘附性。 可以防止膜形成基板以外的部分的沉积物在成膜基板上脱落并散射,从而可以稳定地形成膜厚度和膜质量均匀的沉积膜,并且可以发生较少的图像 经常。 也可以实现成膜的各种性能,成膜速度,再现性和生产率的改善,从而大量提高产量。
    • 36. 发明授权
    • Method for transferring functional regions, LED array, LED printer head, and LED printer
    • 传输功能区域的方法,LED阵列,LED打印机头和LED打印机
    • US08415230B2
    • 2013-04-09
    • US13254024
    • 2010-03-01
    • Takao YoneharaYasuyoshi Takai
    • Takao YoneharaYasuyoshi Takai
    • H01L21/30H01L21/46
    • B41J2/45H01L21/6835H01L24/83H01L33/0079H01L2221/68359H01L2924/14H01L2924/3025H01L2924/00
    • Provided is a method for transferring, onto a second substrate, at least one of functional regions arranged and joined to a first separation layer that is disposed on a first substrate and that becomes separable by a treatment, in which regions on the second substrate where the functional regions are to be transferred have a second separation layer that becomes separable by a treatment. The method includes a step of joining the first substrate to the second substrate by bonding such that the functional regions contact the second separation layer; a step of separating the functional regions from the first substrate at the first separation layer; and a step of, before or after the step of separation, forming separation grooves penetrating through the second substrate and the second separation layer from a surface of the second substrate, the surface being opposite to a surface having the second separation layer thereon.
    • 提供了一种用于将布置并连接到第一分离层的功能区域中的至少一个转移到第二基板上的方法,第一分离层设置在第一基板上并且通过处理可分离,其中第二基板上的区域 要转移功能区域具有可通过处理分离的第二分离层。 该方法包括通过接合将第一基板接合到第二基板的步骤,使得功能区域接触第二分离层; 在第一分离层处分离功能区域与第一基板的步骤; 以及在分离步骤之前或之后的步骤,从第二基板的表面形成穿过第二基板和第二分离层的分离槽,该表面与其上具有第二分离层的表面相对。