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31. 发明授权

US07101171B2 Molding die for disc substrate 失效
标题翻译：圆盘基片成型模具
公开(公告)号：US07101171B2
公开(公告)日：2006-09-05
申请号：US10311853
申请日：2002-04-26
申请人： Osamu Matsuura , Kazuhiro Miura , Hideaki Yoshimura , Shinsuke Kishi
发明人： Osamu Matsuura , Kazuhiro Miura , Hideaki Yoshimura , Shinsuke Kishi
IPC分类号： B29D11/00
CPC分类号： B29C45/263 , B29C45/34 , B29C2045/2648 , B29L2017/005 , Y10S425/81
摘要： A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4. The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3. In addition, a cavity 6 as a closed space is formed between a stamper 1b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2b of a moving side mirror 2. While the moving side mirror 2 is being press-contracted to the fixed side mirror 1, when a resin material is filled into the cavity 6, the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4, a plurality of openings 4a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.
摘要翻译：将树脂环51压配合到形成在互锁环4的内周面上的凹槽部分中。树脂环51由特氟隆等硬质树脂构成。作为低摩擦润滑构件的树脂环51插入在互锁环4和外周环3之间。此外，在作为固定侧反射镜1的成型面的压模1b和移动侧反射镜2的镜侧成型面2b之间，形成作为封闭空间的空腔6。当移动侧反射镜2被压缩到固定侧反射镜1时，当树脂材料被填充到空腔6中时，外周环3以预定的间隙可滑动地保持在移动侧反射镜2的凹槽中。在互锁环4中，形成有多个开口部4a，其释放由填充到空腔6中的盘状树脂材料产生的气体。

32. 发明授权

US06879554B2 Disc player capable of reproducing a partially recorded disc 失效
标题翻译：光盘播放机能够再现部分记录的光盘
公开(公告)号：US06879554B2
公开(公告)日：2005-04-12
申请号：US09749631
申请日：2000-12-28
申请人： Takao Shimamura , Kenichi Takahashi , Shinya Honjou , Takashi Sasaki , Koichi Kikuchi , Yoshihiro Hashizuka , Hideaki Yoshimura , Takashi Suzuki
发明人： Takao Shimamura , Kenichi Takahashi , Shinya Honjou , Takashi Sasaki , Koichi Kikuchi , Yoshihiro Hashizuka , Hideaki Yoshimura , Takashi Suzuki
IPC分类号： G11B7/0037 , G11B7/005 , G11B7/007 , G11B7/085 , G11B7/09 , G11B19/12 , G11B20/12 , G11B27/10 , G11B27/22 , G11B27/32 , G11B27/34 , G11B27/36 , G11B7/00
CPC分类号： G11B19/12 , G11B7/0037 , G11B7/005 , G11B7/007 , G11B7/08505 , G11B7/0945 , G11B20/1252 , G11B27/105 , G11B27/22 , G11B27/329 , G11B27/34 , G11B27/36 , G11B2220/2545
摘要： A method for reproducing information recorded on a disc is provided. In the method, a reproduction signal is irradiated towards the disc to produce a corresponding read signal. Also, the reproduction signal is positioned at a first position within a non-program area of the disc and is attempted to be focused on the disc. If the reproduction signal is focused on the disc, the method determines if the read signal has a valid signal level. If the read signal does not have the valid signal level when the reproduction signal is positioned at the first position, the reproduction signal is moved to a second position within a program area of the disc while the reproduction signal remains focused on the disc. Then, the method determines if the read signal has the valid signal level when the reproduction signal is positioned at the second position. Also, a disc player that employs the method and a software program that instruct a controller to perform operations in accordance with the method are also provided.
摘要翻译：提供了一种用于再现记录在盘上的信息的方法。在该方法中，将再现信号照射到盘以产生相应的读取信号。此外，再现信号位于盘的非程序区域内的第一位置，并且尝试将其聚焦在盘上。如果再现信号被聚焦在盘上，则该方法确定读取信号是否具有有效的信号电平。如果读取信号在再现信号位于第一位置时没有有效信号电平，则再现信号被移动到盘的程序区域内的第二位置，同时再现信号保持聚焦在盘上。然后，当再现信号位于第二位置时，该方法确定读信号是否具有有效信号电平。此外，还提供了采用该方法的光盘播放器和指示控制器根据该方法执行操作的软件程序。

33. 发明授权

US06841103B2 Injection molding apparatus and method 失效
标题翻译：注射成型装置及方法
公开(公告)号：US06841103B2
公开(公告)日：2005-01-11
申请号：US09778805
申请日：2001-02-08
申请人： Shinsuke Kishi , Hideaki Yoshimura
发明人： Shinsuke Kishi , Hideaki Yoshimura
IPC分类号： B29C45/64 , B29C45/00 , B29C45/46 , B29C45/76 , B29C45/77 , B29C45/80
CPC分类号： B29C45/77 , B29C45/7653 , B29C2045/2687 , B29C2945/76006 , B29C2945/76257 , B29C2945/76381 , B29C2945/76505 , B29C2945/76545 , B29C2945/76648 , B29C2945/76709 , B29C2945/76765 , B29C2945/76943
摘要： The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
摘要翻译：本发明涉及一种能够防止过度包装的发生的注射成型装置和方法。该装置包括一对在其间形成多个空腔的模具; 用于在规定压力下封闭所述一对模具的封闭装置; 注射装置，用于在规定的压力下将熔融树脂注射到相应的空腔中; 以及用于控制模具关闭装置和注射装置的控制装置。此外，该装置包括多个压力传感器，用于检测相应空腔中的相应压力;以及控制装置，其控制注射装置和/或模具闭合装置以降低熔融树脂的注射速率和/或关闭力当根据来自各个压力传感器的感测值发现空腔之间的压力差大于规定值时，模具，否则停止喷射和/或模具关闭操作。

34. 发明授权

US08186053B2 Circuit board and method of manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US08186053B2
公开(公告)日：2012-05-29
申请号：US12271519
申请日：2008-11-14
申请人： Kishio Yokouchi , Hideaki Yoshimura , Katsuya Fukase
发明人： Kishio Yokouchi , Hideaki Yoshimura , Katsuya Fukase
IPC分类号： H01K3/10 , B22F7/00
CPC分类号： H01L23/49822 , H01L23/145 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/056 , H05K3/426 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/12035 , H01L2224/0401
摘要： A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.
摘要翻译：电路板具有以细间距布置的电镀通孔，并且满足与强度和热膨胀系数等特性有关的要求。一种电路板的制造方法，其特征在于，包括：通过热压缩形成芯部的步骤，通过设置碳纤维形成的预浸料，以在电镀通孔穿过的位置处产生开口，并用树脂浸渍碳纤维; 在芯部的开口部的位置形成贯通孔内的通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰碳纤维的位置处形成电镀通孔，从而制造芯基板。

35. 发明申请

US20080006915A1 Semiconductor package, method of production of same, printed circuit board, and electronic apparatus 审中-公开
标题翻译：半导体封装，生产方法，印刷电路板和电子设备
公开(公告)号：US20080006915A1
公开(公告)日：2008-01-10
申请号：US11641718
申请日：2006-12-20
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/495
CPC分类号： H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83104 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.
摘要翻译：具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

36. 发明授权

US07222316B2 Board design aiding apparatus, board design aiding method and board design aiding program 有权
标题翻译：板设计辅助设备，板设计辅助方法和板设计辅助程序
公开(公告)号：US07222316B2
公开(公告)日：2007-05-22
申请号：US10986135
申请日：2004-11-12
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F17/50 , G01R31/02
CPC分类号： G06F17/5068 , H05K3/0005 , H05K3/4602 , H05K2201/0191
摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
摘要翻译：简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规则获得板的面积的平均厚度，用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

37. 发明授权

US07115444B2 Semiconductor device with improved heat dissipation, and a method of making semiconductor device 失效
公开(公告)号：US07115444B2
公开(公告)日：2006-10-03
申请号：US11235270
申请日：2005-09-27
申请人： Hideaki Yoshimura
发明人： Hideaki Yoshimura
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/32 , H01L21/4871 , H01L21/4882 , H01L23/36 , H01L23/3677 , H01L23/3733 , H01L23/3737 , H01L23/433 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.

38. 发明授权

US06646962B2 Apparatus for detecting dropout, an error signal extracting unit, and unit for identifying type of dropout in an optical pickup 失效
标题翻译：用于检测压差的装置，误差信号提取单元和用于识别光学拾取器中的压差类型的单元
公开(公告)号：US06646962B2
公开(公告)日：2003-11-11
申请号：US09793729
申请日：2001-02-27
申请人： Takashi Sasaki , Takashi Suzuki , Takao Shimamura , Shinya Honjou , Kenichi Takahashi , Yoshihiro Hashizuka , Koichi Kikuchi , Hideaki Yoshimura
发明人： Takashi Sasaki , Takashi Suzuki , Takao Shimamura , Shinya Honjou , Kenichi Takahashi , Yoshihiro Hashizuka , Koichi Kikuchi , Hideaki Yoshimura
IPC分类号： G11B700
CPC分类号： G11B7/0948 , G11B7/0941
摘要： A servo control apparatus of an optical pickup is provided for reading recorded information from a recording medium and generates a read signal. The apparatus includes an error signal extracting part for extracting an error signal which indicates a deviation amount of a reading position from a target reading position of the optical pickup; a drive part for driving the optical pickup to change the reading position; an equalizer for equalizing the error signal and supplying a drive signal which indicates a driving amount of the drive part; a detecting part for detecting a dropout portion in the read signal; an identifying part for identifying a form of the dropout portion detected in the detecting part; and a controller. The controller performs control to change a gain of the equalizer in accordance with the identified form of the dropout portion.
摘要翻译：提供了一种用于从记录介质读取记录信息并产生读取信号的光学拾取器的伺服控制装置。该装置包括误差信号提取部分，用于从光学拾取器的目标读取位置提取指示读取位置的偏差量的误差信号; 用于驱动光学拾取器以改变读取位置的驱动部件; 均衡器，用于均衡误差信号并提供指示驱动部分的驱动量的驱动信号; 用于检测读取信号中的压差部分的检测部分; 用于识别在所述检测部分中检测到的所述丢失部分的形式的识别部分; 和控制器。控制器执行控制以根据所识别的出口部分的形式改变均衡器的增益。

39. 发明授权

US06600705B2 Method of and apparatus for setting servo adjustment value, reproducing information and recording information under servo control using servo adjustment value 失效
标题翻译：用于设定伺服调整值的方法和装置，使用伺服调整值在伺服控制下再现信息和记录信息
公开(公告)号：US06600705B2
公开(公告)日：2003-07-29
申请号：US09745258
申请日：2000-12-20
申请人： Takashi Suzuki , Takashi Sasaki , Hideaki Yoshimura , Koichi Kikuchi , Yoshihiro Hashizuka , Shinya Honjou , Kenichi Takahashi , Takao Shimamura
发明人： Takashi Suzuki , Takashi Sasaki , Hideaki Yoshimura , Koichi Kikuchi , Yoshihiro Hashizuka , Shinya Honjou , Kenichi Takahashi , Takao Shimamura
IPC分类号： G11B700
CPC分类号： G11B7/0945 , G11B7/0941 , G11B2007/0013
摘要： A servo adjustment apparatus for setting an adjustment value for servo control of at least one of optical recording of information on information recording surfaces and optical reproduction of information recorded on the information recording surfaces, is provided. A setting device sets an adjustment value corresponding to one of the information recording surfaces. Another setting device sets another adjustment value corresponding to another one of the surfaces other than the one of information recording surfaces. Then a calculation device calculates a relational value indicating a relationship between the adjustment value and another adjustment value. A storage device stores calculated relational value. A resetting device resets the adjustment value using another adjustment value set previously and the relational value when the adjustment value is reset, and resets another adjustment value using the adjustment value set previously and the relational value when another adjustment value is reset.
摘要翻译：提供一种伺服调整装置，用于设置用于信息记录表面上的信息的光学记录和记录在信息记录表面上的信息的光学再现中的至少一个的伺服控制的调整值。设定装置设定与信息记录面之一对应的调整值。另一设定装置设定与信息记录面以外的其他表面对应的另一调整值。然后，计算装置计算表示调整值与另一调整值之间的关系的关系值。存储设备存储计算的关系值。复位装置使用先前设定的另一个调整值和调整值复位时的关系值来重置调整值，并使用先前设置的调整值和另一个调整值复位时的关系值复位另一个调整值。

40. 发明授权

US06576317B2 Optical disc and injection compression molding die for producing the same 有权
标题翻译：光盘和注塑压模用于生产它
公开(公告)号：US06576317B2
公开(公告)日：2003-06-10
申请号：US09774701
申请日：2001-02-01
申请人： Hideaki Yoshimura , Shinsuke Kishi
发明人： Hideaki Yoshimura , Shinsuke Kishi
IPC分类号： B32B302
CPC分类号： B29C45/263 , B29C2045/2667 , G11B7/24 , G11B7/263 , Y10T428/21
摘要： An optical disc capable of preventing damages on a printing plate and an injection compression molding die capable of producing such optical disc substrate without raising the accuracy of the die are provided. An optical disc substrate according to one embodiment of the present invention has a ring-formed projected portion on the outer periphery of the printable plane slightly recessed inwardly from the outer edge of the disc. Such optical disc substrate can be produced using a molding die in which a readout-side mirror has a ring-formed groove on the inner surface thereof in the vicinity of a sliding portion between such readout-side mirror and a cavity ring.
摘要翻译：提供了一种能够防止印版上的损坏的光盘和能够制造这种光盘基板的注射压缩成型模具，而不提高模具的精度。根据本发明的一个实施例的光盘基板在可打印平面的外周上具有从盘的外边缘向内略微凹入的环形突出部分。这种光盘基板可以使用其中读出侧反射镜在其内表面上的这种读出侧反射镜和腔环之间的滑动部分附近的环形凹槽的成型模具来制造。

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