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    • 31. 发明授权
    • Methods of stabilizing thiophene derivatives
    • 稳定噻吩衍生物的方法
    • US07449588B2
    • 2008-11-11
    • US11744264
    • 2007-05-04
    • Friedrich JonasKlaus WussowKnud Reuter
    • Friedrich JonasKlaus WussowKnud Reuter
    • C07D333/16C07D495/06
    • C07D495/04
    • Methods of stabilizing thiophene derivatives of the general formula (I) by treatment with basic compounds: wherein R1 and R2 each independently represents a moiety selected from the group consisting of hydrogen, optionally substituted C1-20 alkyl groups which can contain up to 5 heteroatoms selected from the group consisting of oxygen and sulfur, optionally substituted C1-20 oxyalkyl groups which can contain up to 5 heteroatoms selected from the group consisting of oxygen and sulfur, or wherein R1 and R2 together represent a fused cyclic moiety selected from the group consisting of optionally substituted C1-20 dioxyalkylene groups and C1-20 dioxyarylene groups; and stabilized thiophene derivatives that can be prepared by such methods.
    • 通过用碱性化合物处理来稳定通式(I)的噻吩衍生物的方法:其中R 1和R 2各自独立地表示选自氢 ,任选取代的C 1-20烷基,其可以含有至多5个选自氧和硫的杂原子,任选取代的C 1-20烷氧基,其可以 含有多至5个选自氧和硫的杂原子,或其中R 1和R 2一起代表稠合的环状部分,其选自任选取代的 C 1-20二氧亚烷基和C 1-20二取代的亚芳基; 和可以通过这些方法制备的稳定的噻吩衍生物。
    • 37. 发明授权
    • Process for producing rigid and flexible circuits
    • 生产刚性和柔性电路的工艺
    • US5935405A
    • 1999-08-10
    • US926111
    • 1997-09-09
    • Gerhard-Dieter WolfFriedrich Jonas
    • Gerhard-Dieter WolfFriedrich Jonas
    • H05K3/10H05K3/18H05K3/42C25D5/02
    • H05K3/188C25D5/022H05K3/108H05K2201/0329H05K2203/1142H05K3/426
    • Rigid or flexible circuits of electrically conductor tracks can be produced on flexible or rigid, non-conductive support materials bya) coating the surfaces of the support materials including existing drill holes with a primer and a conductive polymer, preferably poly-3,4-ethylendioxythiophene, which may contain binders,b) applying an electroplating resist in the form of the negative image of the conductor tracks,c) metallizing by electroplating the surface kept free by the electroplating resist, including existing drill holes, in the form of the positive image of the conductor tracks,d) removing the electroplating resist ande) removing the conductive polymer, which had been below the electroplating resist, or converting it to a non-conductive form, wherein the conductor tracks are electrically interconnected during the metallizing step by the layer of conductive polymer, thereby avoiding the need to individually contact each conductor track.
    • 电导体轨道的刚性或柔性电路可以通过以下方式在柔性或刚性的非导电支撑材料上制造:a)用底漆和导电聚合物涂覆包括现有钻孔的载体材料的表面,优选聚3,4- 乙烯二氧噻吩,其可以包含粘合剂,b)以导体轨迹的负像形式施加电镀抗蚀剂,c)通过电镀由电镀抗蚀剂保持的表面(包括现有的钻孔)以阳性形式进行金属化 导体轨迹的图像,d)去除电镀抗蚀剂,以及e)去除已经在电镀抗蚀剂下面的导电聚合物,或将其转换成非导电形式,其中导体轨道在金属化步骤期间电互连, 导电聚合物层,从而避免需要单独接触每个导体轨道。