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31. 发明授权

US07956443B2 Through-wafer interconnects for photoimager and memory wafers 有权
标题翻译：用于光刻机和存储晶圆的透晶片互连
公开(公告)号：US07956443B2
公开(公告)日：2011-06-07
申请号：US12725724
申请日：2010-03-17
申请人： Salman Akram , Charles M. Watkins , Mark Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
发明人： Salman Akram , Charles M. Watkins , Mark Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
IPC分类号： H01L23/485
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

32. 发明授权

US07709279B2 Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices 有权
标题翻译：用于测试半导体器件的方法，用于在测试期间保护其免受静电放电事件的方法，以及用于制造用于测试半导体器件的插入件的方法
公开(公告)号：US07709279B2
公开(公告)日：2010-05-04
申请号：US10827806
申请日：2004-04-20
申请人： David R. Hembree , Salman Akram
发明人： David R. Hembree , Salman Akram
IPC分类号： H01L21/66 , H01L23/58
CPC分类号： G01R1/18 , H01L22/34 , H01L23/5256 , H01L27/0251 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method for providing external electrostatic discharge (ESD) protection to a semiconductor device, which may or may not include its own ESD protection, are provided. An ESD structure may be associated with each interconnect, either individually or shared between two or more interconnects. Each interconnect includes a contact tip for establishing a temporary electrical connection with a bond pad of the semiconductor device and a contact pad for electrically interfacing the bond pad with external burn-in and/or test equipment. The ESD structure may be implemented, for example, as a fusible element or a shunting element, such as a pair of diodes, a diode-resistor network, or a pair of transistors. The interconnect may be employed as part of an insert including a plurality of interconnects that provides ESD protection to a plurality of integrated circuits of at least one semiconductor device.
摘要翻译：提供了一种用于向半导体器件提供外部静电放电（ESD）保护的装置和方法，其可以包括或可以不包括其自身的ESD保护。 ESD结构可以与每个互连相关联，单独地或在两个或更多个互连之间共享。每个互连包括用于与半导体器件的接合焊盘建立临时电连接的接触尖端和用于将接合焊盘与外部老化和/或测试设备电接口的接触焊盘。 ESD结构可以实现为例如可熔元件或分流元件，例如一对二极管，二极管 - 电阻器网络或一对晶体管。互连可以用作插入件的一部分，其包括向至少一个半导体器件的多个集成电路提供ESD保护的多个互连。

33. 发明授权

US07531453B2 Microelectronic devices and methods for forming interconnects in microelectronic devices 有权
标题翻译：用于在微电子器件中形成互连的微电子器件和方法
公开(公告)号：US07531453B2
公开(公告)日：2009-05-12
申请号：US12027106
申请日：2008-02-06
申请人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
发明人： Kyle K. Kirby , Salman Akram , David R. Hembree , Sidney B. Rigg , Warren M. Farnworth , William M. Hiatt
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/48 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/4038 , H05K3/422 , H05K3/423 , H05K2201/0305 , H05K2201/09827 , H05K2203/072 , H05K2203/1147 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
摘要翻译：本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。该方法然后包括用导电材料填充通道。

34. 发明授权

US07189954B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
公开(公告)号：US07189954B2
公开(公告)日：2007-03-13
申请号：US10894262
申请日：2004-07-19
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L31/0232 , H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

35. 发明授权

US07155300B2 Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs 有权
公开(公告)号：US07155300B2
公开(公告)日：2006-12-26
申请号：US10401209
申请日：2003-03-27
申请人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
发明人： Salman Akram , Warren M. Farnworth , Derek J. Gochnour , David R. Hembree , Michael E. Hess , John O. Jacobson , James M. Wark , Alan G. Wood
IPC分类号： G06F19/00
CPC分类号： G06F11/006 , H01L2223/5444
摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC's. The ID codes of the IC's are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC's is then accessed, and additional repair procedures the IC's may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.

36. 发明授权

US07115961B2 Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices 有权
标题翻译：封装的微电子成像装置和封装微电子成像装置的方法
公开(公告)号：US07115961B2
公开(公告)日：2006-10-03
申请号：US10925502
申请日：2004-08-24
申请人： Charles M. Watkins , David R. Hembree , Peter A. Benson , Salman Akram
发明人： Charles M. Watkins , David R. Hembree , Peter A. Benson , Salman Akram
IPC分类号： H01L31/203
CPC分类号： H01L27/14625 , H01L24/94 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.
摘要翻译：本文公开了微电子成像装置和包装微电子成像装置的方法。在一个实施例中，微电子成像装置包括具有集成电路的微电子管芯，电耦合到集成电路的图像传感器，以及电耦合到集成电路的多个接合焊盘。所述成像装置还包括覆盖在所述图像传感器上的盖和在所述盖中和/或盖上的多个互连件，其电耦合到所述管芯的相应接合焊盘。互连件为模具的焊盘提供外部电触头。互连可以延伸穿过盖或沿着盖的表面。

37. 发明授权

US07090750B2 Plating 失效
标题翻译：电镀
公开(公告)号：US07090750B2
公开(公告)日：2006-08-15
申请号：US10228505
申请日：2002-08-26
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： C25D17/00
CPC分类号： H01L21/67086 , C25D5/08 , C25D17/001 , C25F7/00 , H01L21/67051 , H01L21/67057 , H01L21/6708
摘要： An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate using a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.
摘要翻译：一种用于使用第一水平卡盘处理衬底以沉积，清洁或蚀刻衬底上的材料的装置和方法，多个衬底附着并带电的第一水平卡盘。与第一个水平卡盘密切相邻的是一个共同延伸的水平第二卡盘，它在每个基板的所有部分上接收和反射反应溶液。在反应过程中，两个卡盘基本上浸没在罐内的反应溶液中。至少一个卡盘从控制臂附接和控制。在反应过程中，至少一个卡盘以垂直轴线以慢速旋转。两个卡盘的旋转轴线可以重合，或者轴线可能彼此偏移，和/或一个或两个轴线可能偏离卡盘中心点。其中一个卡盘也可以相对于另一个卡盘在垂直方向周期性地移动。

38. 发明授权

US06939145B2 Spring element for use in an apparatus for attaching to a semiconductor and a method of making 失效
公开(公告)号：US06939145B2
公开(公告)日：2005-09-06
申请号：US10458016
申请日：2003-06-10
申请人： David R. Hembree , Salman Akram , Derek Gochnour
发明人： David R. Hembree , Salman Akram , Derek Gochnour
IPC分类号： G01R1/04 , H01R12/00
CPC分类号： G01R1/0466 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/53209 , Y10T29/5323
摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.

39. 发明授权

US06932077B2 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 失效
标题翻译：采用多重分度技术切割晶片尺寸和切割装置的方法
公开(公告)号：US06932077B2
公开(公告)日：2005-08-23
申请号：US10701957
申请日：2003-11-05
申请人： Salman Akram , Derek J. Gochnour , Michael E. Hess , David R. Hembree
发明人： Salman Akram , Derek J. Gochnour , Michael E. Hess , David R. Hembree
IPC分类号： B23P17/00 , B26D3/00 , B28D1/32 , B28D5/02 , H01L21/00 , H01L21/301 , H01L23/58 , H01L29/00 , H05K3/02 , H05K3/20 , H05K3/30 , B24D4/00
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , Y10T83/0222 , Y10T83/0363 , Y10T83/04 , Y10T83/0524 , Y10T83/7726 , Y10T83/7809 , Y10T83/7868
摘要： A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
摘要翻译：用于切割半导体晶片的半导体晶片锯包括可变横向分度能力和多个叶片。晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。

40. 发明授权

US06899797B2 Apparatus for continuous processing of semiconductor wafers 失效
标题翻译：用于连续处理半导体晶片的装置
公开(公告)号：US06899797B2
公开(公告)日：2005-05-31
申请号：US10365381
申请日：2003-02-11
申请人： Salman Akram , David R. Hembree
发明人： Salman Akram , David R. Hembree
IPC分类号： C25D7/12 , C25D17/00 , C25F7/00
CPC分类号： C25F7/00 , C25D17/001
摘要： An electrochemical reaction assembly of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly achieves a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.
摘要翻译：引起电化学反应的电化学反应组件，例如用于在半导体衬底上沉积材料。通过将半导体衬底保持在浸入合适的反应溶液中的移动阴极上，在电化学反应期间，丝网阳极围绕移动的阴极旋转，该组件实现了沉积材料的高度均匀的厚度和组成，或半导体衬底上的均匀蚀刻或抛光。

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