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31. 发明授权

US07832618B2 Termination bonding 有权
标题翻译：终止粘合
公开(公告)号：US07832618B2
公开(公告)日：2010-11-16
申请号：US11972074
申请日：2008-01-10
申请人： John L. Galvagni , Thomas J. Brown
发明人： John L. Galvagni , Thomas J. Brown
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , H01G2/065 , H01G4/228 , H01G13/006
摘要： Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical components are concurrently terminated, and provided with strongly secured leads.
摘要翻译：公开了用于生产铅型电气部件的方法。将部件放置在引线框架中，并将端接膏施加到部件的选定部分。在组装的引线框架和电气部件点火时，电气部件同时终止，并且设置有牢固固定的引线。

32. 发明授权

US07724496B2 Multilayer vertically integrated array technology 有权
标题翻译：多层垂直集成阵列技术
公开(公告)号：US07724496B2
公开(公告)日：2010-05-25
申请号：US11590681
申请日：2006-10-31
申请人： Carl L. Eggerding , Ronald S. Demcko , John L. Galvagni
发明人： Carl L. Eggerding , Ronald S. Demcko , John L. Galvagni
IPC分类号： H01G4/005 , H01G4/228
CPC分类号： H01G4/40 , H01C1/142 , H01C1/148 , H01C7/18 , H01G4/012 , H01G4/30 , H01G4/35
摘要： The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal filtering characteristics, over-voltage transient suppression capabilities, and land grid array (LGA) terminations. Embodiments of the present subject matter may define a single capacitor, a capacitor array, or a multilayer vertically integrated array with configurable equivalent electrical characteristics including equivalent series inductance (ESL), equivalent series resistance (ESR), and configurable capacitance and voltage clamping and transient suppression capabilities.
摘要翻译：本发明涉及用于提供具有交错电极层部分的多层阵列部件的方法和装置，其配置为选择性地提供信号滤波特性，过电压瞬变抑制能力和平面栅格阵列（LGA）终端。本主题的实施例可以定义单个电容器，电容器阵列或具有可配置的等效电特性的多层垂直集成阵列，包括等效串联电感（ESL），等效串联电阻（ESR）以及可配置的电容和电压钳位和瞬态抑制能力。

33. 发明授权

US07006359B2 Modular electronic assembly and method of making 失效
标题翻译：模块化电子组装及其制作方法
公开(公告)号：US07006359B2
公开(公告)日：2006-02-28
申请号：US10891413
申请日：2004-07-14
申请人： John L. Galvagni , George Korony
发明人： John L. Galvagni , George Korony
IPC分类号： H05K7/02 , H05K3/30
CPC分类号： H05K1/188 , H01L2224/82039 , H01L2924/01078 , H05K3/4602 , H05K2201/0355 , Y10T29/49146 , Y10T29/49165
摘要： A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers. A modular electronic assembly according to the disclosed technology provides maximum available “real estate” for mounting active and other components on the surface of printed wiring boards while significantly reducing the amount of lead (Pb) used to form similar known printed wiring boards.
摘要翻译：公开了一种模块化电子组件和用于制造模块化电子组件的方法。本发明的模块化电子组件被构造成通过将预先测试的分立无源元件结合在这样的印刷线路板的主体内并且以体积有效的方式电连接元件来最大化印刷线路板上的可用表面积。根据本公开的主题构造的模块化电子组件通过在多个铜和粘性环氧树脂片之间布置多个不同的预测试的无源部件而形成，通过环氧树脂层将无源部件保持就位，并将部件一起通过穿过粘性环氧树脂层的电气通孔。根据所公开的技术的模块化电子组件为印刷电路板表面上的主动和其他部件安装提供了最大可用的“空间”，同时显着减少了用于形成类似的已知印刷线路板的铅（Pb）的量。

34. 发明申请

US20080179382A1 TERMINATION BONDING 有权
标题翻译：终止绑定
公开(公告)号：US20080179382A1
公开(公告)日：2008-07-31
申请号：US11972074
申请日：2008-01-10
申请人： John L. Galvagni , Thomas J. Brown
发明人： John L. Galvagni , Thomas J. Brown
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , H01G2/065 , H01G4/228 , H01G13/006
摘要： Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical components are concurrently terminated, and provided with strongly secured leads.
摘要翻译：公开了用于生产铅型电气部件的方法。将部件放置在引线框架中，并将端接膏施加到部件的选定部分。在组装的引线框架和电气部件点火时，电气部件同时终止，并且设置有牢固固定的引线。

35. 发明授权

US07263764B2 Method for adjusting performance characteristics of a multilayer component 失效
标题翻译：调整多层部件的性能特性的方法
公开(公告)号：US07263764B2
公开(公告)日：2007-09-04
申请号：US10647939
申请日：2003-08-26
申请人： Robert Heistand, II , John L. Galvagni , Georghe Korony
发明人： Robert Heistand, II , John L. Galvagni , Georghe Korony
IPC分类号： H01C17/00
CPC分类号： H01G4/228 , H01G2/00 , H01G4/30 , H01G4/385 , H01L23/642 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/43 , Y10T29/435 , Y10T29/49082 , Y10T29/49124 , Y10T29/49128 , Y10T29/4913 , H01L2924/00
摘要： A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and adjusting the ESR of the component by varying the effective resistance of the resistive layer. The effective resistance may be varied by adjusting the composition or thickness of the resistive layer. Alternatively, the effective resistance may be varied by forming a plurality of through-holes perforating one of the electrode layers and by then adjusting the respective diameters of selected of the through-holes to vary the extent of coverage on the resistive layer. An additionally disclosed feature of the present subject matter is to incorporate dielectric layers of varied thicknesses to broaden the resonancy curve associated with a particular mutli-layer component configuration.
摘要翻译：用于调整多层部件的等效串联电阻（ESR）的方法包括提供由绝缘层分隔开的至少第一和第二层，在所述绝缘层与所述第一或第二电极层之一之间提供电阻层，以及通过改变电阻层的有效电阻来调节元件的ESR。可以通过调节电阻层的组成或厚度来改变有效电阻。或者，可以通过形成穿过一个电极层的多个通孔并且然后调整所选择的通孔的相应直径来改变电阻层上的覆盖范围，来改变有效电阻。本主题的另外公开的特征是结合不同厚度的电介质层以扩大与特定多层组件配置相关联的共振曲线。

36. 发明授权

US06963493B2 Multilayer electronic devices with via components 失效
标题翻译：具有通孔组件的多层电子设备
公开(公告)号：US06963493B2
公开(公告)日：2005-11-08
申请号：US10006777
申请日：2001-11-08
申请人： John L. Galvagni
发明人： John L. Galvagni
IPC分类号： H01L23/498 , H05K1/18 , H05K3/40 , H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K1/184 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/183 , H05K1/186 , H05K3/4046 , H05K2201/10636 , Y02P70/611 , H01L2924/00
摘要： A method of using blind via to house electronic components within an electrical device is provided. Such a method allows for the vertical orientation of various types of passive components within a layer of a printed circuit board (PCB) or an integrated passive device (IPD). One exemplary embodiment of the method provides for the passive component's electrical connection between an embedded ground and another device on the surface of the PCB. By virtue of its component positioning, such a method reduces the space demands placed upon the surface of the PCB, enhances the flexibility of circuitry design, and allows for a greater variety of passive components and integral passive devices to be utilized within the PCB itself. Another exemplary embodiment of the method provides for greater flexibility in the design and manufacture of IPDs by allowing for the vertical electrical connection of various passive components through the placement of intervening passive components into via.
摘要翻译：提供了一种使用盲通道来容纳电气设备内的电子部件的方法。这种方法允许在印刷电路板（PCB）或集成无源器件（IPD）的层内的各种类型的无源部件的垂直取向。该方法的一个示例性实施例提供了无源元件在PCB的表面上的嵌入式地与另一器件之间的电连接。由于其组件定位，这种方法减少了放置在PCB表面上的空间需求，增强了电路设计的灵活性，并且允许在PCB本身内使用更多种类的无源组件和整体无源器件。该方法的另一个示例性实施例通过允许通过将中间的无源部件放置到通孔中而使各种无源部件的垂直电连接在IPD的设计和制造中提供更大的灵活性。

37. 发明授权

US4085435A Tantalum chip capacitor 失效
标题翻译：钽片电容器
公开(公告)号：US4085435A
公开(公告)日：1978-04-18
申请号：US695596
申请日：1976-06-14
申请人： John L. Galvagni
发明人： John L. Galvagni
IPC分类号： H01G9/004 , H01G9/00 , H01G9/06 , H01G9/08
CPC分类号： H01G9/08
摘要： The present invention is directed to a tantalum chip capacitor. The invention is characterized by encapsulating an essentially conventional tantalum capacitor subassembly including a body portion, the outer surface of which comprises a cathode, an anode, and an anode lead extending therefrom, within a metallic tubular case, preferably rectangular in transverse section. The subassembly is inserted within the casing and electrical connection is effected between the cathode and the case adjacent one end. An electrical connection is effected between the anode and the other end of the case. The case is thereafter filled with a polymeric insulating material in liquid form, which is thereafter caused to harden. After the polymeric material has hardened, a band, section or groove of the case is cut away to interrupt a direct current path between the ends of the case, which function as the terminals of the capacitor, the ends being maintained in structural integrity by the hardened polymeric material.
摘要翻译：本发明涉及一种钽片式电容器。本发明的特征在于封装基本上常规的钽电容器子组件，其包括主体部分，其主体部分的外表面包括阴极，阳极和从其延伸的阳极引线，在金属管状壳体内，优选地在横截面为矩形。子组件插入壳体内，并且在阴极和邻近一端的壳体之间进行电连接。在壳体的阳极和另一端之间进行电连接。然后，该情况用液体形式的聚合物绝缘材料填充，然后使其硬化。在聚合物材料硬化之后，壳体的带状部分或凹槽被切除，以中断壳体的端部之间的直流路径，其作为电容器的端子，端部通过硬化聚合材料。

38. 发明授权

US4059887A Tantalum chip capacitor and method of manufacture 失效
标题翻译：钽片电容器及其制造方法
公开(公告)号：US4059887A
公开(公告)日：1977-11-29
申请号：US791511
申请日：1977-04-27
申请人： John L. Galvagni
发明人： John L. Galvagni
IPC分类号： H01G9/08 , B01J17/00
CPC分类号： H01G9/08 , Y10T29/417
摘要： The present invention is directed to a method of making a tantalum chip capacitor and the resultant capacitor device. The invention is characterized by encapsulating an essentially conventional tantalum capacitor subassembly including a body portion, the outer surface of which comprises a cathode, an anode, and an anode lead extending therefrom, within a metallic tubular case, preferably rectangular in transverse section. The subassembly is inserted within the casing and electrical connection is effected between the cathode and the case adjacent one end. An electrical connection is effected between the anode and the other end of the case. The case is thereafter filled with a polymeric insulating material in liquid form, which is thereafter caused to harden. After the polymeric material has hardened, a band, section or groove of the case is cut away to interrupt a direct current path between the ends of the case, which function as the terminals of the capacitor, the ends being maintained in structural integrity by the hardened polymeric material.
摘要翻译：本发明涉及一种制造钽片式电容器和所得电容器器件的方法。本发明的特征在于封装基本上常规的钽电容器子组件，其包括主体部分，其主体部分的外表面包括阴极，阳极和从其延伸的阳极引线，在金属管状壳体内，优选地在横截面为矩形。子组件插入壳体内，并且在阴极和邻近一端的壳体之间进行电连接。在壳体的阳极和另一端之间进行电连接。然后，该情况用液体形式的聚合物绝缘材料填充，然后使其硬化。在聚合物材料硬化之后，壳体的带状部分或凹槽被切除，以中断壳体的端部之间的直流路径，其作为电容器的端子，端部通过硬化聚合材料。

39. 发明授权

US07889020B2 Asymmetrical filter 有权
标题翻译：不对称滤波器
公开(公告)号：US07889020B2
公开(公告)日：2011-02-15
申请号：US11583361
申请日：2006-10-18
申请人： Joseph M. Hock , John L. Galvagni
发明人： Joseph M. Hock , John L. Galvagni
IPC分类号： H04B3/30 , H03H7/00
CPC分类号： H01G4/35 , H03H1/0007 , H03H7/1758 , H03H2001/0042
摘要： Disclosed is methodology and apparatus for producing an asymmetrical filter for use with implantable medical devices, and in other input filtering environments. Differing forward and reverse characteristic responses are provided by inserting a low value resistor in series with heart connecting leads so that EMI input protection may be provided without significantly reducing energy transfer from the protected device. Improved protection against voltage transients is provided with present arrangements of differentiated series impedance. Higher frequency energy is allowed out of a subject device than is allowed into such device, which allows for attenuation of undesired frequency ranges entering the filter while allowing output pulses to exit without distortion.
摘要翻译：公开了用于生产用于可植入医疗装置的非对称过滤器以及其它输入过滤环境的方法和装置。通过插入与心脏连接引线串联的低值电阻器来提供不同的正向和反向特性响应，从而可以提供EMI输入保护，而不会显着减少受保护器件的能量传输。提供了针对电压瞬态的改进的保护，具有差分串联阻抗的当前布置。比被允许进入这种装置的受检器件更高的频率能量允许衰减进入滤波器的不期望的频率范围，同时允许输出脉冲退出而不失真。

40. 发明授权

US06757152B2 Cascade capacitor 失效
标题翻译：级联电容
公开(公告)号：US06757152B2
公开(公告)日：2004-06-29
申请号：US10234972
申请日：2002-09-04
申请人： John L. Galvagni , Robert Heistand, II , Georghe Korony
发明人： John L. Galvagni , Robert Heistand, II , Georghe Korony
IPC分类号： H01G4228
CPC分类号： H01G4/228 , H01G2/00 , H01G4/30 , H01G4/385 , H01L23/642 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/43 , Y10T29/435 , Y10T29/49082 , Y10T29/49124 , Y10T29/49128 , Y10T29/4913 , H01L2924/00
摘要： Multi-layer and cascade capacitors for use in high frequency applications and other environments are disclosed. The subject capacitor may have multiple capacitor components or aspects thereof in an integrated package. Such components may include, for example, thin film BGA components, interdigitated capacitor (IDC) configurations, double-layer electrochemical capacitors, surface mount tantalum products, multilayer capacitors, single layer capacitors, and others. Exemplary embodiments of the present subject matter preferably encompass at least certain aspects of thin film BGA techniques and/or IDC-style configurations. Features for attachment and interconnection are provided that facilitate low ESL while maintaining a given capacitance value. Additional advantages include low ESR and decoupling performance over a broad band of operational frequencies. More particularly, the presently disclosed technology provides for exemplary capacitors that may function over a frequency range from kilohertz up to several gigahertz, and that may also be characterized by a wide range of capacitance values. An additionally disclosed feature of the present subject matter is to incorporate dielectric layers of varied thicknesses to broaden the resonancy curve associated with a particular configuration.
摘要翻译：公开了用于高频应用和其他环境的多层和级联电容器。本集电容器可以在集成封装中具有多个电容器组件或其方面。这样的部件可以包括例如薄膜BGA部件，叉指电容器（IDC）配置，双层电化学电容器，表面贴装钽产品，多层电容器，单层电容器等。本主题的示例性实施例优选地包括薄膜BGA技术和/或IDC式配置的至少某些方面。提供用于附接和互连的特征，其在保持给定的电容值的同时促进低ESL。另外的优点包括在宽频带工作频率下的低ESR和去耦性能。更具体地，本公开的技术提供了可以在从千赫兹到几千兆赫兹的频率范围内起作用的示例性电容器，并且还可以通过宽范围的电容值来表征。本主题的另外公开的特征是结合不同厚度的电介质层以扩大与特定配置相关联的共振曲线。

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