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31. 发明授权

US07195696B2 Electrode assembly for electrochemical processing of workpiece 有权
标题翻译：工件电化学处理用电极组件
公开(公告)号：US07195696B2
公开(公告)日：2007-03-27
申请号：US10723045
申请日：2003-11-26
申请人： Cyprian E. Uzoh , Bulent M. Basol
发明人： Cyprian E. Uzoh , Bulent M. Basol
IPC分类号： C25D17/00 , B05C11/00
CPC分类号： H01L21/2885 , C25D5/08 , C25D7/12 , C25D17/001 , C25D17/14 , C25F7/00 , H01L21/32115 , H01L21/3212 , H01L21/32134 , H01L21/76877
摘要： The present invention provides a novel system, apparatus, and method to deposit conductive films on a workpiece. A system for electroplating a surface of a workpiece using a process solution is disclosed. The system comprises a solution housing configured to house an electrode and to contain the process solution, a filter element disposed in the solution housing configured to partition the solution housing into a lower chamber and an upper chamber, and an upper inlet port coupled to the solution housing configured to deliver the process solution to the upper chamber of the solution housing to fill the upper chamber and the lower chamber immersing the electrode in the lower chamber.
摘要翻译：本发明提供了一种在工件上沉积导电膜的新型系统，装置和方法。公开了一种使用工艺溶液对工件的表面进行电镀的系统。该系统包括配置成容纳电极并容纳处理溶液的溶液壳体，设置在溶液壳体中的过滤元件，其配置成将溶液壳体分隔成下腔室和上腔室，以及连接到溶液的上入口端口壳体，被配置为将处理溶液输送到溶液壳体的上腔室以填充上室，下室将电极浸入下室中。

32. 发明授权

US06867136B2 Method for electrochemically processing a workpiece 失效
标题翻译：电化学处理工件的方法
公开(公告)号：US06867136B2
公开(公告)日：2005-03-15
申请号：US10201606
申请日：2002-07-22
申请人： Bulent M. Basol , Homayoun Talieh , Cyprian E. Uzoh
发明人： Bulent M. Basol , Homayoun Talieh , Cyprian E. Uzoh
IPC分类号： B23H5/08 , C25D5/02 , C25D5/06 , C25D5/10 , C25D5/18 , C25D5/22 , C25D5/48 , C25D7/12 , H01L21/288 , H01L21/3205 , H01L21/321 , H01L21/768 , H01L21/44
CPC分类号： B23H5/08 , C25D5/02 , C25D5/10 , C25D5/18 , C25D5/22 , C25D7/123 , H01L21/2885 , H01L21/32125 , H01L21/7684 , H01L21/76877
摘要： The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.
摘要翻译：本发明涉及使用ECMPR技术在工件表面上形成诸如铜的导电材料的近平面或平面层的方法。该方法优选使用至少两个单独的电镀溶液化学物质，以在其表面上具有特征或空腔的半导体衬底上形成近平面或平面的铜层。

33. 发明授权

US06768203B1 Open-bottomed via liner structure and method for fabricating same 有权
标题翻译：通过衬管结构开口底部及其制造方法
公开(公告)号：US06768203B1
公开(公告)日：2004-07-27
申请号：US09262690
申请日：1999-03-04
申请人： Andrew H. Simon , Cyprian E. Uzoh
发明人： Andrew H. Simon , Cyprian E. Uzoh
IPC分类号： H01L2348
CPC分类号： H01L21/76844 , H01L21/76865 , H01L21/76873 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to a method of forming a bottomless liner structure. The method involves the steps of first obtaining a material having a via. Next, a first layer is deposited on the material, the first layer covering the sidewalls and bottom of the via. Finally, a second layer is sputter deposited on the first material, the material Rf biased during at least a portion of the time that the second layer is sputter deposited, such that the first layer deposited on the bottom of the via is substantially removed and substantially all of the first layer deposited on the sidewalls of the via is unaffected.
摘要翻译：本发明涉及一种形成无底衬管结构的方法。该方法包括首先获得具有通孔的材料的步骤。接下来，第一层沉积在材料上，第一层覆盖通孔的侧壁和底部。最后，第二层被溅射沉积在第一材料上，材料Rf在第二层被溅射沉积的至少一部分时间内偏置，使得沉积在通孔底部上的第一层被基本上去除并且基本上被除去沉积在通孔侧壁上的所有第一层都不受影响。

34. 发明授权

US06649523B2 Method and system to provide material removal and planarization employing a reactive pad 失效
公开(公告)号：US06649523B2
公开(公告)日：2003-11-18
申请号：US09969531
申请日：2001-10-01
申请人： Bulent M. Basol , Cyprian E. Uzoh , Homayoun Talieh
发明人： Bulent M. Basol , Cyprian E. Uzoh , Homayoun Talieh
IPC分类号： H01L21302
CPC分类号： B24D13/14 , B24B37/042 , B24B37/24 , B24D3/346 , C23F3/00 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： Systems and methods to remove a first material located on a top surface of a workpiece are presented according to one aspect of the present invention. According to an exemplary method, the pad including a second material is positioned proximate to the workpiece so that a front surface of the pad contacts an exposed surface of the first material. The front surface of the pad is mechanically moved against the exposed surface of the first material to initiate a chemical reaction between the first material and the second material that yields a reaction product. The reaction product may be removed by using a chemical solution, by using the mechanical movement of the pad against the exposed surface of the first material or both.

35. 发明授权

US06380628B2 Microstructure liner having improved adhesion 失效
标题翻译：显微组织衬垫具有改进的粘合性
公开(公告)号：US06380628B2
公开(公告)日：2002-04-30
申请号：US09377329
申请日：1999-08-18
申请人： John A. Miller , Andrew Simon , Jill Slattery , Cyprian E. Uzoh , Yun-Yu Wang
发明人： John A. Miller , Andrew Simon , Jill Slattery , Cyprian E. Uzoh , Yun-Yu Wang
IPC分类号： H01L2348
CPC分类号： H01L21/76862 , H01L21/76816 , H01L21/76843 , H01L21/76865 , H01L21/76871
摘要： A damascene structure, such as a conductive line or via, having a liner with a roughened surface between the substrate and the conductive fill and, preferably, a smooth bottom. The substrate underneath the liner may also have a roughened sidewall and smooth bottom. Such a structure provides enhanced adhesion between one or more layers of the damascene structure. The damascene structure may be manufactured by applying a photoresist over a substrate top surface, exposing the photoresist under conditions that create a standing wave in the resist, and developing the photoresist to provide a pattern having the desired roughened or serrated outline. The pattern is transferred into the substrate, the liner is applied over the substrate bottom and sidewalls, and the liner is filled with conductive material. A roughened liner surface may be achieved by applying a partial layer of liner material over the substrate, removing a portion of the partial layer, and repeating the application and removal steps.
摘要翻译：具有在衬底和导电填料之间具有粗糙表面的衬垫，以及优选光滑底部的镶嵌结构，例如导电线或通孔。衬垫下面的衬底也可以具有粗糙的侧壁和光滑的底部。这种结构提供了镶嵌结构的一层或多层之间增强的附着力。镶嵌结构可以通过在衬底顶表面上施加光致抗蚀剂来制造，在在抗蚀剂中产生驻波的条件下曝光光致抗蚀剂，以及显影光致抗蚀剂以提供具有期望的粗糙化或锯齿形轮廓的图案。将图案转移到衬底中，将衬垫施加在衬底底部和侧壁上，并且衬垫填充有导电材料。可以通过在衬底上施加部分衬里材料层，去除部分层的一部分并重复施加和去除步骤来实现粗糙化衬里表面。

36. 发明授权

US06261426B1 Method and apparatus for enhancing the uniformity of electrodeposition or electroetching 有权
标题翻译：用于增强电沉积或电蚀刻的均匀性的方法和装置
公开(公告)号：US06261426B1
公开(公告)日：2001-07-17
申请号：US09235798
申请日：1999-01-22
申请人： Cyprian E. Uzoh , Hariklia Deligianni , John O. Dukovic
发明人： Cyprian E. Uzoh , Hariklia Deligianni , John O. Dukovic
IPC分类号： C25D1700
CPC分类号： C25D5/08 , C25D7/123 , C25D17/001 , C25D17/008
摘要： An apparatus and method for an electrodeposition or electroetching system. A thin metal film is deposited or etched by electrical current through an electrolytic bath flowing toward and in contact with a target on which the film is disposed. Uniformity of deposition or etching is promoted, particularly at the edge of the target film, by baffle and shield members through which the bath passes as it flows toward the target. The baffle has a plurality of openings disposed to control the localized current flow across the cross section of the workpiece/wafer. Disposed near the edge of the target, the shield member shapes the potential field and the current line so that it is uniform.
摘要翻译：电沉积或电蚀系统的装置和方法。通过电流沉积或蚀刻薄的金属膜，所述电解液流向与其上设置有膜的靶接触并与其接触的电解槽。特别是在目标膜的边缘，通过挡板和屏蔽构件促进了沉积或蚀刻的均匀性，当浴流向靶时通过该挡板和屏蔽构件通过。挡板具有多个开口，其设置成控制横跨工件/晶片横截面的局部电流。设置在目标边缘附近，屏蔽构件使势场和当前线形成均匀。

37. 发明授权

US06180505B2 Process for forming a copper-containing film 失效
标题翻译：用于形成含铜膜的方法
公开(公告)号：US06180505B2
公开(公告)日：2001-01-30
申请号：US09227013
申请日：1999-01-07
申请人： Cyprian E. Uzoh
发明人： Cyprian E. Uzoh
IPC分类号： H01L2144
CPC分类号： H01L24/05 , H01L23/53238 , H01L24/11 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/0401 , H01L2224/04042 , H01L2224/05016 , H01L2224/05018 , H01L2224/05019 , H01L2224/0502 , H01L2224/05027 , H01L2224/05082 , H01L2224/05147 , H01L2224/05556 , H01L2224/05558 , H01L2224/05559 , H01L2224/05562 , H01L2224/05624 , H01L2224/05644 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48624 , H01L2224/48644 , H01L2224/48699 , H01L2224/48724 , H01L2224/48744 , H01L2224/48799 , H01L2924/00011 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00 , H01L2224/05552 , H01L2924/00015 , H01L2924/01033
摘要： A structure and process for a copper-containing, wire-bonding pad structure for bonding to gold wires. The structure includes a nickel-containing film to improve metal lurgical characteristics. The structure also has a laminated impurity film within the copper pad, which complexes with the nickel-containing pad to prevent a destructive interaction between nickel and copper at elevated temperatures, or during the lifetime of the device or the wirebond.
摘要翻译：一种用于与金线接合的含铜接线焊盘结构的结构和工艺。该结构包括用于改善金属手术特性的含镍膜。该结构还具有在铜焊盘内的层压杂质膜，其与含镍焊盘复合以防止镍和铜在升高的温度下或在器件或引线键的寿命期间的破坏性相互作用。

38. 发明授权

US6113759A Anode design for semiconductor deposition having novel electrical contact assembly 失效
标题翻译：具有新型电接触组件的半导体沉积阳极设计
公开(公告)号：US6113759A
公开(公告)日：2000-09-05
申请号：US216893
申请日：1998-12-18
申请人： Cyprian E. Uzoh
发明人： Cyprian E. Uzoh
IPC分类号： C25D17/10 , C25B11/03
CPC分类号： C25D17/10
摘要： An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface. The contact assembly includes a closed or substantially closed cylinder member of titanium or titanium alloy, a copper lining or disk disposed within the cylinder, and a titanium or titanium alloy post fixed and in electrical engagement with the lining or disk.
摘要翻译：阳极组件包括穿孔阳极和附接到阳极的电接触组件。穿孔阳极支架固定阳极。阳极保持器至少在底壁中具有穿孔，使得电镀溶液可以流过阳极保持器中的穿孔和阳极中的穿孔。阳极隔离器分离阳极和阴极。阳极隔离器包括至少一个曲线表面。接触组件包括钛或钛合金的闭合或基本上闭合的圆筒构件，设置在圆筒内的铜衬层或圆盘，以及固定并与内衬或圆盘电接合的钛或钛合金柱。

39. 发明授权

US5930669A Continuous highly conductive metal wiring structures and method for fabricating the same 失效
标题翻译：连续高导电性金属布线结构及其制造方法
公开(公告)号：US5930669A
公开(公告)日：1999-07-27
申请号：US838222
申请日：1997-04-03
申请人： Cyprian E. Uzoh
发明人： Cyprian E. Uzoh
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/522 , H01L23/532 , H01L21/00
CPC分类号： H01L21/76844 , H01L21/76868 , H01L21/76877 , H01L21/76883 , H01L23/5226 , H01L23/53238 , H01L23/5329 , H01L2924/0002
摘要： The present relates to a method of fabricating wiring structures which contain a continuous, single crystalline conductive material extending through the structure. This is achieved in the present invention by utilizing an open-bottomed via liner structure.
摘要翻译：本发明涉及一种制造布线结构的方法，其包含延伸穿过结构的连续的单晶导电材料。这在本发明中通过利用开口的通孔衬垫结构实现。

40. 发明授权

US07204917B2 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same 失效
标题翻译：用于电化学机械加工的工件表面影响装置设计及其使用方法
公开(公告)号：US07204917B2
公开(公告)日：2007-04-17
申请号：US10302755
申请日：2002-11-21
申请人： Cyprian E. Uzoh , Bulent M. Basol
发明人： Cyprian E. Uzoh , Bulent M. Basol
IPC分类号： C25D5/04 , C25D17/10 , C25D17/00 , B23H5/06 , B23H3/00 , C25F7/00 , C25D7/12
CPC分类号： C25D5/00 , B24B37/042 , B24B37/16 , B24B37/20 , B24B37/22 , B24B37/24 , B24B37/26 , C25D5/02 , C25D5/06 , C25D5/22 , C25D7/123 , C25D17/001 , C25D17/005 , C25D17/007 , C25D17/14 , C25F7/00 , H01L21/2885 , H01L21/3212 , H01L21/6715 , H01L21/76838 , H01L21/76877 , H01L23/53238 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which a solution becomes disposed onto a conductive surface of a workpiece and electrochemical mechanical processing of the conductive surface is performed while relative movement and physical contact exists between the top surface and the conductive surface. The top surface comprises a ceramic material that presents a substantially planar contact area to the conductive surface, the ceramic material having a hardness greater than that of the conductive surface. A plurality of channels are formed through the top surface.
摘要翻译：本发明涉及工件表面影响装置的顶面及其使用方法。工件表面影响装置的上表面适用于电化学机械处理装置，其中溶液设置在工件的导电表面上，并且执行导电表面的电化学机械处理，同时存在相对运动和物理接触之间的相互运动和物理接触顶表面和导电表面。顶表面包括陶瓷材料，其向导电表面提供基本平坦的接触面积，陶瓷材料的硬度大于导电表面的硬度。通过上表面形成多个通道。

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