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    • 31. 发明授权
    • Pressure sensor with on-board compensation
    • 带有板载补偿的压力传感器
    • US08186226B2
    • 2012-05-29
    • US12634551
    • 2009-12-09
    • Lamar F. Ricks
    • Lamar F. Ricks
    • G01L19/04
    • G01L19/02G01L9/065
    • The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor. The on-board heating element may be configured to heat the pressure sensor assembly to various temperatures so that temperature related offsets and/or errors may be identified, and then compensated for with the zener diode trim network.
    • 本公开一般涉及压力传感器,更具体地,涉及用于补偿压力传感器用于应力,温度和/或其他诱导偏移和/或误差的方法和装置。 在一个示例性实施例中,压力传感器可以包括安装到压力传感器封装的基板的压力感测芯片。 压力传感器芯片可以包括板载补偿。 在一些情况下,车载补偿可以包括位于压力感测芯片上或其中的车载加热元件和车载齐纳二极管调整网络。 齐纳二极管调整网络可以包括一个或多个齐纳二极管和一个或多个电阻元件,其中齐纳二极管可以被选择性地激活以“修整”电阻网络以补偿压力传感器的一个或多个偏移和/或误差。 车载加热元件可以被配置为将压力传感器组件加热到各种温度,使得可以识别温度相关的偏移和/或误差,然后用齐纳二极管调整网络进行补偿。
    • 33. 发明申请
    • DIFFERENTIAL PRESSURE SENSE DIE BASED ON SILICON PIEZORESISTIVE TECHNOLOGY
    • 基于硅技术的差压检测仪
    • US20090151464A1
    • 2009-06-18
    • US11956811
    • 2007-12-14
    • Lamar F. Ricks
    • Lamar F. Ricks
    • G01L7/08
    • G01L13/025
    • A method and apparatus for designing a differential pressure sense die based on a unique silicon piezoresistive technology for sensing low differential pressure in harsh duty applications is disclosed. The pressure sense die comprises of an etched pressure diaphragm and a hole that is drilled through the sense die wherein the pressure sense die possess a backside and a front side and are associated with varying pressures. A top cap can be attached to the front side and an optional constraint for stress relief can be attached to the backside of the differential pressure sense die. The top cap and the constraint comprise of glass and/or silicon and can be attached with an anodic bonding process or glass frit process.
    • 公开了一种基于用于在苛刻工作应用中感测低压差的独特硅压阻技术来设计差压感测管芯的方法和装置。 压力感应模具包括蚀刻的压力隔膜和通过感测模头钻出的孔,其中压力感测模具具有背侧和前侧并与变化的压力相关联。 顶盖可以连接到前侧,并且用于应力消除的可选约束可以附着在差压感测模的背面。 顶盖和约束包括玻璃和/或硅,并且可以通过阳极接合工艺或玻璃料加工来附着。
    • 34. 发明申请
    • Self diagnostic measurement method to detect microbridge null drift and performance
    • 自诊断测量方法检测微桥零漂和性能
    • US20090056410A1
    • 2009-03-05
    • US11897058
    • 2007-08-29
    • Lamar F. RicksPaul P. Bey
    • Lamar F. RicksPaul P. Bey
    • G01F15/02G01F25/00
    • G01F1/6845G01F1/692G01F1/6965G01F1/699G01F25/0007
    • A self-diagnostic measurement method to detect microbridge null drift and performance. An ASIC can be designed to include a self-diagnostic feature that automatically occurs at start up or upon command in Normal Operation whereby the temperature compensated microbridge null can be measured in a state of very low thermal energy and allows for the tracking of microbridge null stability versus time. An Airflow Combi-Sensor ASIC (Heimdal) with its strategic partner ZMD can be developed and can be implemented in the form of a self-diagnostic feature that occurs when power is first applied to the ASIC or upon command. When the self-diagnostic is initiated, power is removed and after the electronics have settled, a small power can be applied to the microbridge to measure the bridge null with reduced sensitivity to flow due to self-heating.
    • 一种自诊断测量方法,用于检测微桥零漂和性能。 ASIC可以被设计为包括在启动时或在正常操作中的命令时自动发生的自诊断特征,由此可以在非常低的热能的状态下测量温度补偿的微桥无效,并且允许跟踪微桥无效 相对于时间。 可以开发与其战略合作伙伴ZMD的气流组合传感器ASIC(Heimdal),并可以以电源首次应用于ASIC或命令时发生的自诊断功能的形式实现。 当自诊断启动时,电源被去除,并且在电子设备已经稳定之后,可以将小功率施加到微桥以测量桥接零,由于自加热而对流量的敏感性降低。
    • 36. 发明授权
    • Calibrated, low-profile magnetic sensor
    • 校准,低调磁传感器
    • US06798193B2
    • 2004-09-28
    • US10219239
    • 2002-08-14
    • Mike W. ZimmermanLamar F. RicksCurtis B. JohnsonJoel D. StolfusDouglas L. Mueller
    • Mike W. ZimmermanLamar F. RicksCurtis B. JohnsonJoel D. StolfusDouglas L. Mueller
    • G01R3500
    • G01D5/147G01R33/06Y10T29/49007
    • A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit. An orifice placed with in the housing permits a tool to be passed through the orifice within the housing to contact the magnet. The magnet can be placed in the optimum position for calibration of the magnetic circuit thereof. The same orifice that is used for calibrating the position of the magnet can also be utilized as an injection port for encapsulating the device using an injection epoxy dispensing process.
    • 本文描述了用于形成这种传感器的经校准的低轮廓磁传感器和方法。 通常,在壳体内形成磁感测装置,其中磁感测装置包括至少一个磁体。 磁传感器包括紧凑的集成电路封装,例如小外形集成电路封装(SOIC)。 磁感应元件通常安装在小型集成电路封装上。 磁感测装置可以被配置成额外结合具有形成在其中的孔的印刷电路板(PCB),使得紧凑型集成电路封装可以在印刷电路板上偏心地表面安装,使得孔可以位于 印刷电路板与磁体形状相匹配,允许磁体通过与SOIC相邻的电路板,以完成磁路。 放置在壳体中的孔允许工具穿过壳体内的孔口以接触磁体。 可以将磁体置于用于校准其磁路的最佳位置。 用于校准磁体位置的相同的孔口也可以用作用于使用注射环氧树脂分配工艺来封装装置的注射端口。