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31. 发明申请

US20090272971A1 LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME 有权
标题翻译：具有多个发光细胞的发光装置和安装其的包装
公开(公告)号：US20090272971A1
公开(公告)日：2009-11-05
申请号：US12481998
申请日：2009-06-10
申请人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L29/10 , H01L33/00 , H01L21/00 , H01L29/15
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

32. 发明申请

US20120056215A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
公开(公告)号：US20120056215A1
公开(公告)日：2012-03-08
申请号：US13296735
申请日：2011-11-15
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L33/64 , H01L33/62
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

33. 发明申请

US20110175129A1 LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME 有权
公开(公告)号：US20110175129A1
公开(公告)日：2011-07-21
申请号：US13074761
申请日：2011-03-29
申请人： Chung Hoon LEE , Lacroix YVES , Hyung Soo YOON , Young Ju LEE
发明人： Chung Hoon LEE , Lacroix YVES , Hyung Soo YOON , Young Ju LEE
IPC分类号： H01L33/42
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

34. 发明申请

US20110175128A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
公开(公告)号：US20110175128A1
公开(公告)日：2011-07-21
申请号：US13074740
申请日：2011-03-29
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

35. 发明申请

US20100330714A1 MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME 有权
标题翻译：用于形成模制构件的模具和使用其制造模具构件的方法
公开(公告)号：US20100330714A1
公开(公告)日：2010-12-30
申请号：US12881657
申请日：2010-09-14
申请人： Jung Hwa JUNG , Chung Hoon LEE
发明人： Jung Hwa JUNG , Chung Hoon LEE
IPC分类号： H01L21/56 , B29C45/14 , H01L33/52
CPC分类号： H01L21/565 , B29C33/10 , B29C39/006 , B29C39/10 , B29C39/26 , B29C45/14655 , B29C45/34 , B29L2011/00 , H01L23/49861 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/00014
摘要： There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
摘要翻译：提供了用于形成模制构件的模具和使用其形成模制构件的方法。模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。注射和排出孔从上表面延伸到下表面。因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获模制构件。

36. 发明申请

US20100244060A1 LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME 有权
标题翻译：具有多个发光细胞的发光装置和安装其的包装
公开(公告)号：US20100244060A1
公开(公告)日：2010-09-30
申请号：US12819154
申请日：2010-06-18
申请人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L33/62
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光器件包括形成在衬底上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

37. 发明申请

US20100224904A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20100224904A1
公开(公告)日：2010-09-09
申请号：US12782287
申请日：2010-05-18
申请人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62 , H01L33/64 , H01L33/52
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

38. 发明申请

US20100096977A1 AC LIGHT EMITTING DEVICE WITH LONG-PERSISTENT PHOSPHOR AND LIGHT EMITTING DEVICE MODULE HAVING THE SAME 有权
标题翻译：具有长时间荧光的交流发光装置和具有其的发光装置模块
公开(公告)号：US20100096977A1
公开(公告)日：2010-04-22
申请号：US12581507
申请日：2009-10-19
申请人： Chung Hoon LEE , Yeo Jin Yoon , Dae Won Kim , Dae Sung Kal , Kyung Hee Ye
发明人： Chung Hoon LEE , Yeo Jin Yoon , Dae Won Kim , Dae Sung Kal , Kyung Hee Ye
IPC分类号： H01J1/62
CPC分类号： H01L33/504 , F21K9/00 , F21K9/62 , F21K9/64 , F21V23/06 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L2224/48137 , H01L2224/49107 , H05B33/0821
摘要： Disclosed are an AC light emitting device with a long-persistent phosphor and an AC light emitting device module having the same. According to an exemplary embodiment of the present invention, the light emitting device includes a first light emitting diode chip and a second light emitting diode chip, each of which has a plurality of light emitting cells on a single substrate. Further, a first long-persistent phosphor is positioned on the first light emitting diode chip to perform wavelength conversion for a portion of light emitted from the first light emitting diode chip; and a second long-persistent phosphor is positioned on the second light emitting diode chip to perform wavelength conversion for a portion of light emitted from the second light emitting diode chip. The afterglow luminescence resulted from the second long-persistent phosphor is allowed to be different from that resulted from the first long-persistent phosphor, whereby a flicker effect of the AC light emitting device can be more alleviated.
摘要翻译：公开了具有长持久性荧光体和具有该荧光体的AC发光器件模块的交流发光器件。根据本发明的示例性实施例，发光器件包括第一发光二极管芯片和第二发光二极管芯片，每个芯片在单个基板上具有多个发光单元。此外，第一长持续荧光体位于第一发光二极管芯片上，以对从第一发光二极管芯片发射的光的一部分进行波长转换; 并且第二长持续荧光体位于第二发光二极管芯片上，以对从第二发光二极管芯片发射的光的一部分进行波长转换。使得由第二长持续荧光体产生的余辉发光与第一长持续荧光体不同，从而可以进一步减轻AC发光器件的闪烁效应。

39. 发明申请

US20090085048A1 AC LIGHT EMITTING DIODE 有权
标题翻译：交流发光二极管
公开(公告)号：US20090085048A1
公开(公告)日：2009-04-02
申请号：US12178764
申请日：2008-07-24
申请人： Chung Hoon LEE , Ki Bum NAM , Dae Won KIM
发明人： Chung Hoon LEE , Ki Bum NAM , Dae Won KIM
IPC分类号： H01L33/00
CPC分类号： H01L27/156 , H01L21/0242 , H01L21/02433 , H01L21/0254 , H01L21/02609 , H01L33/16 , H01L33/32 , H01L33/62 , H01L2224/48137
摘要： Disclosed is a light emitting diode (LED) operated by being directly connected to an AC power source. An AC LED according to the present invention comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate; and wires electrically connecting the light emitting cells; wherein the light emitting cells are connected in series by the wires to form a serial array, the single substrate is a non-polar substrate, and the light emitting cells have non-polar GaN-based semiconductor layers grown on the non-polar substrate.
摘要翻译：公开了通过直接连接到AC电源来操作的发光二极管（LED）。根据本发明的交流发光二极管包括二维排列在单个基板上的多个发光单元; 以及电连接所述发光单元的电线; 其中所述发光单元通过所述导线串联连接以形成串联阵列，所述单个衬底是非极性衬底，并且所述发光单元具有在非极性衬底上生长的非极性GaN基半导体层。

40. 发明申请

US20080217628A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20080217628A1
公开(公告)日：2008-09-11
申请号：US12042934
申请日：2008-03-05
申请人： Chung Hoon LEE , Jae Ho LEE , Dae Won KIM
发明人： Chung Hoon LEE , Jae Ho LEE , Dae Won KIM
IPC分类号： H01L33/00
CPC分类号： H01L27/153 , H01L2224/48137 , H01L2224/49107
摘要： The present invention relates to a light emitting device having a light emitting diode package with a plurality of light emitting cells and an integrated electronic element formed on the same substrate. The light emitting device comprises a substrate, a light emitting cell block having a first array with a plurality of light emitting cells formed on one region of the substrate arranged therein, a second array formed on the same region as the first array, and electrodes for AC power connecting the first and second arrays in reverse parallel; and at least one integrated electronic element formed on another region of the same substrate as the light emitting cell block.
摘要翻译：本发明涉及具有多个发光单元的发光二极管封装和形成在同一衬底上的集成电子元件的发光器件。发光器件包括衬底，具有第一阵列的发光单元块，所述第一阵列具有形成在布置在其中的衬底的一个区域上的多个发光单元，形成在与第一阵列相同的区域上的第二阵列，以及用于交流电源反向并联连接第一和第二阵列; 以及形成在与发光单元块相同的基板的另一区域上的至少一个集成电子元件。

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