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    • 33. 发明申请
    • Sokcet assembly for testing semiconductor device
    • 用于测试半导体器件的Sokcet组件
    • US20060170412A1
    • 2006-08-03
    • US11196238
    • 2005-08-04
    • Chan ParkChul HamYoung ParkHo SongWoo LimJae Seo
    • Chan ParkChul HamYoung ParkHo SongWoo LimJae Seo
    • G01R31/28
    • G01R1/0433
    • The present invention relates to a socket assembly for testing semiconductor device comprising a socket board electrically connected to an outside testing device wherein a plurality of connection pins connected to leads of a semiconductor is provided; a socket guide mounted to cover the socket board, with an open part formed so that the semiconductor may in/out, thereby connecting the semiconductor to the connection pins of the socket board; and a spacer interposed between the socket board and the socket guide for maintaining a predetermined distance between the semiconductor and the socket board by touching an surface of the semiconductor having moved into an inside of the socket guide before a surface of each carrier touches the socket guide. According to the present invention, the balls or the leads of each semiconductor may be pressed to the connection pins of the socket in a predetermined depth without replacing the carriers though the semiconductors have the different thicknesses.
    • 本发明涉及一种用于测试半导体器件的插座组件,包括:电连接到外部测试装置的插座板,其中提供连接到半导体引线的多个连接引脚; 安装成覆盖插座板的插座引导件,其形成为使得半导体可以进/出的开口部,从而将半导体连接到插座板的连接引脚; 以及插入在插座板和插座引导件之间的间隔件,用于通过在每个承载件的表面接触插座导向件之前触摸已经移动到插座导向件内部的半导体的表面来保持半导体和插座板之间的预定距离 。 根据本发明,通过半导体具有不同的厚度,每个半导体的球或引线可以以预定深度被压到插座的连接销上,而不需要更换载体。
    • 34. 发明申请
    • LED and a lighting apparatus using the LED
    • LED和使用LED的照明装置
    • US20060163555A1
    • 2006-07-27
    • US11326427
    • 2006-01-06
    • Chan Park
    • Chan Park
    • H01L29/06H01L31/0328H01L31/0336H01L31/072H01L31/109
    • H04N9/315F21Y2115/10H01L33/54H01L2224/48091Y10S362/80H01L2924/00014
    • Disclosed herein is a LED and a lighting apparatus, which employs a LED as a light source of low power and high efficiency for an optical projection system. The lighting apparatus comprises a reflection part together with the LED, and enhances light emitting directionality of the LED, thereby generating parallel light or focused light suitable for the light source of the optical projection system. The LED comprises a negative electrode and a positive electrode formed on an identical plane with different stack constructions, thereby reducing the number of wires between the electrodes occupying a predetermined volume. In addition, the substrate and the electrodes are made of a transparent material to transmit light therethrough, so that the light source using the LED radiates light in all direction as in the light source using the arc discharge, without shielding the light at a rear side by the electrodes.
    • 这里公开了一种LED和照明装置,其将LED用作光学投影系统的低功率和高效率的光源。 照明装置包括与LED一起的反射部分,并且增强LED的发光方向性,从而产生适合于光学投影系统的光源的平行光或聚焦光。 LED包括在具有不同叠层结构的同一平面上形成的负电极和正电极,从而减少电极占据预定体积的数量。 此外,基板和电极由透明材料制成以透射光,使得使用LED的光源在光源中使用电弧放电在全方向辐射光,而不遮蔽后侧的光 通过电极。
    • 36. 发明申请
    • Handler for testing semiconductor device
    • 处理器用于测试半导体器件
    • US20060087312A1
    • 2006-04-27
    • US11266192
    • 2005-11-04
    • Chan Park
    • Chan Park
    • G01R31/28
    • G01R31/2867G01R31/2893
    • Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclosed chamber for providing a particular temperature environment.
    • 一种用于测试半导体器件的处理器,包括用于可拆卸地保持和携带多个器件的载体单元,具有多个测试插座的测试板,用于分别与保持在载体单元处的装置接触以测试装置;压机 单元,用于当载体单元与测试板对准时分别按压并使载体单元上的装置与测试板上的测试插座接触;喷射单元,用于直接和选择性地喷射高温或低温气体 所述装置的表面与所述载体单元的装置附近的位置与所述测试插座接触,以将所述装置加热或冷却至预设温度;气体供应单元,用于选择性地将所述高温或低温气体供应至 喷雾单元和控制单元,用于控制从气体供应单元向喷射单元供气,从而直接将高温或低温气体喷射到 没有用于提供特定温度环境的封闭室的装置。