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    • 31. 发明授权
    • Adjuvant for CMP slurry
    • CMP浆料的辅料
    • US08062395B2
    • 2011-11-22
    • US11783742
    • 2007-04-11
    • Gi Ra YiJong Pil KimYoung Jun Hong
    • Gi Ra YiJong Pil KimYoung Jun Hong
    • B24D3/02C09C1/68C09K3/14
    • H01L21/31053C09G1/02C09K3/1463
    • Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically charged material from being polished, resulting in raising a polishing selectivity of the anionically charged material, wherein the adjuvant comprises polymer particles having a core-shell structure with a nano-scale particle size smaller than that of the abrasive particles, surfaces of which are anionically charged. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.
    • 公开了一种用于对阳离子充电材料和阴离子充电材料同时研磨磨料颗粒的方法的辅助剂,其被吸收到阳离子充电材料上,从而限制阳离子充电材料的抛光,从而提高 阴离子充电材料的抛光选择性,其中所述助剂包含具有小于磨料颗粒的纳米级粒径的核 - 壳结构的聚合物颗粒,其表面是阴离子充电的。 还公开了包含上述助剂和磨料颗粒的CMP(化学机械抛光)浆料。
    • 33. 发明申请
    • Adjuvant for CMP slurry
    • CMP浆料的辅料
    • US20070243710A1
    • 2007-10-18
    • US11783742
    • 2007-04-11
    • Gi Ra YiJong Pil KimYoung Jun Hong
    • Gi Ra YiJong Pil KimYoung Jun Hong
    • H01L21/461C09K13/00
    • H01L21/31053C09G1/02C09K3/1463
    • Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically charged material from being polished, resulting in raising a polishing selectivity of the anionically charged material, wherein the adjuvant comprises polymer particles having a core-shell structure with a nano-scale particle size smaller than that of the abrasive particles, surfaces of which are anionically charged. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.
    • 公开了一种用于对阳离子充电材料和阴离子充电材料同时研磨磨料颗粒的方法的辅助剂,其被吸收到阳离子充电材料上,从而限制阳离子充电材料的抛光,从而提高 阴离子充电材料的抛光选择性,其中所述助剂包含具有小于磨料颗粒的纳米级粒度的核 - 壳结构的聚合物颗粒,其表面是阴离子充电的。 还公开了包含上述助剂和磨料颗粒的CMP(化学机械抛光)浆料。