专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US06896586B2 Method and apparatus for heating polishing pad 失效
标题翻译：抛光垫加热方法和装置
公开(公告)号：US06896586B2
公开(公告)日：2005-05-24
申请号：US10112628
申请日：2002-03-29
申请人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
发明人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
摘要翻译：提供了一种用于具有线性抛光带的化学机械平面化（CMP）系统的温度控制系统，能够在线性抛光带上的准备位置上施加基底的载体。温度控制系统包括具有多个区域的压板。温度控制系统还包括配置的温度传感器，其确定在准备位置之后的位置处的线性抛光带的温度。该系统还包括控制器，用于响应于从温度传感器接收到的输出，调节调节温度的流体流到压板的多个区域中的选定区域。

32. 发明申请

US20050070212A1 SYSTEM, METHOD AND APPARATUS FOR APPLYING LIQUID TO A CMP POLISHING PAD 失效
标题翻译：用于将液体施加到CMP抛光垫的系统，方法和装置
公开(公告)号：US20050070212A1
公开(公告)日：2005-03-31
申请号：US10676388
申请日：2003-09-30
申请人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
发明人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
IPC分类号： B24B37/04 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
摘要翻译：将液体输送到CMP抛光垫的系统和方法包括将液体供应到喷嘴，喷嘴朝向CMP抛光垫的抛光表面。液体以小于或等于约100cc /分钟的速率流动。加压的载气也被供应到喷嘴。液体基本均匀地从喷嘴喷射到CMP抛光垫上。

33. 发明授权

US06732017B2 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system 失效
标题翻译：用于CMP /清洁系统的使用点输送，控制和混合化学和浆料的系统和方法
公开(公告)号：US06732017B2
公开(公告)日：2004-05-04
申请号：US10077831
申请日：2002-02-15
申请人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
发明人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
IPC分类号： G05B2100
CPC分类号： G05D11/132
摘要： A chemical mechanical planarization (CMP) system includes a point of use chemical mixing system. The point of use chemical mixing system includes a first and a second pump, a first and a second flow sensor, a mixer and a controller. The first pump has an input coupled to a first chemical supply and the first flow sensor coupled to the output of the first pump. The second pump has an input coupled to a second chemical supply and the second flow sensor coupled to the output of the second pump. The mixer has inputs coupled to the output of the first and second flow sensors. The controller is configured to receive signals from the first and second flow sensors and to produce control signals for the first and second pumps and the mixer. The controller is further configured to cause a mixture of the first and second chemicals upon a demand from the CMP process.
摘要翻译：化学机械平面化（CMP）系统包括使用化学混合系统。使用的化学混合系统包括第一和第二泵，第一和第二流量传感器，混合器和控制器。第一泵具有耦合到第一化学品供应的输入和耦合到第一泵的输出的第一流量传感器。第二泵具有耦合到第二化学品供应的输入端和耦合到第二泵的输出端的第二流量传感器。混合器具有耦合到第一和第二流量传感器的输出的输入。控制器被配置为从第一和第二流量传感器接收信号并且产生用于第一和第二泵和混合器的控制信号。控制器还被配置成根据CMP工艺的要求引起第一和第二化学品的混合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式