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    • 32. 发明申请
    • High Performance Drilling Fluids with Submicron-Size Particles as the Weighting Agent
    • 具有亚微米粒子作为加重剂的高性能钻井液
    • US20120277124A1
    • 2012-11-01
    • US13545123
    • 2012-07-10
    • Ying Zhang
    • Ying Zhang
    • C09K8/04C09K8/32
    • C09K8/36C09K8/032C09K2208/10C09K2208/18
    • Methods and compositions utilizing a drilling fluid comprising sub-micron precipitated barite having a weight average particle diameter below about 1 micron. Methods include a method comprising circulating a drilling fluid in a well bore, wherein the drilling fluid comprises: a carrier fluid; and a weighting agent that comprises sub-micron precipitated barite having a weight average particle diameter below about 1 micron are disclosed. In some embodiments, the drilling fluid may comprise an invert emulsion. In some embodiments, the sub-micron precipitated barite has a particle size distribution such that at least 10% of particles in the sub-micron precipitated barite have a diameter below about 0.2 micron, at least 50% of the particles in the of the sub-micron precipitated barite have a diameter below about 0.3 micron and at least 90% of the particles in the sub-micron precipitated barite have a diameter below about 0.5 micron.
    • 利用包含重均粒径低于约1微米的亚微米沉淀重晶石的钻井液的方法和组合物。 方法包括一种方法,包括使钻井液在井眼中循环,其中钻井流体包括:载体流体; 并且公开了包含重均粒径低于约1微米的亚微米沉淀重晶石的加重剂。 在一些实施例中,钻井液可以包括反相乳液。 在一些实施方案中,亚微米沉淀重晶石具有粒度分布,使得亚微米沉淀重晶石中的至少10%的颗粒具有低于约0.2微米的直径,子层中的至少50%的颗粒 - 微量沉淀重晶石的直径低于约0.3微米,并且亚微米沉淀重晶石中的至少90%的颗粒具有低于约0.5微米的直径。
    • 33. 发明授权
    • Nanowire FET with trapezoid gate structure
    • 具有梯形栅极结构的纳米线FET
    • US08298881B2
    • 2012-10-30
    • US12824293
    • 2010-06-28
    • Jeffrey W. SleightSarunya BangsaruntipSebastian U. EngelmannYing Zhang
    • Jeffrey W. SleightSarunya BangsaruntipSebastian U. EngelmannYing Zhang
    • H01L21/00H01L21/84
    • H01L29/775B82Y10/00H01L29/4232H01L29/513H01L29/66439
    • In one embodiment, a method of providing a nanowire semiconductor device is provided, in which the gate structure to the nanowire semiconductor device has a trapezoid shape. The method may include forming a trapezoid gate structure surrounding at least a portion of a circumference of a nanowire. The first portion of the trapezoid gate structure that is in direct contact with an upper surface of the nanowire has a first width and a second portion of the trapezoid gate structure that is in direct contact with a lower surface of the nanowire has a second width. The second width of the trapezoid gate structure is greater than the first width of the trapezoid gate structure. The exposed portions of the nanowire that are adjacent to the portion of the nanowire that the trapezoid gate structure is surrounding are then doped to provide source and drain regions.
    • 在一个实施例中,提供了一种提供纳米线半导体器件的方法,其中对纳米线半导体器件的栅极结构具有梯形形状。 该方法可以包括形成围绕纳米线的圆周的至少一部分的梯形栅极结构。 与纳米线的上表面直接接触的梯形栅极结构的第一部分具有与纳米线的下表面直接接触的梯形栅极结构的第一宽度和第二部分具有第二宽度。 梯形栅极结构的第二宽度大于梯形栅极结构的第一宽度。 然后,与梯形栅极结构所围绕的部分纳米线相邻的纳米线的暴露部分被掺杂以提供源区和漏区。
    • 39. 发明授权
    • Addition of ballast hydrocarbon gas to doped polysilicon etch masked by resist
    • 添加压敏烃气体到由抗蚀剂掩蔽的掺杂多晶硅蚀刻
    • US08198103B2
    • 2012-06-12
    • US12170634
    • 2008-07-10
    • Timothy J. DaltonWesley C. NatzlePaul W. PastelRichard S. WiseHongwen YanYing Zhang
    • Timothy J. DaltonWesley C. NatzlePaul W. PastelRichard S. WiseHongwen YanYing Zhang
    • H01L21/302
    • H01L21/32139H01L21/32137Y10S438/909
    • A chemical composition and method for providing uniform and consistent etching of gate stacks on a semiconductor wafer, whereby the composition includes an etchant and an added ballast gas added. The gate stacks are formed using this combined etchant and ballast gas composition. The ballast gas may either be similar to, or the equivalent of, a gaseous byproduct generated within the processing chamber. The ballast gas is added in either an overload amount, or in an amount sufficient to compensate for varying pattern factor changes across the water. This etchant and added ballast gas form a substantially homogeneous etchant across the entire wafer, thereby accommodating for or compensating for these pattern factor differences. When etching the wafer using this homogeneous etchant, a passivation layer is formed on exposed wafer surfaces. The passivation layer protects the lateral sidewalls of the gate stacks during etch to result in straighter gate stacks.
    • 一种用于在半导体晶片上提供均匀且一致的栅叠层蚀刻的化学组成和方法,由此所述组合物包括添加的蚀刻剂和添加的压载气体。 使用这种组合的蚀刻剂和压载气组合物形成栅堆叠。 压载气体可以类似于或等同于在处理室内产生的气态副产物。 压载气体以过载量或足以补偿横跨水的变化因子变化的量加入。 这种蚀刻剂和添加的压载气体在整个晶片上形成基本均匀的蚀刻剂,从而适应或补偿这些图案因子差异。 当使用这种均匀的蚀刻剂蚀刻晶片时,在暴露的晶片表面上形成钝化层。 钝化层在蚀刻期间保护栅极堆叠的侧壁以产生更直的栅叠层。