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31. 发明申请

US20050161149A1 Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process 审中-公开
标题翻译：在金属材料表面上形成含有介电填料的聚酰亚胺涂层的方法，用于制造用于形成用于印刷线路板的电容器层的铜包覆层压板和通过该方法获得的覆铜层压板
公开(公告)号：US20050161149A1
公开(公告)日：2005-07-28
申请号：US10518030
申请日：2003-06-27
申请人： Toshiko Yokota , Susumu Takahashi , Hideaki Matsushima , Makoto Dobashi , Takuya Yamamoto
发明人： Toshiko Yokota , Susumu Takahashi , Hideaki Matsushima , Makoto Dobashi , Takuya Yamamoto
IPC分类号： C25D7/00 , C25D13/06 , C25D15/00 , C25D15/02 , H01L23/12 , H05K1/16 , H05K3/38 , C25D1/00
CPC分类号： H05K1/162 , C25D15/02 , H05K3/384 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/0723 , H05K2203/135
摘要： A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide coating container dielectric filler on a surface of metallic material according to the electrodeposition coating technique, characterized in that as the dielectric filler, use is made of dielectric powder of perovskite structure in approximately spherical form which has an average particle diameter (D1A) of 0.05 to 1.0 μm and a weight cumulative particle diameter (D50), measured in accordance with the laser diffraction scattering type particle size distribution measuring method, of 0.1 to 2.0 μm and further exhibits an aggregation degree, in terms of D50/D1a wherein D50 and D1a represent a weight cumulative particle diameter and an average particle diameter obtained by image analysis, respectively, of 4.5 or less.
摘要翻译：从含有介电填料的聚酰亚胺电沉积液形成包含电介质填料的电介质层的方法，该电介质层的膜厚均匀性优异。特别是根据电沉积涂覆技术在金属材料表面上形成聚酰亚胺涂层容器电介体填料的方法，其特征在于，作为介电填料，使用大致球形的钙钛矿结构的介电粉末，其具有根据激光衍射散射型粒度分布测量测量的0.05至1.0μm的平均粒径（D 1A 1A）和重量累积粒径（D <50 ）方法为0.1至2.0μm，并且还表现出聚合度，就D D D＆lt;＆lt; 50＆gt;和D＆lt; SUB > 1a 分别表示通过图像分析得到的重量累积粒径和平均粒径为4.5以下。

32. 发明授权

US06835297B1 High current density electrolytic decomposition process for copper 失效
标题翻译：铜的高电流密度电解分解过程
公开(公告)号：US06835297B1
公开(公告)日：2004-12-28
申请号：US10070748
申请日：2002-06-24
申请人： Toshiko Yokota , Susumu Takahashi , Makoto Dobashi , Yoshiaki Kinoshita
发明人： Toshiko Yokota , Susumu Takahashi , Makoto Dobashi , Yoshiaki Kinoshita
IPC分类号： C25C112
CPC分类号： C25C1/12 , Y02P10/212
摘要： The method for electrolytically refining copper makes use of crude copper as an anode and is characterized in that the temperature of the electrolyte in an electrolytic cell is maintained at a level of not less than 55° C.; that the electrolyte is continuously introduced into the electrolytic cell from the top of the cell, continuously discharged from the bottom of the cell along with slime, the slime is removed from the electrolyte discharged from the electrolytic cell and the electrolyte free of any slime is recirculated in the cell; and that the electrolyte is passed through the space between the electrodes at an average electrolyte velocity sufficient for allowing the electrolyte to flow on the whole surface of the cathode downward or in the direction opposite to that of the upward stream of the electrolyte generated on the cathode surface when the electrolysis is initiated while the electrolyte is in the stationary state.
摘要翻译：铜的电解精炼方法利用粗铜作为阳极，其特征在于，电解槽中的电解液的温度维持在不低于55℃的水平。电解液从电池顶部连续地从电池顶部连续排放到电池的底部，与粘液一起排出，从电解液排出的电解液中除去粘液，并且不含任何粘液的电解液再循环在细胞中并且电解质以平均电解速度通过电解质，其电解液速度足以允许电解液在阴极的整个表面上向下或与在阴极上产生的电解质向上流的方向相反的方向流动当电解液处于静止状态时电解开始时的表面。

33. 发明授权

US06544664B1 Copper foil for printed wiring board 失效
标题翻译：铜箔印刷线路板
公开(公告)号：US06544664B1
公开(公告)日：2003-04-08
申请号：US09577958
申请日：2000-05-24
申请人： Naotomi Takahashi , Yoichi Babasaki , Tsutomu Higuchi , Osamu Nakano , Hiroshi Watanabe , Masaru Takahashi , Makoto Dobashi
发明人： Naotomi Takahashi , Yoichi Babasaki , Tsutomu Higuchi , Osamu Nakano , Hiroshi Watanabe , Masaru Takahashi , Makoto Dobashi
IPC分类号： B32B1500
CPC分类号： H05K3/388 , C23C14/16 , Y10T428/12438 , Y10T428/12847 , Y10T428/12903 , Y10T428/265
摘要： A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.
摘要翻译：本文公开了一种用于制造印刷电路板的铜箔和包含铜箔的覆铜层压板，铜箔的特征在于，通过气相沉积在铜箔的至少一侧上形成金属铬层，其特征在于，铜箔的一面由载体通过脱模层支撑，并且通过气相沉积在箔的另一侧上形成金属铬层。铜箔对各种基板的粘附性（基板和铜箔之间的剥离强度），耐湿性，耐化学性和耐热性优异，因此铜箔可以适用于印刷电路板的制造。

34. 发明授权

US06335099B1 Corrosion resistant, magnesium-based product exhibiting luster of base metal and method for producing the same 失效
标题翻译：表现出贱金属光泽的耐腐蚀镁基产品及其制造方法
公开(公告)号：US06335099B1
公开(公告)日：2002-01-01
申请号：US09403503
申请日：1999-10-22
申请人： Tsutomu Higuchi , Mitsuo Suzuki , Makoto Dobashi
发明人： Tsutomu Higuchi , Mitsuo Suzuki , Makoto Dobashi
IPC分类号： B32B1504
CPC分类号： C25D11/30
摘要： A corrosion-resistant article of a magnesium material having the gloss of the metal substrate surface comprises an anodic oxide film formed on the external surface of an article of magnesium or a magnesium alloy, which never changes the gloss of the metal substrate and a colorless or colored transparent electrodeposition coating film on the anodic film. Such an article can be prepared by immersing an article of magnesium or a magnesium alloy in an electrolyte containing a phosphate and an aluminate to thus form an anodic oxide film through anodization of the surface of the article and forming a colorless or colored transparent electrodeposition coating film on the anodic film through electrodeposition coating.
摘要翻译：具有金属基材表面的光泽的镁材料的耐腐蚀制品包括形成在镁或镁合金制品的外表面上的阳极氧化膜，其不会改变金属基材的光泽，并且无色或在阳极膜上着色的透明电沉积涂膜。这样的制品可以通过将镁或镁合金制品浸入含有磷酸盐和铝酸盐的电解质中来制备，从而通过阳极氧化制品的表面形成阳极氧化膜并形成无色或有色的透明电沉积涂膜在阳极膜上通过电沉积涂层。

35. 发明授权

US06194056B1 High tensile strength electrodeposited copper foil 失效
标题翻译：高抗拉强度的电沉积铜箔
公开(公告)号：US06194056B1
公开(公告)日：2001-02-27
申请号：US09349601
申请日：1999-07-09
申请人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
发明人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
IPC分类号： B32B300
CPC分类号： H05K1/09 , C25D1/04 , C25D3/38 , H05K2201/0355 , Y10T428/24917
摘要： A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.
摘要翻译：在180℃下加热1小时后，具有2.5μm以下的无光泽粗糙度Rz为2.5μm以下且拉伸强度为40,000Kgf / mm2的高拉伸强度的铜箔是通过将铜从含有预定的少量的聚醚二醇和锡和铁离子。氯离子含量保持在0.1重量％以下。 ppm。铜箔的特征在于具有主要（111）取向的原子单元的铜晶体。

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