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31. 发明申请

US20120243985A1 AXIAL BLOWER 审中-公开
标题翻译：轴流风机
公开(公告)号：US20120243985A1
公开(公告)日：2012-09-27
申请号：US13425688
申请日：2012-03-21
申请人： Kazuhiro NITTA , Akira UEDA , Atsushi YAMAGUCHI , Akihiro OTSUKA , Tadashi KATSUI
发明人： Kazuhiro NITTA , Akira UEDA , Atsushi YAMAGUCHI , Akihiro OTSUKA , Tadashi KATSUI
IPC分类号： F04D29/52 , F04D19/00
CPC分类号： F04D29/681 , F04D25/0613 , F04D29/526 , F04D29/685
摘要： An axial blower includes a moving vane generating air flow by rotation, a casing accommodating said moving vane, and an adapter detachably attached to the casing. The adapter includes a fitting part to be fit to an inner surface of the casing. The adapter forms a protrusion or a step on the inner surface of the casing.
摘要翻译：轴流鼓风机包括通过旋转产生空气流的移动叶片，容纳所述活动叶片的壳体和可拆卸地附接到壳体的适配器。适配器包括配合到壳体内表面的配合部件。适配器在壳体的内表面上形成突起或台阶。

32. 发明申请

US20110303406A1 AIR-CONDITIONING SYSTEM AND CONTROL DEVICE THEREOF 审中-公开
标题翻译：空调系统及其控制装置
公开(公告)号：US20110303406A1
公开(公告)日：2011-12-15
申请号：US13154838
申请日：2011-06-07
申请人： Jun Takeda , Nobuyuki Tamura , Tadashi Katsui , Masamichi Iwasaki , Shinji Mizumura , Hideo Okoshi
发明人： Jun Takeda , Nobuyuki Tamura , Tadashi Katsui , Masamichi Iwasaki , Shinji Mizumura , Hideo Okoshi
IPC分类号： G05D23/00 , H05K7/20
CPC分类号： H05K7/20745 , H05K7/20836
摘要： A computer room air-conditioning system includes a temperature detection unit which is provided for each of a front and a back of each rack, and measures air temperatures of the front and the back; and a control device for acquiring a measured temperature by each temperature detection unit, and performing control based on the measured temperature. With the configuration, the control device includes a temperature difference calculation unit for calculating a temperature difference between cool air at the front and warm air at the back of each rack based on each measured and acquired temperature; and a heating element cooling control unit for controlling by adjustment an amount of flow of cool air from the underfloor space to the computer room based on the calculated temperature difference.
摘要翻译：计算机室空调系统包括为每个机架的前后设置的温度检测单元，并且测量前后的空气温度; 以及控制装置，用于通过每个温度检测单元获取测量的温度，并且基于测量的温度进行控制。通过该结构，控制装置具有：温度差计算部，其根据各测定和获取的温度，计算前端的冷空气与后方的暖风的温度差; 以及加热元件冷却控制单元，用于基于计算出的温差来调节从地板下空间到计算机室的冷气流量。

33. 发明申请

US20110142612A1 COUNTER-ROTATING AXIAL FLOW FAN 有权
标题翻译：逆转轴流风扇
公开(公告)号：US20110142612A1
公开(公告)日：2011-06-16
申请号：US12967200
申请日：2010-12-14
申请人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
发明人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
IPC分类号： F04D29/44 , F03D1/02
CPC分类号： F04D29/544 , F04D19/007 , F04D19/024 , F04D29/663
摘要： A counter-rotating axial flow fan in which the shape of stationary blades of a middle stationary portion is optimized to reduce noise is provided. Defining the maximum axial chord length of front blades as Lf, the maximum axial chord length of rear blades as Lr, and the maximum axial chord length of stationary blades as Lm, a relationship of Lm/(Lf+Lr) 5.8.
摘要翻译：提供了一种反向旋转轴流风扇，其中中间静止部分的固定叶片的形状被优化以降低噪声。将前刀片的最大轴向长度定义为Lf，后刀片的最大轴向弦长度为Lr，固定刀片的最大轴向弦长为Lm，满足Lm /（Lf + Lr）<0.14的关系。定义固定叶片下表面的叶片和下表面之间的最大尺寸为K1，固定叶片的最大轴向弦长Lm满足Lm / K1> 5.8的关系。

34. 发明申请

US20110060571A1 Thermal-fluid-simulation analyzing apparatus 有权
标题翻译：热流体仿真分析仪
公开(公告)号：US20110060571A1
公开(公告)日：2011-03-10
申请号：US12805591
申请日：2010-08-06
申请人： Akira Ueda , Junichi Ishimine , Ikuro Nagamatsu , Masahiro Suzuki , Tadashi Katsui , Yuji Ohba , Seiichi Saito , Nobuyoshi Yamaoka , Yasushi Uraki
发明人： Akira Ueda , Junichi Ishimine , Ikuro Nagamatsu , Masahiro Suzuki , Tadashi Katsui , Yuji Ohba , Seiichi Saito , Nobuyoshi Yamaoka , Yasushi Uraki
IPC分类号： G06G7/48
CPC分类号： G06F17/50 , G06F17/5004 , G06F17/5018 , G06F2217/16 , G06F2217/80 , H05K7/20609 , H05K7/20836
摘要： A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.
摘要翻译：热流体模拟分析装置包括执行单元，其使用分析条件生成分析模型，以基于所生成的分析模型进行第一热流体模拟分析;分析条件收集单元，其在预定时间段通过时收集分析条件在第一热流体模拟分析之后，条件提取单元从分析条件收集单元收集的分析条件中提取边界条件，以及重新执行单元，其选择与条件提取所提取的边界条件相对应的区域由执行单元生成的分析模型的区域的单位，更新所选择的区域与边界条件，并对更新的分析模型进行第二热流体模拟分析。

35. 发明申请

US20110059687A1 DATA CENTER, COOLING SYSTEM, AND METHOD OF COOLING INFORMATION TECHNOLOGY DEVICE 审中-公开
标题翻译：数据中心，冷却系统和冷却信息技术设备的方法
公开(公告)号：US20110059687A1
公开(公告)日：2011-03-10
申请号：US12873909
申请日：2010-09-01
申请人： Tadashi Katsui , Junichi Ishimine , Seiichi Saito , Masahiro Suzuki , Ikuro Nagamatsu , Yuji Ohba , Nobuyoshi Yamaoka , Akira Ueda , Yasushi Uraki
发明人： Tadashi Katsui , Junichi Ishimine , Seiichi Saito , Masahiro Suzuki , Ikuro Nagamatsu , Yuji Ohba , Nobuyoshi Yamaoka , Akira Ueda , Yasushi Uraki
IPC分类号： F24F7/00
CPC分类号： H05K7/20745
摘要： A data center includes a housing room that houses an information technology device; an air conditioning machine that cools air in the housing room and supplies the air under a floor of the housing room; a grille that allows the air supplied under the floor to circulate in the housing room; and a rack device that houses the information technology device. In the housing room in the data center, the rack device is arranged in such a way as to surround the grille. The information technology device is housed in the rack device in such a way as to take in air from a space surrounded by the rack device via the grille and discharge air to the housing room. The air conditioning machine is arranged at a side from which the information technology device discharges air.
摘要翻译：数据中心包括一个容纳信息技术设备的房间; 空调机，其对所述收容室内的空气进行冷却，并将所述空气供给到所述收容室的地板下; 允许在地板下方供应的空气在容纳室中循环的格栅; 以及容纳信息技术装置的机架装置。在数据中心的房屋中，机架装置以围绕格栅的方式布置。信息技术装置被容纳在机架装置中，以便经由格栅从由机架装置包围的空间吸入空气，并将空气排出到容纳室。空调机设置在信息技术装置排出空气的一侧。

36. 发明申请

US20100297927A1 AIR CONDITIONING INSTALLATION 审中-公开
标题翻译：空调安装
公开(公告)号：US20100297927A1
公开(公告)日：2010-11-25
申请号：US12782886
申请日：2010-05-19
申请人： Ikuro NAGAMATSU , Junichi ISHIMINE , Seiichi SAITO , Masahiro SUZUKI , Tadashi KATSUI , Yuji OHBA , Nobuyoshi YAMAOKA , Akira UEDA , Yasushi URAKI
发明人： Ikuro NAGAMATSU , Junichi ISHIMINE , Seiichi SAITO , Masahiro SUZUKI , Tadashi KATSUI , Yuji OHBA , Nobuyoshi YAMAOKA , Akira UEDA , Yasushi URAKI
IPC分类号： F24F11/04 , F24F13/10
CPC分类号： H05K7/20745 , F24F1/005 , F24F1/0053
摘要： An installation for cooling an electronic device provided on a floor in a room includes an underfloor space below the floor; an air conditioner for sending air to the underfloor space; a first opening provided in the floor and adjacent to the electronic device, for sending air from the underfloor space to the room; and a second opening provided in the floor and adjacent to the air conditioner, the second opening being configured to cause the air pressure of the lower side of the second opening to be lower than the air pressure of the upper side of the second opening.
摘要翻译：用于冷却设置在房间的地板上的电子设备的设备包括地板下面的地板下方的空间; 一个用于将空气送到地板下空间的空调; 设置在地板上并靠近电子设备的第一开口，用于将空气从地板下方的空间传送到房间; 以及第二开口，设置在所述地板上并与所述空调相邻，所述第二开口构造成使得所述第二开口的下侧的空气压力低于所述第二开口的上侧的空气压力。

37. 发明授权

US07828045B2 Heat sink and information processor using heat sink 失效
标题翻译：散热片和信息处理器采用散热片
公开(公告)号：US07828045B2
公开(公告)日：2010-11-09
申请号：US10230992
申请日：2002-08-30
申请人： Tadashi Katsui
发明人： Tadashi Katsui
IPC分类号： H05K7/20
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/12 , F28F13/06 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.
摘要翻译：本发明涉及一种散热器。更具体地，本发明涉及一种散热器，其用于从诸如笔记本型个人计算机的便携式电子设备中布置的诸如微处理器的集成电路封装散热，并且还用于从硬盘在电子设备中使用的单元。散热器包括：用于传递由加热部件产生的热量的传热部件; 保持部，其保持所述传热部件; 以及具有空间的散热体，其中嵌入有至少具有叶片的冷却风扇和驱动电动机，其中，用于保持传热构件的保持部分的部分位于空间下方。

38. 发明申请

US20080257639A1 Storage box for electronic apparatus 有权
标题翻译：电子仪器储物箱
公开(公告)号：US20080257639A1
公开(公告)日：2008-10-23
申请号：US12081498
申请日：2008-04-16
申请人： Atsushi Yamaguchi , Junichi Ishimine , Masahiro Suzuki , Tadashi Katsui , Shin-ichirou Kouno , Akira Takahashi , Akihiro Watanabe , Tomohiro Okazaki
发明人： Atsushi Yamaguchi , Junichi Ishimine , Masahiro Suzuki , Tadashi Katsui , Shin-ichirou Kouno , Akira Takahashi , Akihiro Watanabe , Tomohiro Okazaki
IPC分类号： A47B81/00
CPC分类号： H05K7/20736 , Y10T29/4913
摘要： A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.
摘要翻译：存储箱的箱形外壳包括限定第一和第二平面之间的存储空间的消音壁或壁。存储空间在第一和第二平面处打开。一个消音壁构件沿第一平面延伸。辅助箱形外壳连接到箱形外壳，以封闭箱形外壳的第一平面。辅助箱形外壳限定了与储存空间隔离的辅助空间和消音壁构件。存储空间通过通风口和辅助空间连接到新鲜空气。箱状外壳和防静电壁构件的致密壁或壁用于防止操作声音的泄漏。

39. 发明授权

US06501652B2 Heat sink and information processor using it 失效
标题翻译：散热器和信息处理器使用它
公开(公告)号：US06501652B2
公开(公告)日：2002-12-31
申请号：US09931874
申请日：2001-08-20
申请人： Tadashi Katsui
发明人： Tadashi Katsui
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a heat sink. It is an object of the present invention to provide a heat sink at a low manufacturing cost, the life of the motor of which is long so that the reliability of the heat sink can be enhanced and, further, a sufficiently high cooling performance can be obtained and the designing of the heat sink can be easily performed. The heat sink includes: a bottom surface coming into contact with a heating element; a side on which a plurality of ventilation holes are formed; and an upper surface into which a cooling fan composed of blades and a motor is embedded and fixed.
摘要翻译：本发明涉及一种散热器。本发明的目的是提供一种低制造成本的散热器，其电动机的寿命长，从而可以提高散热器的可靠性，并且还可以具有足够高的冷却性能可以容易地实现散热器的设计。散热器包括：与加热元件接触的底面; 其上形成有多个通气孔的一侧; 以及嵌入并固定由叶片和马达构成的冷却风扇的上表面。

40. 发明授权

US06487079B2 Heat sink and mounting structure for heat sink 失效
标题翻译：散热器和散热器的安装结构
公开(公告)号：US06487079B2
公开(公告)日：2002-11-26
申请号：US09825053
申请日：2001-04-04
申请人： Tadashi Katsui
发明人： Tadashi Katsui
IPC分类号： H05K720
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat: sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.
摘要翻译：用于将散热器安装在安装在印刷电路板上的集成电路封装上的结构被构造成使得具有框架部分和支撑柱部分的引导构件固定到印刷电路板上，并且散热器就座在内部引导构件的周边，使得散热器可以与集成电路封装紧密接触，然后将盖子固定到引导构件，使得其覆盖在散热器的上表面的外周边缘部分上。该结构的冷却效率高，易于安装。

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