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    • 37. 发明授权
    • Multistage mounting printed circuit board system and method
    • 多级安装印刷电路板系统及方法
    • US07280371B2
    • 2007-10-09
    • US10758982
    • 2004-01-16
    • Stephan Karl BarsunRobert William Dobbs
    • Stephan Karl BarsunRobert William Dobbs
    • H05K1/11H05K1/14
    • H05K7/142H05K7/1409
    • A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).
    • 提出了一种多级安装印刷电路板系统和方法。 在一个实施例中,多级安装印刷电路板系统包括用于将电气部件安装在其上的第一印刷电路板。 第一印刷电路板接口部件耦合到第一印刷电路板。 第一印刷电路板接口组件经由第二印刷电路板接口部件将第一印刷电路板通信地耦合到第二印刷电路板。 多个印刷电路板提取器耦合到第一印刷电路板。 多个印刷电路板提取器将第一印刷电路板耦合到卡引导件(例如,安装第二印刷电路板的单对卡引导件)。