专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20100126688A1 METHOD FOR FILLING METAL INTO FINE SPACE 有权
标题翻译：将金属填充到精细空间的方法
公开(公告)号：US20100126688A1
公开(公告)日：2010-05-27
申请号：US12394774
申请日：2009-02-27
申请人： Shigenobu SEKINE , Yurina Sekine , Ryuji Kimura
发明人： Shigenobu SEKINE , Yurina Sekine , Ryuji Kimura
IPC分类号： B22D27/15 , B22D19/00
CPC分类号： B22D19/00 , B81B2207/07 , B81C1/00095 , H01L21/486 , H01L21/76882 , H01L2924/0002 , H05K3/101 , H05K3/4038 , H05K2201/0305 , H05K2203/025 , H05K2203/0278 , H05K2203/085 , H05K2203/128 , Y10T29/4998 , Y10T29/49982 , Y10T29/49984 , Y10T29/49988 , Y10T29/49991 , Y10T29/49993 , H01L2924/00
摘要： The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.
摘要翻译：本发明包括在存在于物体内部的微细空间内冷却熔融金属并使其在施加超过大气压的强制外力对其进行硬化的步骤。在物体的外表面上的细长空间的一端开口。强制外力由选自按压压力，注射压力和轧制压实中的至少一个构件提供，并且在从其开口的开口表面侧向熔融金属施加的另一端一边的精细空间是封闭的。

32. 发明申请

US20090304834A1 Metal powder with nano-composite structure and its production method using a self-assembling technique 有权
标题翻译：金属粉末纳米复合结构及其制备方法采用自组装技术
公开(公告)号：US20090304834A1
公开(公告)日：2009-12-10
申请号：US12453376
申请日：2009-05-08
申请人： Shigenobu Sekine
发明人： Shigenobu Sekine
IPC分类号： B29B9/00
CPC分类号： H01F1/047 , B22F1/0014 , B22F1/0048 , B22F9/008 , B22F9/10 , B22F2009/084 , B22F2009/0844 , B22F2009/086 , B22F2009/0876 , H01F1/0551 , H01F1/0571 , H01F1/0574
摘要： Methods, apparatuses and systems for producing powder particles of extremely small, highly uniform spherical shape and high sphericity, composed of metal including single metals and alloys, including nanocomposite structures, using a self-assembling procedure. The invention further includes the produced spherical particles. The metal spherical particles are produced whereby molten metal, alloys or composites are directed onto a fast-rotating disk in an atmosphere containing one or more inert gases and small amounts of an oxidizing gas and the molten metal drops are dispersed as tiny droplets for a predetermined time using centrifugal force within a cooling-reaction gas, and then cooled rapidly to form solid spherical particles. The spherical particles comprise a crystalline, amorphous or porous composition, having a size of 1-300 μm±1% with a uniformity of size being ≦60-70% and a precise spherical shape of less than or equal to ±10%.
摘要翻译：使用自组装方法制造由包括单一金属和合金在内的金属（包括纳米复合结构）组成的极小，高度均匀的球形和高球形度的粉末颗粒的方法，装置和系统。本发明还包括所生产的球形颗粒。制造金属球形颗粒，其中熔融金属，合金或复合材料在含有一种或多种惰性气体和少量氧化气体的气氛中被引导到快速旋转盘上，并且熔融金属液滴以微小液滴分散在预定的时间在冷却反应气体内使用离心力，然后迅速冷却，形成固体球形颗粒。球形颗粒包含晶体，无定形或多孔组合物，其尺寸为1-300mum±1％，其尺寸均匀度为<= 60-70％，精确的球形形状小于或等于±10％。

33. 发明申请

US20080038555A1 SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, AND GOOD SPHERICITY AND METHOD FOR PRODUCING 有权
标题翻译：具有纳米尺寸的晶体颗粒，结晶结构和良好的亲水性和生产方法
公开(公告)号：US20080038555A1
公开(公告)日：2008-02-14
申请号：US11836457
申请日：2007-08-09
申请人： Shigenobu SEKINE , Yurina SEKINE
发明人： Shigenobu SEKINE , Yurina SEKINE
IPC分类号： B32B15/02 , B22F9/00 , H05H1/26
CPC分类号： B22F9/06 , B22F1/0085 , B22F9/002 , B22F9/08 , B22F9/082 , B22F2009/084 , B22F2009/0844 , B22F2998/00 , B22F2998/10 , B22F2999/00 , C01G1/00 , C01P2002/60 , C01P2002/90 , C01P2004/32 , Y10T428/12181 , Y10T428/2982 , B22F2201/11 , B22F2201/013 , B22F2201/02 , B22F2201/03 , B22F2201/30 , B22F9/10 , B22F2202/13
摘要： There is provided nanometer-size spherical particles. The particles of the present invention are made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 μm; and a sphericity of −10% to +10%.
摘要翻译：提供了纳米尺寸的球形颗粒。本发明的颗粒由选自金属，合金和金属化合物的至少一种制成。颗粒包括多晶区域和单晶区域中的一个或两个。颗粒的粒径小于1μm; 和球形度为-10％至+ 10％。

34. 发明授权

US5865873A Method of preparing raw material powder for permanent magnets superior in moldability 失效
标题翻译：制备成型性优异的永磁体用原料粉末的方法
公开(公告)号：US5865873A
公开(公告)日：1999-02-02
申请号：US779218
申请日：1997-01-06
申请人： Shigenobu Sekine , Hiroji Sato
发明人： Shigenobu Sekine , Hiroji Sato
IPC分类号： B22F9/22 , B22F1/00 , H01F1/057 , H01F1/059 , H01F1/06
CPC分类号： H01F1/059 , B22F1/0007 , B22F1/0085 , H01F1/0571 , H01F1/0578 , B22F2999/00
摘要： The present invention is directed to provide a method of preparing a raw material powder for permanent magnets superior in moldability, especially in moldability and productivity of bonded magnets. The method comprises subjecting an acicular iron powder having an aspect ratio of not smaller than 5:1 to heating at 800.degree.-900.degree. C. in fluidized state with a gas stream containing no oxygen until the acicular iron powder is transformed into a columnar shape iron powder having an aspect ratio of not larger than 3:1, a die-like shape iron powder or a spherical shape iron powder. The acicular iron powder may contain or may be attached by such a component effective for improving magnetic properties as a rare earth element metal, a rare earth element metal oxide, boron, cobalt and nickel.
摘要翻译：本发明的目的在于提供一种制备永久磁铁用原料粉末的方法，该成型性优异，特别是成形性和粘结磁铁的生产率。该方法包括使长径比不小于5:1的针状铁粉在流化状态下在不含氧的气流中加热至800-900℃，直到针状铁粉转变为柱状长径比不大于3:1的铁粉，模具状铁粉或球形铁粉。针状铁粉可以含有或者可以通过这样一种有助于提高作为稀土元素金属，稀土元素金属氧化物，硼，钴和镍的磁性能的组分附着。

35. 发明授权

US09230860B2 Semiconductor substrate, electronic device and method for manufacturing the same 有权
标题翻译：半导体衬底，电子器件及其制造方法
公开(公告)号：US09230860B2
公开(公告)日：2016-01-05
申请号：US13587322
申请日：2012-08-16
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L21/768 , H01L23/48 , H01L21/02 , H01L21/28
CPC分类号： H01L21/76898 , H01L21/02109 , H01L21/02225 , H01L21/02227 , H01L21/02269 , H01L21/28 , H01L21/768 , H01L21/76838 , H01L23/481 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2924/1305 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles.
摘要翻译：半导体衬底包括垂直导体和绝缘层。垂直导体包括纳米复合晶体结构的金属/合金成分，并且沿其厚度方向填充在半导体衬底中形成的垂直孔中。绝缘层围绕垂直导体形成为环形，并且包括nm尺寸的二氧化硅颗粒和填充二氧化硅颗粒之间的空间的纳米晶体或纳米无定形二氧化硅，以提供与二氧化硅颗粒一起的纳米复合结构。

36. 发明授权

US08609999B2 Circuit board, electronic device and method for manufacturing the same 有权
标题翻译：电路板，电子装置及其制造方法
公开(公告)号：US08609999B2
公开(公告)日：2013-12-17
申请号：US13017590
申请日：2011-01-31
申请人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
发明人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
IPC分类号： H05K1/11 , H01L21/768
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/4038 , H05K3/4061 , H05K3/4614 , H05K2201/0215 , H05K2201/0218 , H05K2201/0305 , H05K2201/0394 , H05K2201/083 , H05K2203/0285 , H05K2203/104 , H05K2203/128 , Y10T29/49155 , Y10T29/49156 , H01L2924/00012 , H01L2924/00
摘要： A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.
摘要翻译：电路板包括基板，电路图案和通孔电极。电路图案沿其厚度方向设置在基板的一侧。通孔电极填充在形成在基板中的通孔中，其一端连接到电路图案。电路图案和贯通电极各自具有含有贵金属成分（例如Au成分）的区域，并且通过其彼此连接。

37. 发明授权

US08569632B2 Wiring board having through hole or non-through hole, and method for producing the same 有权
标题翻译：具有通孔或非通孔的接线板及其制造方法
公开(公告)号：US08569632B2
公开(公告)日：2013-10-29
申请号：US11580871
申请日：2006-10-16
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H05K1/11
CPC分类号： H05K3/0094 , H05K3/4038 , H05K2201/0305 , H05K2203/0285 , H05K2203/0425
摘要： There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity.
摘要翻译：提供了一种包括具有孔的基板的电路板。在孔内形成金属布线。布线由熔点为100-600℃的焊料合金制成，金属布线包括焊料合金的多晶区域。本发明的金属布线的导电性优异。

38. 发明申请

US20130075930A1 SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20130075930A1
公开(公告)日：2013-03-28
申请号：US13587322
申请日：2012-08-16
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76898 , H01L21/02109 , H01L21/02225 , H01L21/02227 , H01L21/02269 , H01L21/28 , H01L21/768 , H01L21/76838 , H01L23/481 , H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2924/1305 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles.

39. 发明申请

US20120168206A1 SUBSTRATE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE 有权
标题翻译：电子设备和电子设备用基板
公开(公告)号：US20120168206A1
公开(公告)日：2012-07-05
申请号：US13313823
申请日：2011-12-07
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H05K7/20 , H05K1/16 , H05K1/11 , H05K1/03 , B82Y99/00
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/3677 , H01L23/49877 , H01L33/486 , H01L33/642 , H01L2224/16225 , H01L2224/48472 , H01L2924/01327 , H01L2924/09701 , H01L2924/12044 , H01L2924/181 , H01L2933/0066 , H01L2924/00 , H01L2924/00012
摘要： A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.
摘要翻译：基板包括多个贯通电极。通孔电极具有包括纳米尺寸的碳纳米管的纳米复合结构，并且是通过使用在基板中形成的通孔作为模具而形成的铸件。

40. 发明授权

US07910837B2 Circuit board, electronic device and method for manufacturing the same 有权
标题翻译：电路板，电子装置及其制造方法
公开(公告)号：US07910837B2
公开(公告)日：2011-03-22
申请号：US12180831
申请日：2008-07-28
申请人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
发明人： Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
IPC分类号： H01R12/04 , H05K1/11 , H05K3/02 , H05K3/10
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/4038 , H05K3/4061 , H05K3/4614 , H05K2201/0215 , H05K2201/0218 , H05K2201/0305 , H05K2201/0394 , H05K2201/083 , H05K2203/0285 , H05K2203/104 , H05K2203/128 , Y10T29/49155 , Y10T29/49156 , H01L2924/00012 , H01L2924/00
摘要： A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.
摘要翻译：电路板包括基板，电路图案和通孔电极。电路图案沿其厚度方向设置在基板的一侧。通孔电极填充在形成在基板中的通孔中，其一端连接到电路图案。电路图案和贯通电极各自具有含有贵金属成分（例如Au成分）的区域，并且通过其彼此连接。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式