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31. 发明授权

US09385274B2 Patterned opto-electrical substrate and method for manufacturing the same 有权
标题翻译：图案化的光电基板及其制造方法
公开(公告)号：US09385274B2
公开(公告)日：2016-07-05
申请号：US14104547
申请日：2013-12-12
申请人： Kinik Company
发明人： Wen-Cheng Ke , Wei-Kuo Chen , Fwu-Yih Houng , Chia-Che Ho
IPC分类号： H01L21/00 , H01L31/0256 , H01L33/22 , H01L33/12 , H01L33/32 , H01L33/00 , H01L21/02
CPC分类号： H01L33/22 , H01L21/0242 , H01L21/0243 , H01L33/005 , H01L33/007 , H01L33/12 , H01L33/32
摘要： The present invention relates to a patterned opto-electrical substrate, comprising a substrate, the substrate has a first patterned structure, a spacer region and a second patterned structure, wherein the second patterned structure is formed on one or both of the first patterned structure and the spacer region, and the first patterned structure is a micron-scale protruding structure or a micron-scale recessing structure, while the second patterned structure is a submicron-scale recessing structure. The present invention also relates to a method for manufacturing the aforementioned patterned opto-electrical substrate and light emitting diodes having the aforementioned patterned opto-electrical substrate.
摘要翻译：本发明涉及一种图案化的光电衬底，包括衬底，衬底具有第一图案化结构，间隔区域和第二图案化结构，其中第二图案化结构形成在第一图案化结构的一个或两个上，间隔区域和第一图案化结构是微米级突出结构或微米级凹陷结构，而第二图案结构是亚微米级凹陷结构。本发明还涉及一种用于制造上述图案化的光电基板和具有上述图案化的光电基板的发光二极管的方法。

32. 发明授权

US09259822B2 Chemical mechanical polishing conditioner and manufacturing methods thereof 有权
标题翻译：化学机械抛光调理剂及其制造方法
公开(公告)号：US09259822B2
公开(公告)日：2016-02-16
申请号：US14198162
申请日：2014-03-05
申请人： Kinik Company
发明人： Jui-Lin Chou , Chia Chun Wang , Chia-Feng Chiu , Chung-Yi Cheng
IPC分类号： B24B53/00 , B24D3/06 , B24D7/18 , B24B53/017 , B24B53/12
CPC分类号： B24B53/017 , B24B53/12 , B24D7/18
摘要： The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.
摘要翻译：化学机械抛光调理剂及其制造方法技术领域本发明涉及化学机械抛光调理剂及其制造方法。所述化学机械抛光调理剂包括：具有平整表面的平面基板; 设置在所述平面基板的表面上的接合层; 以及嵌入在所述接合层的表面中的多个磨料颗粒，并通过所述粘合层固定在所述平面基板的表面上; 其中所述平面基板通过在固化所述粘合层期间对所述非平面基板进行变形补偿而形成，并且因此所述磨料颗粒的末端具有调平高度。因此，本发明可以有效地改善加热和固化过程中化学机械抛光调理剂的基材的热变形问题，从而提高化学机械抛光调理剂的表面平整度。

33. 发明授权

US09216438B2 Diamond screening apparatus 有权
标题翻译：钻石筛选设备
公开(公告)号：US09216438B2
公开(公告)日：2015-12-22
申请号：US14168360
申请日：2014-01-30
申请人： Kinik Company
发明人： Jui-Lin Chou , Chia Chun Wang , Chia-Feng Chiu , Wen-Jen Liao , Jen Feng Chen
IPC分类号： B07C5/342 , B25J15/06 , B25J9/00 , G05B19/418 , G06T7/00
CPC分类号： B07C5/3422 , B25J9/0093 , B25J15/0616 , G05B19/4182 , G05B2219/40554 , G05B2219/40564 , G05B2219/40607 , G06T7/0006 , G06T2207/30108 , Y02P90/083
摘要： The present invention relates to a diamond screening apparatus, comprising: a working platform comprising a working plane; a conveyer disposed on the working plane of the working platform for carrying a diamond matrix unit; an image capture device forming one or a plurality of captured images in different regions of the diamond matrix unit; a display device; and an image recognition module, which is electrically connected to the image capture device and the display device, performs a geometric feature parameter analysis on the captured images to determine one or a plurality of risk diamonds of the diamond matrix unit.
摘要翻译：金刚石筛选装置技术领域本发明涉及金刚石筛选装置，其特征在于，包括：工作平台，设置在用于承载金刚石矩阵单元的工作平台的工作平面上的输送机; 在所述菱形矩阵单元的不同区域中形成一个或多个捕获图像的图像捕获装置; 显示装置; 并且电连接到图像捕获装置和显示装置的图像识别模块对所捕获的图像执行几何特征参数分析，以确定菱形矩阵单元的一个或多个风险菱形。

34. 发明申请

US20150202735A1 CHEMICAL MECHANICAL POLISHING CONDITIONER WITH OPTIMAL ABRASIVE EXPOSING RATE 审中-公开
标题翻译：化学机械抛光调理器，具有最佳的磨耗率
公开(公告)号：US20150202735A1
公开(公告)日：2015-07-23
申请号：US14539842
申请日：2014-11-12
申请人： Kinik Company
发明人： I-Tsao LIAO
IPC分类号： B24B53/017 , B24B53/12
CPC分类号： B24B53/017 , B24B53/12
摘要： The present invention relates to a chemical mechanical polishing conditioner with optimal abrasive exposing rate, comprising a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein each abrasive particle has an abrasive exposing rate which is ¼ to ¾ of particle sizes of the abrasive particles and is measured by a height measuring device. Therefore, the chemical mechanical polishing conditioner with optimal abrasive exposing rate of the present invention can control the exposing rate of the abrasive particles to improve the cut rate of the conditioner.
摘要翻译：本发明涉及具有最佳研磨曝光速率的化学机械抛光调理剂，其包含基材; 设置在所述基板上的接合层; 以及多个磨料颗粒放置在粘合层上，并且磨料颗粒通过粘结层放置在基底上; 其中每个磨料颗粒的磨料暴露速率为研磨颗粒粒径的1/4至3/4，并由高度测量装置测量。因此，具有本发明的最佳研磨曝光率的化学机械抛光调理剂可以控制研磨剂颗粒的曝光速率，以提高调理剂的切割速率。

35. 发明申请

US20140335624A1 DETECTION METHOD AND APPARATUS FOR THE TIP OF A CHEMICAL MECHANICAL POLISHING CONDITIONER 审中-公开
标题翻译：化学机械抛光调理器提示的检测方法及装置
公开(公告)号：US20140335624A1
公开(公告)日：2014-11-13
申请号：US14274375
申请日：2014-05-09
申请人： Kinik Company
发明人： Jui-Lin CHOU , Chia Chun WANG , Chia-Feng CHIU , Wen-Jen LIAO
IPC分类号： G01N31/22
CPC分类号： B24B53/017 , B24B49/12 , B24B49/18
摘要： The present invention relates to a detection method and apparatus for the tip of the chemical mechanical polishing conditioner, which comprises: providing a dyeing apparatus comprising a dyeing layer; providing a chemical mechanical polishing conditioner comprising a substrate, a binding layer, and a plurality of abrasive particles, the abrasive particles fixed on the substrate by the binding layer; making the abrasive particles of the chemical mechanical polishing conditioner toward the dyeing apparatus and provide a downward force, so that the chemical mechanical polishing conditioner is contacted with the dyeing layer; and separating the chemical mechanical polishing conditioner and the dyeing apparatus, so that the abrasive particles with a particular protruding height form dyeing abrasive particles adhered the dyeing layer on their surface, and the dyeing abrasive particles are determined as a defect of destroying the flatness of chemical mechanical polishing conditioner.
摘要翻译：本发明涉及化学机械抛光调理剂的尖端的检测方法和装置，其包括：提供包括染色层的染色装置; 提供一种化学机械抛光调理剂，其包含基材，粘合层和多个研磨颗粒，磨料颗粒通过粘合层固定在基材上; 使化学机械抛光调理剂的磨料颗粒朝向染色装置提供向下的力，使化学机械抛光调理剂与染色层接触; 并分离化学机械抛光调理剂和染色设备，使得具有特定突起高度的磨料颗粒形成染色磨料颗粒将染色层附着在其表面上，并且将染色磨料颗粒确定为破坏化学品的平整度的缺陷机械抛光调理剂。

36. 发明申请

US20140127983A1 CHEMICAL MECHANICAL POLISHING CONDITIONER AND MANUFACTURING METHODS THEREOF 有权
标题翻译：化学机械抛光调理器及其制造方法
公开(公告)号：US20140127983A1
公开(公告)日：2014-05-08
申请号：US14063230
申请日：2013-10-25
申请人： Kinik Company
发明人： Chia-Chun WANG , Kai-Hsiang CHANG , Chung-Yi CHENG , Wen-Jen LIAO
IPC分类号： B24B53/017 , B24D18/00
CPC分类号： B24B53/017 , B24D18/0009
摘要： The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.
摘要翻译：本发明涉及一种化学机械抛光调理剂的制造方法，包括：（A）提供非平面基材; （B）提供设置在所述非平面基板的表面上的粘结层; （C）提供嵌入在所述粘合层的表面中的多个磨料颗粒，和（D）热固化所述粘合层，使得所述非平面基材在固化所述粘结层期间变形为平面基材，颗粒通过粘合层固定在平面基底的表面上; 其中，在步骤（D）之后，磨料颗粒的尖端具有调平的高度。因此，本发明可以有效地改善热固化过程中化学机械抛光调理剂的基材的热变形问题，并且增强化学机械抛光调理剂的表面平整度。

37. 发明申请

US20210284890A1 GRINDING TOOL AND METHOD OF FABRICATING THE SAME 有权
公开(公告)号：US20210284890A1
公开(公告)日：2021-09-16
申请号：US17336631
申请日：2021-06-02
申请人： KINIK COMPANY
发明人： Jui-Lin CHOU , Chia-Feng CHIU , Chin-Chung CHOU , Hsin-Chun WANG
IPC分类号： C09K3/14 , B24B37/24 , C04B41/91 , C04B41/00 , B23K26/38 , B24D7/06 , B23K31/10 , B24D18/00 , B23K26/402
摘要： A method of fabricating a grinding tool includes providing an abrasive particle, and cutting the abrasive particle with a laser beam so that the cut abrasive particle has four tips adjacent to one another, a cavity of a generally cross shape extending between the four tips, and a material discharge surface at an end of the cavity. The laser beam is applied along a plurality of parallel first cutting lines and a plurality of parallel second cutting lines, the second cutting lines intersecting the first cutting lines, at least the first cutting lines being grouped into a first, a second and a third region, the second region being located between the first and third regions, a number of cutting passes repeated along each of the first cutting lines in each of the first and third regions increasing as the first cutting line is nearer to the second region, and the laser beam repeating a plurality of cutting passes along each of the first cutting lines in the second region.

38. 发明授权

US11053419B2 Grinding tool and method of fabricating the same 有权
公开(公告)号：US11053419B2
公开(公告)日：2021-07-06
申请号：US15980302
申请日：2018-05-15
申请人： Kinik Company
发明人： Jui-Lin Chou , Chia-Feng Chiu , Chin-Chung Chou , Hsin-Chun Wang
IPC分类号： C09K3/14 , B24B37/24 , C04B41/91 , C04B41/00 , B23K26/38 , B24D7/06 , B23K31/10 , B24D18/00 , B23K26/402 , B23K101/20 , B23K103/00
摘要： A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.

39. 发明授权

US10525567B2 Chemical-mechanical polishing abrasive pad conditioner and method for manufacturing same 有权
公开(公告)号：US10525567B2
公开(公告)日：2020-01-07
申请号：US15883656
申请日：2018-01-30
申请人： Kinik Company Ltd.
发明人： Jui-Lin Chou , Chin-Chung Chou , Chung-Yi Cheng , Hsin-Chun Wang , Yu-Chau Hung
IPC分类号： B24B53/017 , B24B53/00 , B24D18/00 , C08K3/22 , C08K3/02 , C30B29/36
摘要： The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

40. 发明申请

US20180354095A1 Grinding Tool and Method of Fabricating the Same 审中-公开
公开(公告)号：US20180354095A1
公开(公告)日：2018-12-13
申请号：US16003264
申请日：2018-06-08
申请人： Kinik Company
发明人： Jui-Lin CHOU , I-Tsao LIAO , Tsung-Yu YANG
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： A grinding tool includes a substrate and a plurality of abrasive particles. The substrate has a first and a second surface and a plurality of holes, each of the holes extending through the substrate and respectively having a first and a second opening on the first and second surface, the second opening being larger than the first opening. The abrasive particles are respectively disposed in the holes and attached to the substrate via a plurality of adhesive portions, each of the abrasive particles having a tip protruding outward from the first surface and a remaining part covered with one of the adhesive portions inside the corresponding hole, wherein the first openings of the holes are smaller than the abrasive particles, and the abrasive particles are respectively retained in the holes. Moreover, embodiments described herein include a method of fabricating a grinding tool.

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