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31. 发明授权

US08368190B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08368190B2
公开(公告)日：2013-02-05
申请号：US13074740
申请日：2011-03-29
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L23/495
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

32. 发明授权

US08338836B2 Light emitting device for AC operation 有权
标题翻译：用于交流操作的发光装置
公开(公告)号：US08338836B2
公开(公告)日：2012-12-25
申请号：US12513803
申请日：2007-09-05
申请人： Keon Young Lee , Dae Sung Kal
发明人： Keon Young Lee , Dae Sung Kal
IPC分类号： H01L29/18
CPC分类号： H01L25/0753 , H01L33/62 , H01L2924/0002 , H05B33/0803 , H05B33/0821 , H05B33/089 , Y02B20/341 , H01L2924/00
摘要： An AC light emitting device, in which a plurality of light emitting cells formed on a substrate are flip-bonded to a submount to be driven under an AC power source is disclosed. The light emitting device comprises a first serial array of light emitting cells, and a second serial array of light emitting cells, wherein the second serial array is connected in reverse parallel to the first serial array. Meanwhile, bonding patterns are formed on a submount substrate, and the light emitting cells of the first and second serial arrays are flip-bonded to the bonding patterns. Further, node connecting patterns are formed on the submount substrate, and connect the bonding patterns such that nodes corresponding to each other provided in the first and second serial arrays are electrically connected to each other. Accordingly, it is possible to provide an AC light emitting device which can prevent overvoltage from being applied to light emitting cells in the array to which reverse voltage is applied by bonding patterns and node connecting patterns formed on a submount substrate, thereby protecting the light emitting cells.
摘要翻译：公开了一种AC发光器件，其中形成在衬底上的多个发光单元被翻转接合到在AC电源下被驱动的基座。发光器件包括发光单元的第一串联阵列和发光单元的第二串联阵列，其中第二串联阵列与第一串联阵列反向并联连接。同时，在基板上形成接合图案，并且第一和第二串联阵列的发光单元被翻转接合到接合图案。此外，节点连接图案形成在副安装座基板上，并且连接接合图案，使得设置在第一和第二串行阵列中的彼此相对应的节点彼此电连接。因此，可以提供一种交流发光装置，其可以通过结合形成在副安装座基板上的图案和节点连接图案来防止过电压施加到阵列中的发光单元，反射电压被施加到反向电压，由此保护发光细胞。

33. 发明授权

US08198643B2 Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same 有权
公开(公告)号：US08198643B2
公开(公告)日：2012-06-12
申请号：US13105322
申请日：2011-05-11
申请人： Chung-Hoon Lee , Keon-Young Lee , Lacroix Yves
发明人： Chung-Hoon Lee , Keon-Young Lee , Lacroix Yves
IPC分类号： H01L29/18
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H05B33/0803 , H05B33/0809 , H05B33/0821 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

34. 发明授权

US08159000B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08159000B2
公开(公告)日：2012-04-17
申请号：US13159846
申请日：2011-06-14
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

35. 发明申请

US20120001568A1 LIGHT EMITTING APPARATUS USING AC LED 失效
标题翻译：使用交流LED的发光装置
公开(公告)号：US20120001568A1
公开(公告)日：2012-01-05
申请号：US12945295
申请日：2010-11-12
申请人： Keon Young LEE , Choong Hae Lee
发明人： Keon Young LEE , Choong Hae Lee
IPC分类号： H05B37/02
CPC分类号： H05B33/0806 , H05B33/0821 , H05B33/089
摘要： Provided is an AC LED light emitting device. The AC LED light emitting device flows a current to at least one AC LED array among at least two AC LED arrays of an AC LED light emitting unit to turn it on during one period of an AC power having sine wave characteristics if a magnitude of a voltage applied to the AC LED light emitting unit including at least two AC LED arrays each of which including at least one AC LED is smaller than a turn-on voltage determined according to the number of AC LED arrays of the AC LED light emitting unit. If the magnitude of the voltage applied to the AC LED light emitting unit is larger than the turn-on voltage of the AC LED light emitting unit, all of the AC LED arrays of the AC LED light emitting unit are turned on.
摘要翻译：提供了一种AC LED发光装置。交流LED发光装置将电流流向AC LED发光单元的至少两个AC LED阵列中的至少一个AC LED阵列，以在具有正弦波特性的AC功率的一个周期内将其导通，施加到包括至少两个包括至少一个AC LED的至少两个AC LED阵列的AC LED发光单元的电压小于根据AC LED发光单元的AC LED阵列的数量确定的导通电压。如果施加到AC LED发光单元的电压的大小大于AC LED发光单元的接通电压，则AC LED发光单元的所有AC LED阵列都被接通。

36. 发明申请

US20110210350A1 LIGHT EMITTING ELEMENT WITH A PLURALITY OF CELLS BONDED, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE USING THE SAME 有权
标题翻译：具有多个细胞结合的发光元件，其制造方法和使用其的发光装置
公开(公告)号：US20110210350A1
公开(公告)日：2011-09-01
申请号：US13105322
申请日：2011-05-11
申请人： Chung-Hoon LEE , Keon-Young LEE , Lacroix YVES
发明人： Chung-Hoon LEE , Keon-Young LEE , Lacroix YVES
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H05B33/0803 , H05B33/0809 , H05B33/0821 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.
摘要翻译：本发明涉及具有排列单元的发光元件，其制造方法和使用其的发光器件。本发明提供一种发光元件及其制造方法，所述发光元件包括发光单元块，所述发光单元块具有串联或并联连接在单个基板上的多个发光单元，其中，所述多个发光单元中的每一个包括 N型半导体层和P型半导体层，并且一个发光单元的N型半导体层电连接到另一相邻发光单元的P型半导体层。此外，本发明提供一种发光装置，其包括具有串联连接的多个发光单元的发光元件。因此，能够简化能够与家用AC电源一起使用的照明用发光元件的制造工序，能够减少在制造照明用发光元件时发生的不合格率，并大量生产光用于照明的发光装置。此外，通过在发光元件外部设置预定的整流电路，可以提高交流动作的直流驱动效率。

37. 发明申请

US20110140135A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 审中-公开
公开(公告)号：US20110140135A1
公开(公告)日：2011-06-16
申请号：US13033702
申请日：2011-02-24
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L33/08 , H01L33/48 , H01L33/60
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

38. 发明申请

US20110062465A1 LIGHT EMITTING ELEMENT WITH A PLURALITY OF CELLS BONDED, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE USING THE SAME 有权
公开(公告)号：US20110062465A1
公开(公告)日：2011-03-17
申请号：US12944412
申请日：2010-11-11
申请人： Chung-Hoon LEE , Keon-Young LEE , Lacroix YVES
发明人： Chung-Hoon LEE , Keon-Young LEE , Lacroix YVES
IPC分类号： H01L27/15
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H05B33/0803 , H05B33/0809 , H05B33/0821 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

39. 发明授权

US07871839B2 Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same 有权
公开(公告)号：US07871839B2
公开(公告)日：2011-01-18
申请号：US12685145
申请日：2010-01-11
申请人： Chung-Hoon Lee , Keon-Young Lee , Lacroix Yves
发明人： Chung-Hoon Lee , Keon-Young Lee , Lacroix Yves
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/08 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H05B33/0803 , H05B33/0809 , H05B33/0821 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

40. 发明授权

US07855395B2 Light emitting diode package having multiple molding resins on a light emitting diode die 有权
标题翻译：在发光二极管裸片上具有多个成型树脂的发光二极管封装
公开(公告)号：US07855395B2
公开(公告)日：2010-12-21
申请号：US11575128
申请日：2005-06-23
申请人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
发明人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
IPC分类号： H01L33/00 , H01L23/495 , H01L23/34
CPC分类号： H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
摘要翻译：公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。一对引线端子的至少一部分嵌入在封装主体中。包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。第一模塑树脂覆盖LED芯片。具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

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