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31. 发明授权

US10409303B2 Temperature controller of semiconductor wafer and temperature control method of semiconductor wafer 有权
公开(公告)号：US10409303B2
公开(公告)日：2019-09-10
申请号：US15459221
申请日：2017-03-15
申请人： Kelk Ltd.
发明人： Kazuhiro Mimura
IPC分类号： G05B13/02 , G05D23/19 , H01L21/67
摘要： A manipulated variable calculator having a plurality of control loops and configured to calculate manipulated variables to be respectively given to a plurality of temperature adjusters includes: a reference model output generator configured to generate a reference model that is a response output until reaching a temperature setpoint when, in the plurality of control loops, a manipulated variable of a control loop having the slowest response speed is defined as 100%; a simulator configured to sequentially search for a switching time to determine a manipulated variable pattern; a reference model configured to generate a reference model output based on the searched switching time; and a control switching unit configured to switch to a feed-back control using an error between the reference model outlet and the temperature setpoint when the reference model outlet reaches a predetermined time or a predetermined temperature after the reference model outlet starts.

32. 发明授权

US10157761B2 Temperature controller of semiconductor wafer 有权
公开(公告)号：US10157761B2
公开(公告)日：2018-12-18
申请号：US15239062
申请日：2016-08-17
申请人： KELK Ltd.
发明人： Kazuhiro Mimura
IPC分类号： G06F19/00 , H01L21/67 , G05D23/19
摘要： A temperature controller for a semiconductor wafer is configured to perform a temperature control on a plurality of temperature adjusters including a reference temperature adjuster to perform a temperature adjustment of the semiconductor wafer, in which a manipulated variable calculator to give a manipulated variable to a master loop and a slave loop includes a master-slave switching unit configured to switch between the master loop and the slave loop and a master-slave cancellation unit configured to cancel a setting of the master loop and the slave loop when a temperature setpoint of the slave loop is set to have a temperature gradient against a temperature setpoint of the master loop.

33. 发明申请

US20180053668A1 Temperature Controller of Semiconductor Wafer 审中-公开
公开(公告)号：US20180053668A1
公开(公告)日：2018-02-22
申请号：US15239062
申请日：2016-08-17
申请人： KELK Ltd.
发明人： Kazuhiro Mimura
IPC分类号： H01L21/67 , G05B19/042 , G05D23/19 , G06F17/16
CPC分类号： H01L21/67248 , G05D23/1917 , H01L21/67109
摘要： A temperature controller for a semiconductor wafer is configured to perform a temperature control on a plurality of temperature adjusters including a reference temperature adjuster to perform a temperature adjustment of the semiconductor wafer, in which a manipulated variable calculator to give a manipulated variable to a master loop and a slave loop includes a master-slave switching unit configured to switch between the master loop and the slave loop and a master-slave cancellation unit configured to cancel a setting of the master loop and the slave loop when a temperature setpoint of the slave loop is set to have a temperature gradient against a temperature setpoint of the master loop.

34. 发明授权

US09793462B2 Thermoelectric module, thermoelectric power generating apparatus, and thermoelectric generator 有权
公开(公告)号：US09793462B2
公开(公告)日：2017-10-17
申请号：US14379626
申请日：2013-02-07
申请人： KELK, Ltd.
发明人： Hiromasa Kaibe , Kazuya Makino , Kouji Nagano , Hirokuni Hachiuma
IPC分类号： H01L35/32 , H01L35/10 , H01L35/30
CPC分类号： H01L35/32 , H01L35/10 , H01L35/30 , H01L35/325
摘要： A thermoelectric module includes a low temperature-side wiring line, a high temperature-side wiring line, a low temperature-side member, a plurality of low temperature-side thermoelectric conversion elements made of a BiTe-based material, a high temperature-side member, a plurality of high temperature-side thermoelectric conversion elements made of a material different from the BiTe-based material, an insulating member, a radiant heat blocking plate, a low temperature-side electrode, and a high temperature-side electrode. The radiant heat blocking plate is arranged on the side of the high temperature-side member with respect to the low temperature-side wiring line and the high temperature-side wiring line. A thermoelectric module that can restrain burning of wiring lines, as well as a thermoelectric power generating apparatus and a thermoelectric generator including the same can thereby be obtained.

35. 发明申请

US20170141281A1 Thermoelectric Generator 审中-公开
公开(公告)号：US20170141281A1
公开(公告)日：2017-05-18
申请号：US15322521
申请日：2015-06-29
申请人： KELK Ltd.
发明人： Kazuya Makino , Haruo Imamura , Hirokuni Hachiuma
IPC分类号： H01L35/10 , H01L35/32
摘要： A thermoelectric generator includes: a heat-receiving plate configured to receive heat; a cooling plate configured to be kept at a lower temperature than a temperature of the heat-receiving plate; and a thermoelectric generation module interposed between the heat-receiving plate and the cooling plate, in which the thermoelectric generation module includes: an opposed surface that is opposed to the cooling plate; a plurality of thermoelectric elements; a terminal configured to electrically conduct to the thermoelectric elements; and a lead member bonded to the terminal, in which the lead member penetrates the opposed surface and extends to the cooling plate.

36. 发明申请

US20160020375A1 THERMOELECTRIC POWER GENERATION DEVICE AND THERMOELECTRIC POWER GENERATION METHOD USING THE SAME 审中-公开
标题翻译：使用其的热电发电装置和热电发电方法
公开(公告)号：US20160020375A1
公开(公告)日：2016-01-21
申请号：US14772848
申请日：2014-03-27
申请人： JFE STEEL CORPORATION , KELK LTD.
发明人： Takashi KUROKI , Kazuhisa KABEYA , Akio FUJIBAYASHI , Hiromasa KAIBE , Takeshi KAJIHARA , Kazuya MAKINO , Hirokuni HACHIUMA
IPC分类号： H01L35/32 , H01L35/30
CPC分类号： H01L35/32 , B21B1/46 , B21B45/00 , H01L35/30 , Y02P70/123
摘要： A thermoelectric power generation device includes: a thermoelectric power generation unit; and a transporter capable of moving the thermoelectric power generation unit. A thermoelectric power generation device including a thermoelectric power generation unit that converts heat energy which varies in release state into electric energy to recover the energy can thus be provided in a steel material manufacturing line in which a heat source flows.
摘要翻译：热电发电装置包括：热电发电单元; 以及能够移动所述热电发电单元的运输机。因此，能够在热源流过的钢材生产线中设置包括将释放状态变化的热能转换成电能以回收能量的热电发电单元。

37. 发明申请

US20150212528A1 Temperature Controller for Semiconductor Wafer and Temperature Control Method for Semiconductor Wafer 有权
标题翻译：半导体晶片温度控制器及半导体晶圆温度控制方法
公开(公告)号：US20150212528A1
公开(公告)日：2015-07-30
申请号：US14593081
申请日：2015-01-09
申请人： KELK LTD.
发明人： Kazuhiro Mimura
IPC分类号： G05D23/19 , G05B15/02 , H01L21/67
CPC分类号： G05B15/02 , G05D23/1934 , H01L21/67248
摘要： A temperature controller that performs a temperature control on a plurality of temperature adjusters including a reference temperature adjuster to adjust a temperature of a semiconductor wafer includes a setpoint setting section that: sets a temperature detected by a master temperature detector as a control setpoint for a reference one of the temperature adjusters of a master loop, until a temporary setpoint below an actual control setpoint preset as a desired temperature of the semiconductor wafer is reached; and sets the actual control setpoint as the control setpoint for the master loop after the temporary setpoint is reached.
摘要翻译：对包括参考温度调节器的多个温度调节器进行温度控制的温度控制器，用于调节半导体晶片的温度包括：设定点设定部分，其将由主温度检测器检测到的温度设置为用于参考的控制设定点一个主回路的温度调节器之一，直到达到预定为半导体晶片的期望温度的实际控制设定点为止的临时设定值为止; 并在达到临时设定值之后将实际控制设定值设置为主回路的控制设定值。

38. 发明申请

US20140345666A1 THERMOELECTRIC ELEMENT AND THERMOELECTRIC MODULE PROVIDED WITH SAME 有权
标题翻译：具有相同的热电元件和热电模块
公开(公告)号：US20140345666A1
公开(公告)日：2014-11-27
申请号：US14371880
申请日：2012-12-10
申请人： KELK Ltd
发明人： Mitsuoki Konnai , Akio Konishi
IPC分类号： H01L35/10 , H01L35/32
CPC分类号： H01L35/10 , H01L35/08 , H01L35/32 , H01L35/34
摘要： A thermoelectric element includes a p-type/n-type semiconductor element having an upper end surface and a lower end surface, a lower electrode that is joined to the lower end surface of the p-type/n-type semiconductor element to connect the p-type/n-type semiconductor element and another n-type/p-type semiconductor element adjacently thereto and has an area less than that of the lower end surface in a joint region therebetween. A joint portion is made of a solder and has a surface joint part joining the lower end surface of the p-type/n-type semiconductor element and a surface of the lower electrode while the lower end surface of the p-type/n-type semiconductor element and the surface of the lower electrode are opposed to each other A fillet part is formed to fill a space produced between intersecting surfaces, i.e., the lower end surface and a lateral side of the lower electrode, and composes a step part formed by the lower end surface and the lower electrode.
摘要翻译：热电元件包括具有上端面和下端面的p型/ n型半导体元件，与p型/ n型半导体元件的下端面接合的下电极， p型/ n型半导体元件和与其相邻的另一n型/ p型半导体元件，并且在其间的接合区域中的面积小于下端面的面积。接合部由焊料构成，具有将p型/ n型半导体元件的下端面与下电极的表面接合的表面接合部，而p型/ n型半导体元件的下端面，形成半导体元件并且下电极的表面彼此相对形成填充部分，以填充在相交表面之间产生的空间，即下电极的下端表面和横向侧，并形成步骤部分通过下端面和下部电极。

39. 发明申请

US20140334808A1 FLUID HEATING DEVICE 审中-公开
标题翻译：流体加热装置
公开(公告)号：US20140334808A1
公开(公告)日：2014-11-13
申请号：US14445454
申请日：2014-07-29
申请人： KELK LTD.
发明人： Hiroaki MIYAZAKI
IPC分类号： F24H1/14
CPC分类号： F24H1/142 , F28D7/12 , F28F9/22 , F28F21/006 , F28F2009/224
摘要： A fluid heating device for heating chemicals mainly containing sulfuric acid, which is capable of suppressing reduction of heating efficiency even if a fluid mainly containing sulfuric acid is heated, includes a translucent inner tube composed of quartz or the like, a lamp heater disposed in the inner tube, a translucent outer tube disposed outside the inner tube, which is composed of quartz or the like, translucent side plates disposed on both sides of the outer tube, which include quartz or the like, and an amorphous carbon pipe disposed between the outer tube and the inner tube, which functions as a light-absorbing material, wherein the amorphous carbon pipe is disposed so as to be brought into contact with chemicals passing through a space between the outer tube and the inner tube.
摘要翻译：即使主要含有硫酸的流体被加热，也能够抑制发热效率降低的主要含有硫酸的化学品的流体加热装置包括由石英等构成的半透明内管，灯加热器内管，设置在内管外侧的半透明外管，由石英等构成，设置在外管两侧的透明侧板，包括石英等，以及设置在外侧的非晶碳管管和内管，其用作光吸收材料，其中非晶碳管设置成与通过外管和内管之间的空间的化学品接触。

40. 发明申请

US20130152605A1 FLUID TEMPERATURE ADJUSTING DEVICE 审中-公开
标题翻译：流体温度调节装置
公开(公告)号：US20130152605A1
公开(公告)日：2013-06-20
申请号：US13719573
申请日：2012-12-19
申请人： Kelk Ltd.
发明人： Mitsuru Mimata , Koji Maeda
IPC分类号： F25B21/04
CPC分类号： F25B21/04 , F25B2321/021 , H01L21/67109 , H01L21/67248
摘要： A fluid temperature adjusting device includes: a heater configured to heat a fluid passing through a fluid passageway; a peltier module including a plurality of peltier elements, the peltier module being configured to heat or cool the fluid passing through the fluid passageway; and a controller configured to divide a total thermal energy for keeping the fluid at a target temperature into a thermal energy to be supplied from the heater and a thermal energy to be supplied from the peltier module to give the total thermal energy from both the heater and the peltier module to the fluid.
摘要翻译：流体温度调节装置包括：加热器，被配置为加热通过流体通道的流体; 包括多个珀耳帖元件的珀耳帖模块，所述珀耳帖模块被配置为加热或冷却通过所述流体通道的流体; 以及控制器，其被配置为将总热能用于将来自所述加热器的热能保持在目标温度下的热能和从所述珀尔帖模块供给的热能，以从所述加热器和 peltier模块到流体。

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