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    • 34. 发明申请
    • SIDE INLET-TYPED SOLENOID VALVE
    • 侧入式电磁阀
    • US20080272321A1
    • 2008-11-06
    • US11775637
    • 2007-07-10
    • Jong Won PARK
    • Jong Won PARK
    • F16K31/02
    • F16K31/0655B60T8/367B60T8/368
    • A solenoid valve for a slip control system in a vehicle is disclosed. A flow passage is provided in which working fluid such as oil that generates a break hydraulic pressure flows from the side of a solenoid valve through a filter, flows to the front of a plunger through a side hole formed in a valve body of the solenoid valve, and then flows along the side of valve body, that is, is discharged out of an outlet through a side space between valve body and a valve seat. Therefore, linear pressure control is easy because working fluid flows into toward the front of valve plunger through a side inlet of solenoid valve and the entire size is reduced because a special channel for guiding working fluid to the front of the valve plunger is not needed in a pump housing case.
    • 公开了一种用于车辆中的滑动控制系统的电磁阀。 提供了一种流路,其中产生断开液压的诸如油的工作流体从电磁阀的侧面流过过滤器,通过形成在电磁阀的阀体中的侧孔流动到柱塞的前部 然后沿阀体侧流动,即通过阀体与阀座之间的侧空间从出口排出。 因此,由于工作流体通过电磁阀的侧面入口朝向阀柱塞的前部流动,所以线性压力控制是容易的,并且整体尺寸减小,因为不需要用于将工作流体引导到阀柱塞的前部的专用通道 泵壳体。
    • 39. 发明授权
    • Mask frame apparatus for mounting solder balls
    • 用于安装焊球的掩模框架装置
    • US08348132B2
    • 2013-01-08
    • US13067851
    • 2011-06-29
    • Jong Won Park
    • Jong Won Park
    • B23K1/00
    • B23K3/0623B23K1/0016B23K3/08B23K2101/42
    • Disclosed herein is a mask frame apparatus capable of forming a bump having a micro-pitch without performing the manufacturing and the operation controlling of a separate head apparatus and preventing the reduction of a mounting speed of solder balls due to the repetition of an operation of separately recovering the solder balls after they are mounted on a mask. A mask frame apparatus for mounting solder balls includes: an outer circumferential mask frame configured to supply solder balls and having a hollow type duct shape; and an inner mask duct having a duct shape and positioned over the inside of a circumference of the outer circumferential mask frame so as to be in communication with the outer circumferential mask frame, and including a plurality of mask openings formed in a duct shape bottom surface so that the solder balls introduced through the hollow type outer circumferential mask frame are mounted on a substrate by the flow of air.
    • 这里公开了一种掩模框架装置,其能够在不进行单独的头装置的制造和操作控制的情况下形成具有微间距的凸块,并且防止由于重复单独操作而导致的焊球的安装速度的降低 将焊球安装在掩模上后回收焊球。 用于安装焊球的掩模框架装置包括:外周掩模框架,其构造成供应焊球并具有中空型管道形状; 以及具有导管形状并且位于外周罩框架的圆周的内侧以与外周面罩框架连通的内罩罩,并且包括形成在管状底面的多个掩模开口 使得通过中空型外周面罩框架引入的焊球通过空气流安装在基板上。