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    • 33. 发明申请
    • SYMMETRICAL INDUCTOR
    • 对称电感器
    • US20050151612A1
    • 2005-07-14
    • US10707771
    • 2004-01-11
    • Jing-Horng Gau
    • Jing-Horng Gau
    • H01F17/00H01F27/34H01F27/28
    • H01F17/0006H01F27/34H01F2017/0046
    • A symmetrical inductor includes a first metal layer, the first metal layer having a first conductive segment disposed on a first side of a line, and a second conductive segment disposed on a second side of the line, the second conductive segment and the first conductive segment being symmetrical to the line; a second metal layer, the second metal layer having a third conductive segment disposed on the first side of the line, and a fourth conductive segment disposed on the second side of the line, the fourth conductive segment and the third conductive segment being symmetrical to the line; a first contact plug for connecting the first conductive segment with a first end of the third conductive segment; a second contact plug for connecting the first conductive segment with a second end of the third conductive segment; a third contact plug for connecting the second conductive segment with a first end of the fourth conductive segment, the third contact plug and the first contact plug being symmetrical to the line; and a fourth contact plug for connecting the second conductive segment with a second end of the fourth conductive segment, the fourth contact plug and the second contact plug being symmetrical to the line.
    • 对称电感器包括第一金属层,第一金属层具有设置在线的第一侧上的第一导电段和设置在该线的第二侧上的第二导电段,第二导电段和第一导电段 与线对称; 第二金属层,所述第二金属层具有设置在所述线的第一侧上的第三导电段,以及设置在所述线的第二侧上的第四导电段,所述第四导电段和所述第三导电段与 线; 第一接触插头,用于将第一导电段与第三导电段的第一端连接; 用于将第一导电段与第三导电段的第二端连接的第二接触插塞; 用于将所述第二导电段与所述第四导电段的第一端连接的第三接触插塞,所述第三接触插塞和所述第一接触插塞与所述线对称; 以及用于将所述第二导电段与所述第四导电段的第二端连接的第四接触插塞,所述第四接触插塞和所述第二接触插塞与所述线对称。
    • 38. 发明授权
    • Structure of a DRAM and a manufacturing process thereof
    • DRAM的结构及其制造方法
    • US06423597B1
    • 2002-07-23
    • US09767498
    • 2001-01-23
    • Jing-Horng Gau
    • Jing-Horng Gau
    • H01L218242
    • H01L27/10855H01L27/10885H01L28/84H01L28/90
    • A structure of a DRAM and a manufacturing process therefor, suitable for a substrate on which a plurality of word lines and a plurality of source/drain regions on sides of each of these word lines are formed. A plurality of bit line contacts and a plurality of node contacts are formed in electric contact with the source/drain regions. A first patterned insulating layer is formed on the substrate, in which a plurality of openings are formed in the insulating layer to expose the bit line contacts. The substrate is covered with a first conductive layer and a second insulating layer in sequence. The second insulating layer, the first conductive layer and the first insulating layer are patterned in sequence to form a plurality of bit line stacked structures and a plurality of bit lines electrically connecting to the bit contacts, exposing the node contacts. As a result, the bit line stacked structure forms a plurality of trenches and the bit line stacked structure is orthogonal to the word lines. A plurality of spacers are formed on sidewalls of the bit line stacked structure. A plurality of second conductive layers are formed conformal to the surfaces of the trenches. The second conductive layers are patterned to form a plurality of bottom electrodes electrically connected to the node contacts.
    • 一种DRAM的结构及其制造方法,适用于在其上形成有这些字线的每一侧的多个字线和多个源极/漏极区域的基板。 多个位线触点和多个节点触点形成为与源/漏区电接触。 第一图案化绝缘层形成在基板上,其中在绝缘层中形成多个开口以露出位线触点。 衬底被依次覆盖有第一导电层和第二绝缘层。 第二绝缘层,第一导电层和第一绝缘层依次图案化以形成多个位线堆叠结构和电连接到位触点的多个位线,露出节点触点。 结果,位线堆叠结构形成多个沟槽,并且位线堆叠结构与字线正交。 多个间隔件形成在位线堆叠结构的侧壁上。 多个第二导电层形成为与沟槽的表面一致。 图案化第二导电层以形成电连接到节点触点的多个底部电极。
    • 39. 发明授权
    • Method of making self-aligned bit-lines
    • 制作自对准位线的方法
    • US06329255B1
    • 2001-12-11
    • US09620230
    • 2000-07-20
    • Jing-Horng Gau
    • Jing-Horng Gau
    • H01L21336
    • H01L27/10885H01L21/76885H01L21/76897H01L27/10852H01L27/10888
    • The present invention provides a method of making self-aligned bit-lines on a substrate, the surface of which comprises a dielectric layer having a plurality of node contact holes and bit-line contact holes. A first conducting layer is formed on the surface of the substrate, filling each node contact hole and bit-line contact hole. Next, a protecting layer is formed over the first conducting layer. The protecting layer and the first conducting layer are etched to form each node contact and bit-line contact. A spacer is formed around each node contact. A second dielectric layer is formed on the wafer, and then etched down to the first dielectric layer and to the surface of each bit-line contact, forming a trench in the second dielectric layer. A second conducting layer is formed on the surface of the substrate, filling each bit-line trench, and a back etching process is performed to remove the second conducting layer from the surface of the second dielectric layer and from each trench down to a certain depth, resulting in a bit-line. Finally, a third dielectric layer is formed on the surface of the substrate, filling each trench.
    • 本发明提供一种在衬底上制作自对准位线的方法,其表面包括具有多个节点接触孔和位线接触孔的电介质层。 在基板的表面上形成第一导电层,填充每个节点接触孔和位线接触孔。 接下来,在第一导电层上形成保护层。 蚀刻保护层和第一导电层以形成每个节点接触和位线接触。 围绕每个节点接触形成间隔物。 第二电介质层形成在晶片上,然后蚀刻到第一电介质层和每个位线接触表面,在第二介电层中形成沟槽。 在基板的表面上形成第二导电层,填充每个位线沟槽,并执行背蚀刻工艺以从第二介电层的表面和每个沟槽向下移动到一定深度的第二导电层 ,导致位线。 最后,在衬底的表面上形成第三电介质层,填充每个沟槽。
    • 40. 发明授权
    • Fabrication method of a self-aligned contact window
    • 自对准接触窗的制作方法
    • US06245625B1
    • 2001-06-12
    • US09336553
    • 1999-06-19
    • Jing-Horng Gau
    • Jing-Horng Gau
    • H01L21336
    • H01L21/76897
    • A method of fabricating a self-aligned contact window structure is described in which a substrate is provided with a plurality of gates formed on the substrate and a plurality of lightly doped regions is formed in the substrate on both sides of the gate. A first dielectric layer of a certain thickness is then formed on the substrate with the surface of the first dielectric layer being lower than the surfaces of the gates such that the sidewalls of the gates are partially exposed. A plurality of spacers is further formed on the exposed sidewalls of the gates. Using the gates and the spacers as masks, the first dielectric layer is anisotropically etched until the lightly doped regions are partially exposed. Using the gate and the spacer as masks, a plurality of heavily doped regions is formed in the lightly doped region and in the substrate. A second dielectric layer is formed covering the gates. The second dielectric is then defined to form a self-aligned contact window.
    • 描述了一种制造自对准接触窗结构的方法,其中衬底设置有形成在衬底上的多个栅极,并且在栅极两侧的衬底中形成多个轻掺杂区域。 然后在衬底上形成一定厚度的第一电介质层,其中第一介电层的表面低于栅极的表面,使得栅极的侧壁部分露出。 在栅极的暴露的侧壁上进一步形成多个间隔物。 使用栅极和间隔物作为掩模,第一介电层被各向异性蚀刻,直到轻掺杂区域部分暴露。 使用栅极和间隔物作为掩模,在轻掺杂区域和衬底中形成多个重掺杂区域。 形成覆盖栅极的第二电介质层。 然后限定第二电介质以形成自对准的接触窗口。